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STMicroelectronics SPC564A70L7CFAY

Part No.:
SPC564A70L7CFAY
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSPC564A70L7CFAY.pdf
Description:
IC MCU 32BIT 2MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,749

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Product details

Overview

SPC564A70L7CFAY from STMicroelectronics is a 32-bit Power Architecture® e200z4-based automotive MCU targeting powertrain control units (PCUs), featuring 150 MHz core frequency, 2 MB on-chip flash with ECC and read-while-write, 128 KB SRAM with standby/ECC, and integrated FlexRay v2.1 (10 Mbit/s, dual-channel) for engine management systems.

For engineers reviewing the SPC564A70L7CFAY datasheet, SPC564A70L7CFAY pinout, SPC564A70L7CFAY application, or SPC564A70L7CFAY equivalent, key selection considerations include its triple FlexCAN (64-message buffers each), dual eQADC (40×12-bit channels, 688 ns min conversion), eTPU2 with 32 standard + 6 reaction channels, and support for LQFP176/PBGA324 packages in AEC-Q100 Grade 1 environments.

Technical Context

The SPC564A70L7CFAY implements a superscalar e200z4 core with Variable Length Encoding (VLE), enabling up to two integer or floating-point instructions per cycle and four MAC operations per cycle. Its memory subsystem includes 2 MB flash with ECC and RWW capability, 128 KB SRAM (32 KB with standby mode), and an 8 KB configurable instruction cache.

Peripheral integration centers on deterministic real-time I/O: three FlexCAN modules (64 message buffers each), one FlexRay v2.1 controller (128 message objects, ECC), two eQADCs (40 input channels, 688 ns conversion), and second-generation eTPU2 with dedicated reaction module (6 channels × 3 outputs). Clocking uses an on-chip FMPLL with 4–40 MHz crystal input.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture e200z4 Power Architecture® with VLE, superscalar dual-execution-unit design for deterministic automotive control loops.
Clock Frequency 150 MHz maximum core frequency; enabled by FMPLL with 4–40 MHz external crystal input.
Flash Memory 2 MB on-chip flash with ECC protection and read-while-write capability for safe over-the-air (OTA) updates.
SRAM 128 KB total: 32 KB supports standby retention, all protected by ECC for ASIL-B compliance.
Analog Conversion Two eQADCs, 40 total 12-bit input channels, minimum 688 ns conversion time for fast cylinder pressure sampling.
Communication Interfaces 3× FlexCAN (64 msg buf), 1× FlexRay v2.1 (10 Mbit/s, dual channel, 128 msg obj), 3× DSPI, 3× eSCI.
Real-Time Peripherals eTPU2 with 32 standard + 6 reaction channels; eMIOS with 24 unified channels for PWM, capture, and timing-critical I/O.

Pinout & Package

SPC564A70L7CFAY is packaged in LQFP176 (24 mm × 24 mm, 0.5 mm pitch) and PBGA324 (23 mm × 23 mm, 1.0 mm ball pitch), both qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient).

Pin/Terminal Circuit Role Design Meaning
VDD_MAIN Main supply rail 5 V ±5 % input powering core logic, PLL, and analog peripherals; requires external ballast resistor per datasheet Fig. 8.
VDD_IO I/O supply rail 3.3 V ±10 % supply for GPIO, CAN transceivers, and digital interfaces; decoupled separately from VDD_MAIN.
VDD_RTC Standby domain supply Supplies 32 KB SRAM retention and RTC during STOP/STANDBY modes; accepts 1.2–3.6 V.
OSC_IN / OSC_OUT Crystal oscillator interface Connects to 4–40 MHz fundamental-mode quartz crystal; internal load capacitors configurable via SIU registers.
FRAY_TXD / FRAY_RXD FlexRay differential pair Dedicated LVDS-capable pins supporting 10 Mbit/s FlexRay v2.1 bus; require 100 Ω termination at node level.
CAN0_TX / CAN0_RX FlexCAN channel 0 interface CMOS-level signals routed to external CAN transceiver (e.g., TJA1043); support ISO 11898-2 physical layer.

Key Features

Feature Design Value
Fail-Safe Protection 16-entry MPU, CRC unit with 3 independent submodules, junction temperature sensor, and ECSM for flash/SRAM error detection/correction.
Nexus Debug Class 3+ core debug + Class 1 eTPU trace; enables non-intrusive real-time profiling of powertrain control algorithms.
Bootloader Capability On-chip CAN/SCI Bootstrap Loader with Boot Assist Module (BAM) for secure field firmware updates without external programmer.
Power Management Three low-power modes (Slow, Stop, Standby); VDD_RTC domain retains 32 KB SRAM and RTC while drawing <10 µA typical.
Crossbar Switch 4×4 XBAR interconnect enabling concurrent access to flash, SRAM, and peripherals without arbitration stalls.

Applications

Engine Control Unit (ECU) Transmission Control Unit (TCU)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary powertrain controller executing ASIL-C safety-critical functions with eTPU2 managing cam/crank signal conditioning and spark timing.

Use Value: 688 ns eQADC conversion enables precise cylinder pressure sampling; FlexRay v2.1 supports deterministic torque coordination between ECU and TCU.

Use Scenario: Gear shift scheduling, clutch engagement control, and hydraulic pressure regulation in automatic transmissions.

IC Role / Device Role / Timing Role: High-integrity motion controller using dual eQADCs for turbine speed and oil temperature sensing, and eMIOS for solenoid PWM generation.

