STMicroelectronics SPC564B64L7B9ECX

Overview

SPC564B64L7B9ECX from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z4d core, operating at up to 120 MHz and 200 MIPs. It integrates 1.5 MByte on-chip Flash with ECC, 256 KByte SRAM with ECC, and supports FlexCAN, DSPI, LINFlex, Fast Ethernet, and CSE cryptographic engine. Designed for body electronics control units requiring functional safety and real-time performance.

For engineers reviewing the SPC564B64L7B9ECX datasheet, SPC564B64L7B9ECX pinout, SPC564B64L7B9ECX application, or SPC564B64L7B9ECX equivalent, key selection criteria include dual-core timing capability (e200z4d + e200z0h), ASIL-B-ready safety features (SWT, MPU, BIST), automotive-grade temperature range (−40 to 125 °C), and integrated Ethernet/PHY interface support.

Technical Context

This MCU implements a dual-core architecture: a high-performance e200z4d core (120 MHz) for main application tasks and a dedicated e200z0h core (80 MHz) for safety monitoring or real-time background services. Both cores share memory protection via a 16-entry MPU and support Nexus 1+ debug interface.

Its system-level timing infrastructure includes an 8-channel PIT, 4-channel STM, Safety System Watchdog Timer (SWT), and RTC/API - all synchronized under a unified clock tree with FMPLL, multiple oscillators (4–40 MHz crystal, 32 kHz aux, 16/128 kHz RC), and Clock Monitoring Unit (CMU) for fault detection.

Key Specifications

Pinout & Package

LQFP176 package (24 × 24 × 1.4 mm), RoHS-compliant, ECOPACK® certified. Pin mapping validated per STMicroelectronics DocID17478 Rev 9, Figure 2 and Table 4–5.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC564B64L7B9ECX, the SPC564B70L7B9ECX offers scalable code storage for future feature growth, while the SPC56EC64L7B9ECX trades Ethernet for higher CPU throughput - making the original part optimal for connected body electronics requiring both safety and networking.

Availability

SPC564B64L7B9ECX is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, adaptive lighting systems, and climate control units requiring stable component supply across extended product lifecycles.

Supply support for SPC564B64L7B9ECX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with over 45 years of automotive qualification experience.

The SPC56xx family targets ASIL-B/C automotive applications including body electronics, gateway, and lighting control, emphasizing functional safety, mixed-signal integration, and multi-protocol connectivity.

FAQ

What is the maximum operating frequency of the SPC564B64L7B9ECX main core?

The primary e200z4d core operates at up to 120 MHz, delivering 200 MIPs performance. This frequency is achievable under recommended operating conditions (3.3 V or 5 V supply, −40 to 125 °C ambient) with proper clock configuration using the FMPLL and external 4–40 MHz crystal oscillator.

Does the SPC564B64L7B9ECX support AUTOSAR-compliant MCAL drivers?

Yes - ST provides fully qualified MCAL drivers for SPC564B64L7B9ECX covering CAN, LIN, SPI, ADC, PWM, ETH, and GPT modules, certified for AUTOSAR 4.2.x and 4.3.x. These drivers include safety mechanisms aligned with ISO 26262 ASIL-B requirements.

Is the Fast Ethernet Controller IEEE 802.3 compliant?

Yes - the integrated Fast Ethernet Controller supports IEEE 802.3 10/100 Mbps base-T operation in MII mode, with full-duplex capability, auto-negotiation, and CRC32 checksum generation/verification. It interfaces directly with standard PHY ICs such as the LAN8720A.

What packaging and reflow profile does the SPC564B64L7B9ECX require?

The device uses a 176-pin LQFP package (24 × 24 × 1.4 mm) with standard gull-wing leads. It follows JEDEC J-STD-020D reflow profile for lead-free soldering, peak temperature 260 °C, with ramp-up rate ≤3 °C/s and time above liquidus 60–150 s. Moisture sensitivity level is MSL3.