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NXP Semiconductors SPC5646BF0MMJ1

Part No.:
SPC5646BF0MMJ1
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
256-LBGA
Datasheet:
AetrixSPC5646BF0MMJ1.pdf
Description:
IC MCU 32BIT 3MB FLASH 256MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,872

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Product details

Overview

SPC5646BF0MMJ1 from NXP Semiconductors is a dual-core automotive microcontroller featuring an e200z4d CPU (up to 120 MHz) and e200z0h CPU (up to 80 MHz), 3 MB on-chip flash, 256 KB SRAM, and integrated FlexCAN, DSPI, LINFlexD, FEC Ethernet, and CSE cryptographic engine. It targets safety-critical powertrain and chassis control units requiring ASIL-B compliance and real-time deterministic execution.

For engineers reviewing the SPC5646BF0MMJ1 datasheet, SPC5646BF0MMJ1 pinout, SPC5646BF0MMJ1 application, or SPC5646BF0MMJ1 equivalent, key selection criteria include dual-core interrupt routing capability, 6-channel FlexCAN with CAN Sampler, 100 Mbps Fast Ethernet Controller, 256-ball MAPBGA package (17 mm × 17 mm), and hardware memory protection unit supporting 16 regions.

Technical Context

The SPC5646BF0MMJ1 implements a crossbar switch architecture enabling concurrent access to flash, SRAM, and peripherals by multiple bus masters-including both e200z4d and e200z0h cores. Its Dual-core Interrupt Controller (INTC) supports flexible routing of 64+ interrupt sources to either or both CPUs, with priority-based preemptive scheduling.

It integrates a dedicated Cross Trigger Unit (CTU) for precise synchronization between eMIOS timers and ADC conversions, and includes a Safety Enhanced Software Watchdog Timer (SWT) with keyed functionality-critical for ISO 26262-compliant system monitoring in automotive applications.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Corese200z4d (120 MHz) + e200z0h (80 MHz); enables asymmetric task partitioning across safety and non-safety domains
Flash Memory3 MB code flash + 64 KB data flash; supports EEPROM emulation and flash page buffering for reduced erase/write latency
SRAM256 KB on-chip SRAM; includes parity/ECC support for ASIL-B fault detection
Communication Interfaces6 × FlexCAN (64 MB each), 8 × DSPI, 10 × LINFlexD, 1 × I²C, 1 × Fast Ethernet (10/100 Mbps)
Analog Peripherals1 × 10-bit ADC (27–33 ch), 1 × 12-bit ADC (5–10 ch), CTU for synchronized sampling
Security & SafetyCryptographic Services Engine (CSE), 16-region MPU, SWT with key-based reset, Nexus3+ debug interface
Power ManagementSTOP/HALT/STANDBY low-power modes; autonomous RTC wake-up (1 ms resolution, 2 s max timeout)

Pinout & Package

SPC5646BF0MMJ1 is packaged in a 256-ball MAPBGA (17 mm × 17 mm, 1.0 mm pitch) with VDD_HV_A, VDD_HV_B, VDD_HV_ADC0, VDD_HV_ADC1, VDD_LV, and VSS_HV/VSS_LV supply domains. Pin functions are defined per ball map in NXP's MPC5646C datasheet Rev. 7, Section 3.4.

Pin/TerminalCircuit RoleDesign Meaning
RESETReset input with Schmitt-trigger and noise filterActive-low asynchronous reset with weak internal pull-up; initiates full device initialization sequence
XTAL / EXTALCrystal oscillator inputs (4–40 MHz)Supports high-accuracy system clock generation; bypass mode enabled when EXTAL grounded
VDD_HV_A / VDD_HV_BHigh-voltage I/O supply domainsVDD_HV_A powers most GPIOs; VDD_HV_B supplies specific ports (PA[7–11], PF[14–15], PG[0–1], PH[0–3], PG[12–13], PA[3])
VDD_HV_ADC0 / VDD_HV_ADC1Analog domain suppliesIndependent 5 V supplies for 10-bit and 12-bit ADCs to minimize digital switching noise coupling
PD[0]–PD[15]General-purpose I/O port D16-bit bidirectional port with configurable slew rate, pull-up/down, and interrupt capability; supports LINFlexD and DSPI alternate functions