Use Value: 2 MB ECC flash stores multiple transmission calibration maps; 128 KB SRAM accommodates real-time adaptive learning buffers.

Electric Power Steering (EPS) Hybrid Vehicle Power Management

Use Scenario: Torque assist calculation, motor phase current sensing, and fault-tolerant steering angle fusion.

IC Role / Device Role / Timing Role: Safety-redundant controller with MPU-enforced memory partitioning and dual FlexCAN for EPS ECU–motor inverter communication.

Use Value: 3× FlexCAN modules enable isolated CAN FD-capable diagnostic, control, and safety bus domains per ISO 26262 ASIL-D decomposition.

Use Scenario: Coordination of ICE start-stop, battery SOC balancing, and regenerative braking energy routing.

IC Role / Device Role / Timing Role: System coordinator interfacing with BMS, inverter, and engine ECU via FlexRay and multiple CAN buses.

Use Value: FlexRay v2.1 10 Mbit/s throughput ensures sub-100 µs latency for torque request synchronization across hybrid power domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive powertrain microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP MPC5643L Same e200z4 core, 128 MB flash, no FlexRay; uses older DSPI instead of downstream MSC-enhanced DSPI. Lacks FlexRay v2.1 and dual eQADC; suitable for legacy CAN-only powertrain designs without high-speed deterministic bus requirements. Select when FlexRay integration is unnecessary and cost-sensitive CAN-based architectures dominate.
Renesas RH850/F1L 32-bit RXv2 core (not Power Architecture), 1.5 MB flash, 192 KB RAM, supports CAN FD but no FlexRay; different toolchain and safety certification path. Targets ASIL-B/D applications with strong compiler/tooling ecosystem; lacks eTPU2-level deterministic I/O for spark timing. Prefer for new designs prioritizing long-term toolchain continuity and CAN FD over FlexRay, especially outside strict Power Architecture migration paths.

Compared with MPC5643L and RH850/F1L, the SPC564A70L7CFAY uniquely delivers FlexRay v2.1 + triple FlexCAN + eTPU2 in a single die-enabling consolidated high-speed deterministic networking and ultra-low-latency I/O critical for next-gen ICE/hybrid powertrain ECUs.

Availability

SPC564A70L7CFAY is available at Aetrix Electronics and suitable for engine control units, transmission control units, electric power steering systems, and hybrid vehicle power management requiring stable component supply under AEC-Q100 Grade 1 conditions.

Supply support for SPC564A70L7CFAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power solutions with broad IP portfolio and AEC-Q100-qualified manufacturing.

The SPC564A70L7CFAY belongs to ST's SPC56x automotive MCU family, designed specifically for ASIL-B/C powertrain applications demanding high computational throughput, functional safety compliance, and multi-bus real-time networking.

FAQ

What is the maximum junction temperature rating for SPC564A70L7CFAY?

The SPC564A70L7CFAY is rated for maximum junction temperature of +150 °C and operates across ambient temperatures from −40 °C to +125 °C (AEC-Q100 Grade 1). Thermal characteristics are validated per JEDEC JESD51 standards, with θJA = 22.5 °C/W for LQFP176 and 14.2 °C/W for PBGA324 packages under defined PCB layout conditions.

Does SPC564A70L7CFAY support hardware-based functional safety features for ISO 26262 compliance?

Yes. The device integrates hardware safety mechanisms including ECC on flash and SRAM, 16-entry MPU for memory isolation, CRC unit with three independent submodules, error correction status module (ECSM), and Nexus Class 3+ debug for runtime verification-supporting ASIL-B system-level compliance per ISO 26262 Part 5 Annex D.

Can SPC564A70L7CFAY execute code from RAM while writing to flash?

Yes. The 2 MB on-chip flash supports true read-while-write (RWW) operation, allowing execution from one flash block while programming or erasing another. This capability is essential for safe in-field firmware updates and bootloader implementations without halting real-time control tasks.

What package variants are offered for SPC564A70L7CFAY, and are they pin-compatible?

The SPC564A70L7CFAY is offered in LQFP176 and PBGA324 packages. These are not pin-compatible: LQFP176 uses perimeter leads with 0.5 mm pitch; PBGA324 uses area-array balls with 1.0 mm pitch and distinct signal mapping per Figures 2 and 4–7 in Doc ID 18078 Rev 4. Designers must select package-specific reference layouts and routing rules.

SPC564A70L7CFAY Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
176-LQFP
Series:
SPC56
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
150
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 1.32V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

SPC564A70L7CFAY FAQ

1.How can I place an order for SPC564A70L7CFAY through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC564A70L7CFAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC564A70L7CFAY reliable?

The price and inventory of SPC564A70L7CFAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC564A70L7CFAY is usually 5 days.

3.What payment methods are accepted for SPC564A70L7CFAY?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC564A70L7CFAY transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC564A70L7CFAY?

SPC564A70L7CFAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC564A70L7CFAY order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC564A70L7CFAY?

For technical support, including SPC564A70L7CFAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC564A70L7CFAY requirements.

6.How does Aetrix verify that SPC564A70L7CFAY is sourced from the original manufacturer or authorized distributors?

All SPC564A70L7CFAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC564A70L7CFAY meets industry standards.

7.What is the process for return or replacement of SPC564A70L7CFAY?

All SPC564A70L7CFAY units undergo pre-shipment inspection (PSI). If there is an issue with SPC564A70L7CFAY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC564A70L7CFAY part is unused and in its original packaging.

Return procedure for SPC564A70L7CFAY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC564A70L7CFAY Tags

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