STMicroelectronics SPC564A70B4CFAR

Overview

SPC564A70B4CFAR from STMicroelectronics is a 32-bit Power Architecture® e200z4-based automotive MCU targeting powertrain control units, featuring 150 MHz core frequency, 2 MB on-chip flash with ECC and read-while-write, 128 KB SRAM with standby/ECC, and integrated FlexRay (10 Mbit/s), triple FlexCAN (64 buffers each), and dual eQADCs (40 channels, 688 ns min conversion). It supports LQFP176 packaging and operates across automotive temperature range (−40 °C to 125 °C).

For engineers reviewing the SPC564A70B4CFAR datasheet, SPC564A70B4CFAR pinout, SPC564A70B4CFAR application, or SPC564A70B4CFAR equivalent, key selection considerations include its dual eQADC subsystem for high-resolution engine sensor acquisition, eTPU2 with 32 standard channels for precise timing-critical actuator control, and Class 3+ Nexus debug support for real-time powertrain software validation.

Technical Context

The SPC564A70B4CFAR implements a superscalar e200z4 core with Variable Length Encoding (VLE), enabling up to two integer or floating-point instructions per cycle and four MAC operations per cycle-optimized for deterministic real-time powertrain algorithms. Its memory subsystem includes 2 MB flash with ECC and RWW capability, plus 128 KB SRAM segmented into 32 KB standby-capable banks with ECC protection.

Peripherals are interconnected via a 4×4 crossbar switch (XBAR) supporting concurrent high-bandwidth access to eDMA, eQADC, eTPU2, and FlexRay. The fail-safe architecture integrates a 16-entry MPU, CRC unit with three submodules, junction temperature sensor, and Boot Assist Module (BAM) for secure CAN/SCI bootloader execution.

Key Specifications

Pinout & Package

LQFP176 package with 0.5 mm pitch, 24 mm × 24 mm body, exposed thermal pad, and ECOPACK® environmental compliance. Pinout defined per STMicroelectronics Doc ID 18078 Rev 4, Section 2.1 (LQFP176 pinout, page 34), including dedicated power/ground segmentation, FMPLL clock inputs, JTAG/Nexus debug pins (TCK/TMS/TDO/TDI/TRST), and functional groups for eSCI, DSPI, FlexCAN, FlexRay, eMIOS, and eQADC analog inputs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive powertrain microcontroller applications.

Compared with MPC5643L, SPC564A70B4CFAR adds FlexRay and dual eQADC for advanced powertrain networking and sensing; versus SPC574S50E3, it retains eTPU2 for legacy timing-critical actuator control while sacrificing ARM toolchain alignment.

Availability

SPC564A70B4CFAR is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualification assurance.

Supply support for SPC564A70B4CFAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power discrete technologies with broad IP portfolio and automotive-grade manufacturing.

The SPC56x series is ST's dedicated automotive MCU platform built on Power Architecture®, designed specifically for ASIL-B/C powertrain and chassis applications requiring high computational determinism, functional safety features, and multi-protocol connectivity.

FAQ

What is the maximum operating junction temperature for SPC564A70B4CFAR?

The SPC564A70B4CFAR is rated for −40 °C to +125 °C junction temperature, validated per AEC-Q100 Grade 1 requirements. Its integrated junction temperature sensor provides real-time die temperature measurement with ±3 °C accuracy over the full range, enabling thermal derating of CPU frequency or PWM duty cycles in high-ambient environments like engine compartments.

Does SPC564A70B4CFAR support bootloading over CAN or SCI?

Yes, the device includes an on-chip CAN/SCI Bootstrap Loader with Boot Assist Module (BAM), allowing firmware updates via CAN 2.0B or asynchronous serial communication without external programming hardware. The BAM supports secure entry into bootloader mode using configurable pin states and checksum validation before executing downloaded code.

How many independent clock domains does the SPC564A70B4CFAR support?

The MCU supports three primary clock domains: main system clock (from FMPLL, up to 150 MHz), peripheral clock (derived from FMPLL with programmable dividers), and slow clock (from internal RC oscillator or external source for low-power modes). Each domain feeds independent clock gates for eQADC, FlexRay, and eTPU2, enabling selective peripheral clock gating to reduce dynamic power consumption.

Is the LQFP176 package of SPC564A70B4CFAR lead-free and RoHS-compliant?

Yes, the SPC564A70B4CFAR in LQFP176 packaging uses STMicroelectronics' ECOPACK® technology, fully compliant with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. The package employs matte tin (Sn) termination finish with no lead, antimony, or halogenated flame retardants, and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) for surface-mount assembly.