Key Features

FeatureDesign Value
Dual-core cross-triggeringINTC routes interrupts independently to e200z4d, e200z0h, or both-enabling lockstep or split-mode operation per functional safety requirements
FEC Ethernet MACFull-duplex 10/100 Mbps Fast Ethernet controller with MII interface; supports time-triggered communication for AUTOSAR-compliant gateways
FlexCAN with Sampler6 CAN modules with 64 message buffers each; CAN Sampler captures message IDs during STOP mode-reducing wake-up latency in low-power states
CTU synchronizationCross Trigger Unit links eMIOS timer events to ADC start-of-conversion-ensuring deterministic timing for motor current sensing and battery monitoring
Hardware security engineCryptographic Services Engine (CSE) accelerates AES-128/256, SHA-256, and RSA operations-supporting secure boot and OTA firmware updates

Applications

Engine Control Unit (ECU)Brake Control Module (BCM)

Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary host controller executing ASW and BSW layers; dual-core INTC manages sensor acquisition (ADC/CTU), actuator PWM (eMIOS), and CAN diagnostics concurrently.

Use Value: 120 MHz e200z4d core delivers <5 µs interrupt latency for misfire detection; 3 MB flash accommodates multi-map calibration storage and diagnostic software.

Use Scenario: Closed-loop ABS/EBD pressure modulation and vehicle stability control coordination.

IC Role / Device Role / Timing Role: Safety-certified controller managing hydraulic valve drivers via PWM outputs while communicating over 2× FlexCAN buses and LINFlexD for sensor clusters.

Use Value: 16-region MPU isolates safety-critical brake logic from non-safety tasks; SWT key validation prevents unauthorized reset escalation during dynamic braking.

Electric Power Steering (EPS)Vehicle Gateway Module

Use Scenario: Torque assist calculation, motor position feedback, and fail-safe torque reduction in steer-by-wire systems.

IC Role / Device Role / Timing Role: Dual-core processor running motor FOC algorithm on e200z4d and safety monitor on e200z0h; CTU synchronizes eMIOS-triggered ADC sampling for current sensing.

Use Value: 256 KB SRAM enables real-time observer model execution; 12-bit ADC with CTU achieves <1 µs jitter for precise phase current measurement.

Use Scenario: Protocol translation between CAN FD, LIN, Ethernet, and FlexRay networks in zonal architectures.

IC Role / Device Role / Timing Role: High-throughput gateway controller using FEC for OTA update distribution and 6× FlexCAN for domain ECU aggregation.

Use Value: 100 Mbps Ethernet supports A/B image flashing; CSE enables secure firmware signing verification before execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5646CK0MMJ1Same die, identical core configuration and peripheral set; differs only in temperature grade (–40°C to 125°C vs. –40°C to 105°C for SPC5646BF0MMJ1)Qualified for extended ambient operation in under-hood powertrain modulesSelect when operating ambient exceeds 105°C or when automotive qualification requires AEC-Q100 Grade 0
SPC564A70L5Single e200z4d core (120 MHz), 2 MB flash, no FlexRay or FEC; uses 176-pin LQFP packageLacks Ethernet and dual-core safety partitioning; suitable for cost-sensitive body control modulesChoose for non-gateway applications where Ethernet and inter-core isolation are not required

Compared with MPC5646CK0MMJ1, SPC5646BF0MMJ1 offers lower thermal qualification but identical feature set and pin compatibility; versus SPC564A70L5, it adds FlexRay, FEC, and dual-core safety architecture at higher pin count and cost-making it appropriate for ASIL-B gateway and chassis controllers.

