My Inquiry
My Account
STMicroelectronics SPC564A70B4CFAY
- Part No.:
- SPC564A70B4CFAY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 324-BGA
- Datasheet:
-
SPC564A70B4CFAY.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 324PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,957
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC564A70B4CFAY from STMicroelectronics is a 32-bit Power Architecture® e200z4-based automotive MCU designed for powertrain control systems. It features a 150 MHz superscalar core with VLE, 2 MB on-chip flash (ECC + RWW), 128 KB SRAM (ECC + standby), and integrated FlexCAN, FlexRay, eTPU2, and dual eQADCs. Used in gasoline/diesel engine control units (ECUs) requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC564A70B4CFAY datasheet, SPC564A70B4CFAY pinout, SPC564A70B4CFAY application, or SPC564A70B4CFAY equivalent, key selection criteria include its dual-channel FlexRay v2.1 support (10 Mbit/s), 32-channel eTPU2 with reaction module, 40-channel 12-bit eQADC (688 ns min conversion), and PBGA324 package compatibility with automotive thermal and EMI requirements.
Technical Context
The SPC564A70B4CFAY implements a dual-issue superscalar e200z4 core with variable-length encoding, enabling up to two integer or floating-point instructions per cycle and four MAC operations per cycle. Its memory subsystem includes 2 MB flash with read-while-write capability and ECC protection, plus 128 KB SRAM with 32 KB in low-power standby mode and full ECC coverage.
Peripheral integration centers on deterministic real-time I/O: three FlexCAN modules (64 message buffers each), one FlexRay controller (dual/single channel, 128 message objects, ECC), 24-channel eMIOS, and second-generation eTPU2 with 32 standard channels and dedicated 6-channel reaction module for precise timing-critical actuator control in engine management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z4 Power Architecture®, 150 MHz, superscalar dual-issue with VLE |
| Flash Memory | 2 MB on-chip, with ECC and read-while-write (RWW) for seamless firmware updates |
| SRAM | 128 KB total: 32 KB in standby mode with ECC, supporting low-power runtime retention |
| eQADC | Two enhanced queued ADCs; 40 × 12-bit inputs, 688 ns minimum conversion time |
| FlexRay | V2.1 compliant, up to 10 Mbit/s, dual or single channel, 128 message objects with ECC |
| eTPU2 | Second-generation time processing unit: 32 standard channels + 6-channel reaction module |
| Package | PBGA324 (23 mm × 23 mm), AEC-Q100 qualified for automotive under-hood environments |
Pinout & Package
PBGA324 package (23 mm × 23 mm, 1.0 mm ball pitch), RoHS-compliant ECOPACK®, rated for −40 °C to 125 °C junction temperature, with dedicated power/ground segmentation for EMC robustness and analog-digital isolation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply (5 V) | Primary core and I/O domain input; requires external ballast resistor for voltage regulation |
| VDD_IO | I/O supply (3.3 V) | Supplies all general-purpose I/O banks; supports mixed-voltage interfacing |
| VDD_CORE | Core supply (1.2 V) | Internal regulator output; derived from VDD_MAIN via on-chip PMC for stable CPU operation |
| VRN/VRP | FlexRay differential pair | High-speed differential bus interface; supports 10 Mbit/s with built-in termination and fault detection |
| AD0–AD39 | Analog inputs | 40 dedicated pins routed to dual eQADC modules; support single-ended and differential acquisition |
| ETPU_A0–ETPU_A31 | eTPU2 channel I/O | 32 dedicated pins for time-critical edge-triggered capture, PWM generation, and encoder decoding |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe memory protection | 16-entry MPU + 24-entry MMU + CRC unit (3 submodules) + ECSM for end-to-end data integrity |
| Deterministic real-time I/O | eTPU2 with reaction module enables sub-microsecond response for fuel injection timing and ignition control |
| Multi-protocol connectivity | 3 × FlexCAN (64 MB each), 1 × FlexRay (128 MB), 3 × DSPI, 3 × eSCI - all with configurable DMA and interrupt prioritization |
| Automotive-grade clocking | On-chip 4–40 MHz oscillator + FMPLL with spread-spectrum modulation to reduce EMI in noisy powertrain environments |
| Nexus debug support | Class 3+ for core, Class 1 for eTPU - enabling real-time trace, hardware breakpoints, and time-stamped event capture |
Applications
| Gasoline Engine Control Unit (ECU) | Diesel Common Rail Control |
|---|---|
Use Scenario: Real-time combustion management in inline-4 and V6 gasoline engines with direct injection and variable valve timing. IC Role / Device Role / Timing Role: Primary controller executing closed-loop air-fuel ratio, spark timing, and knock detection algorithms at ≤10 ms cycle intervals. Use Value: eTPU2 reaction module delivers deterministic <1 µs latency for coil-on-plug ignition firing; dual eQADC ensures synchronized sampling of wideband O2 and MAP sensors. | Use Scenario: High-precision fuel metering and rail pressure regulation in Euro 6-compliant diesel engines with piezo injectors. IC Role / Device Role / Timing Role: Safety-critical actuator driver coordinating up to 8 injector events per combustion cycle with nanosecond-level timing resolution. Use Value: FlexRay v2.1 interface synchronizes rail pressure sensors and injector drivers across distributed ECU nodes; 128-message-object buffer prevents data loss during transient load spikes. |
| Transmission Control Module (TCM) | Hybrid Powertrain Supervisor |
Use Scenario: Adaptive shift scheduling and torque converter clutch control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Coordinating hydraulic solenoid actuation, gear position sensing, and CAN-based communication with engine ECU. Use Value: 3 × FlexCAN modules enable concurrent communication on powertrain, chassis, and diagnostic buses; eMIOS provides 24 independent timer channels for PWM-controlled solenoids. | Use Scenario: Supervisory control of ICE + electric motor torque blending, battery state-of-charge arbitration, and thermal management in P2 hybrid architectures. IC Role / Device Role / Timing Role: Central gateway managing time-synchronized data exchange between engine ECU, motor inverter, and BMS over FlexRay and CAN FD. Use Value: Dual eQADCs acquire high-resolution voltage/current/temperature data from both ICE and traction battery domains; 2 MB flash stores redundant firmware images for ASIL-B fail-operational behavior. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive powertrain microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP MPC5643L | Same e200z4 core, 128 MB flash, no FlexRay, only 2 × FlexCAN (32 MB each), no eTPU2 | Limited to mid-tier powertrain applications without FlexRay networking or advanced timing peripherals | Select when FlexRay and eTPU2 are not required; lower cost but reduced real-time I/O capability |
| Renesas RH850/F1K | 400 MHz dual-core, 2 MB flash, 384 KB RAM, CAN FD + Ethernet AVB, no FlexRay, different toolchain | Targets next-gen ADAS-integrated powertrain systems requiring higher compute throughput and network bandwidth | Select for future-proofing with CAN FD/Ethernet; requires migration from Power Architecture to RH850 toolchain and safety certification revalidation |
Compared with MPC5643L, SPC564A70B4CFAY adds FlexRay and eTPU2 for deterministic actuator control; versus RH850/F1K, it offers mature Power Architecture ecosystem and proven ASIL-B qualification path-but lacks CAN FD and Ethernet.
Availability
SPC564A70B4CFAY is available at Aetrix Electronics and suitable for gasoline ECU, diesel common rail control, transmission control modules, and hybrid powertrain supervisors requiring stable component supply and long-term automotive lifecycle support.
Supply support for SPC564A70B4CFAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power discrete technologies with broad AEC-Q100-qualified portfolio.
The SPC564A70 series belongs to ST's SPC5 automotive MCU platform, engineered specifically for ASIL-B powertrain applications demanding high computational throughput, deterministic I/O, and multi-protocol real-time networking.
FAQ
What is the maximum operating junction temperature for SPC564A70B4CFAY?
The SPC564A70B4CFAY is qualified for operation up to 125 °C junction temperature, validated per AEC-Q100 Grade 1 requirements. Thermal derating begins above 105 °C ambient depending on PCB layout, airflow, and power dissipation-full electrical specifications are guaranteed from −40 °C to 125 °C TJ.
Does SPC564A70B4CFAY support bootloading over CAN or FlexRay?
Yes, it includes an on-chip CAN/SCI Bootstrap Loader with Boot Assist Module (BAM), enabling firmware updates via CAN or eSCI interfaces. FlexRay is not supported for bootloading; however, application-layer firmware distribution over FlexRay is possible using custom protocol stacks implemented in user code.
How many independent clock domains does the SPC564A70B4CFAY support?
The device supports three primary clock domains: core (driven by FMPLL), peripheral (derived from FMPLL or main oscillator), and low-power (standby SRAM and RTC). Each domain has independent gating and frequency scaling, managed by the System Integration Unit (SIU) and Power Management Controller (PMC).
Is the eTPU2 module in SPC564A70B4CFAY backward compatible with first-generation eTPU code?
No, eTPU2 is not binary-compatible with legacy eTPU code due to architectural enhancements including expanded instruction set, larger local RAM, and new reaction module functionality. Migration requires recompilation using SPC56xx-specific eTPU2 compiler tools and adaptation of timing-critical routines to leverage improved latency and channel count.
SPC564A70B4CFAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 324-BGA
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CANbus, EBI/EMI, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 190
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 1.32V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC564A70B4CFAY FAQ
1.How can I place an order for SPC564A70B4CFAY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC564A70B4CFAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC564A70B4CFAY reliable?
The price and inventory of SPC564A70B4CFAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC564A70B4CFAY is usually 5 days.
3.What payment methods are accepted for SPC564A70B4CFAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC564A70B4CFAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC564A70B4CFAY?
SPC564A70B4CFAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC564A70B4CFAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC564A70B4CFAY?
For technical support, including SPC564A70B4CFAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC564A70B4CFAY requirements.
6.How does Aetrix verify that SPC564A70B4CFAY is sourced from the original manufacturer or authorized distributors?
All SPC564A70B4CFAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC564A70B4CFAY meets industry standards.
7.What is the process for return or replacement of SPC564A70B4CFAY?
All SPC564A70B4CFAY units undergo pre-shipment inspection (PSI). If there is an issue with SPC564A70B4CFAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC564A70B4CFAY part is unused and in its original packaging.
Return procedure for SPC564A70B4CFAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC564A70B4CFAY Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