Availability

SPC5646BF0MMJ1 is available at Aetrix Electronics and suitable for automotive powertrain control, chassis electronics, and vehicle gateway applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified sourcing.

Supply support for SPC5646BF0MMJ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in Power Architecture and Arm-based microcontrollers.

The SPC5646BF0MMJ1 belongs to NXP's SPC56 family of automotive MCUs, designed specifically for ASIL-B compliant powertrain, chassis, and advanced driver assistance systems requiring dual-core determinism, hardware security, and multi-protocol connectivity.

FAQ

What is the maximum operating frequency of the SPC5646BF0MMJ1's primary CPU core?

The SPC5646BF0MMJ1 features an e200z4d core rated for up to 120 MHz operation under full characterization at 125 °C ambient. This frequency is achievable with proper thermal design and voltage regulation. The secondary e200z0h core operates up to 80 MHz, or at half-system frequency when the e200z4d runs above 80 MHz. SPC5646BF0MMJ1 datasheet Rev. 7 confirms this in Table 1 and Section 1.2.

Does the SPC5646BF0MMJ1 support hardware-based cryptographic acceleration?

Yes, the SPC5646BF0MMJ1 integrates a Cryptographic Services Engine (CSE) that accelerates AES-128/256 encryption/decryption, SHA-256 hashing, and RSA public-key operations. This enables secure boot, firmware authentication, and OTA update integrity verification without burdening the main CPU cores. SPC5646BF0MMJ1 documentation references CSE in Block Diagram Figure 1 and Table 2.

How many CAN interfaces does the SPC5646BF0MMJ1 include, and what is their buffer capacity?

The SPC5646BF0MMJ1 includes six FlexCAN modules, each with 64 message buffers. Additionally, it features a CAN Sampler that captures message IDs during low-power STOP mode, enabling fast wake-up and selective message filtering. This configuration is confirmed in the MPC5646C datasheet Rev. 7, Section 1.2 and Table 1.

What package type and pin count does the SPC5646BF0MMJ1 use?

The SPC5646BF0MMJ1 is supplied in a 256-ball MAPBGA package measuring 17 mm × 17 mm with 1.0 mm ball pitch. This package supports high I/O density and thermal performance required for automotive applications. Mechanical drawings and ball maps are provided in Section 5.1.3 of the MPC5646C datasheet Rev. 7.

Is the SPC5646BF0MMJ1 qualified for automotive applications under AEC-Q100?

Yes, the SPC5646BF0MMJ1 is AEC-Q100 qualified for Grade 2 (–40°C to +105°C). It meets automotive reliability and stress testing requirements including HTOL, TCT, and ESD. This qualification is documented in NXP's official ordering information and product change notifications for the SPC5646BF0MMJ1 part number.

SPC5646BF0MMJ1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
256-LBGA
Series:
MPC56xx Qorivva
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x10b, 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5646BF0MMJ1 FAQ

1.How can I place an order for SPC5646BF0MMJ1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5646BF0MMJ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5646BF0MMJ1 reliable?

The price and inventory of SPC5646BF0MMJ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5646BF0MMJ1 is usually 5 days.

3.What payment methods are accepted for SPC5646BF0MMJ1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5646BF0MMJ1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5646BF0MMJ1?

SPC5646BF0MMJ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5646BF0MMJ1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5646BF0MMJ1?

For technical support, including SPC5646BF0MMJ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5646BF0MMJ1 requirements.

6.How does Aetrix verify that SPC5646BF0MMJ1 is sourced from the original manufacturer or authorized distributors?

All SPC5646BF0MMJ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5646BF0MMJ1 meets industry standards.

7.What is the process for return or replacement of SPC5646BF0MMJ1?

All SPC5646BF0MMJ1 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5646BF0MMJ1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5646BF0MMJ1 part is unused and in its original packaging.

Return procedure for SPC5646BF0MMJ1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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