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STMicroelectronics SPC564L54L3CBOQR
- Part No.:
- SPC564L54L3CBOQR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC564L54L3CBOQR.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,890
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Product details
Overview
SPC564L54L3CBOQR from STMicroelectronics is a 32-bit Power Architecture® automotive MCU with dual e200z4d cores, 1 MB flash (ECC), 128 KB SRAM (ECC), and SIL3/ASILD safety certification for chassis and safety-critical systems. It operates up to 120 MHz, supports LockStep and Decoupled Parallel modes, and integrates FlexRay (10 Mbit/s), dual FlexCAN 2.0B, and two 12-bit ADCs - deployed in electric power steering (EPS) and brake-by-wire control units.
For engineers reviewing the SPC564L54L3CBOQR datasheet, SPC564L54L3CBOQR pinout, SPC564L54L3CBOQR application, or SPC564L54L3CBOQR equivalent, key selection criteria include ASIL-D fault containment metrics (FCCU/RCCU), dual-core safety architecture (SoR), RWW EEPROM emulation, Nexus Class 3+ debug support, and LFBGA257 thermal performance at 150 °C junction temperature.
Technical Context
The device implements a dual-core Power Architecture® e200z4d CPU with Variable Length Encoding (VLE), MMU, 4 KB instruction cache with EDC, and Signal Processing Engine (SPE). Core operation is synchronized via LockStep for functional safety or decoupled for high-throughput tasks like motor control loop execution.
Safety logic includes Sphere of Replication (SoR) covering CPU, eDMA, and crossbar switch; Fault Collection and Control Unit (FCCU); Redundancy Control and Checker Unit (RCCU); and hardware-triggered MBIST/LBIST. Boot-time software-initiated BIST covers ADC and flash, while replicated junction temperature sensors feed NMI and thermal management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z4d dual core, Power Architecture® v2.03, VLE support for code density optimization |
| Max Core Frequency | 120 MHz - enables real-time execution of ASIL-D safety monitors and control algorithms within <100 µs latency budgets |
| Flash Memory | 1 MB with ECC - supports safe over-the-air (OTA) updates and RWW for EEPROM emulation without halting execution |
| SRAM | 128 KB with ECC - provides fault-tolerant data storage for safety-critical variables and stack redundancy |
| Safety Certification | SIL3/ASIL-D per ISO 26262 - validated by SoR, FCCU, RCCU, and hardware BIST coverage >90% for logic and memory |
| FlexRay Interface | V2.1 Rev. A, 2 channels, 64 message buffers, up to 10 Mbit/s - meets deterministic communication requirements for x-by-wire systems |
| ADC | Two 12-bit converters, 16-channel total, CTU-synchronized sampling - enables simultaneous current/voltage sensing in dual-motor EPS |
| Operating Temperature | Junction range –40 °C to 150 °C - qualified for under-hood deployment in automotive chassis modules |
Pinout & Package
LFBGA257 package (14 mm × 14 mm, 0.8 mm pitch), thermally enhanced for automotive under-hood use with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply input | 3.0–3.6 V core power rail; requires dedicated 100 nF + 10 µF decoupling per supply domain |
| VDDA | Analog supply | Independent 3.3 V analog rail for ADC/SWG; isolated to maintain SNR >70 dB |
| VRX/VTX | FlexRay transceiver interface | Differential pair supporting 10 Mbit/s signaling; matched 100 Ω impedance routing required |
| CANH/CANL | FlexCAN bus interface | Two independent differential CAN 2.0B physical layers; each supports 1 Mb/s with integrated termination |
| ET0_QA/ET0_QB | eTimer quadrature input | Hardware-decoded encoder interface for motor position feedback; supports 4× interpolation |
| NEXUS_TDI/TDO | Nexus Class 3+ debug port | Real-time trace and non-intrusive debugging; supports instruction trace, data watchpoints, and safety state capture |
Key Features
| Feature | Design Value |
|---|---|
| LockStep + Decoupled Parallel mode | Enables both ASIL-D compliance (LockStep) and high-performance motor control (Decoupled), eliminating need for separate safety and application cores |
| On-chip RWW EEPROM emulation | 128 KB SRAM + flash wear-leveling firmware allows persistent parameter storage without external EEPROM, reducing BOM count and failure points |
| Replicated junction temperature sensor | Dual independent sensors feed FCCU and NMI - enables immediate thermal shutdown if deviation exceeds ±5 °C, meeting ASIL-D thermal fault response requirements |
| Hardware CRC unit | Dedicated accelerator computes CRC-32/CRC-16 on memory blocks or message payloads in <100 ns - offloads CPU during safety checksum validation |
| Programmable CTU | Hardware synchronization unit triggers ADC conversions precisely aligned with PWM edge events - eliminates software jitter in current-sensing loops |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire (BBW) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase current regulation in column-assist EPS systems. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms, fault monitoring, and CAN/FlexRay gateway functions. Use Value: Dual-core LockStep ensures continuous torque command validation; 120 MHz core frequency sustains 10 kHz FOC loop rate with <5 µs jitter. | Use Scenario: Redundant actuator control and pressure modulation in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-certified master controller managing dual solenoid drivers, pressure sensor fusion, and vehicle dynamics arbitration. Use Value: FlexRay interface guarantees deterministic 5 ms cycle time; FCCU detects and isolates faults before hydraulic failure propagation. |
| Airbag Control Unit (ACU) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
Use Scenario: Crash event detection, pyrotechnic trigger sequencing, and occupant classification sensor fusion. IC Role / Device Role / Timing Role: SIL3-certified central safety processor handling sensor inputs, decision logic, and dual-stage deployment timing. Use Value: Hardware BIST validates memory and logic pre-deployment; replicated ADCs enable redundant acceleration measurement with <100 ns skew. | Use Scenario: Sensor preprocessing and fail-operational handover coordination between radar, camera, and ultrasonic subsystems. IC Role / Device Role / Timing Role: Safety monitor co-processor validating perception outputs and initiating graceful degradation upon fault detection. Use Value: Decoupled Parallel mode runs safety checker independently of main ADAS stack; Nexus trace captures fault context for root-cause analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144 | ARM Cortex-M4F core, 112 MHz max, 1 MB flash, ASIL-B certified (upgradable to ASIL-D with SW) | Targeted at body electronics and lower-tier ADAS; lacks native FlexRay and dual-core LockStep | Choose when ARM toolchain compatibility and cost sensitivity outweigh native ASIL-D silicon enforcement. |
| Renesas RH850/P1M | 32-bit RXv2 core, 120 MHz, 2 MB flash, ASIL-D certified, but no FlexRay PHY integration | Focused on powertrain and EV inverter control; requires external FlexRay transceiver | Prefer when higher flash density and legacy RH850 ecosystem integration are prioritized over integrated FlexRay. |
Compared with SPC564L54L3CBOQR, the S32K144 offers broader ARM-based software reuse but requires additional safety software layers to reach ASIL-D, while the RH850/P1M delivers higher flash capacity and mature powertrain qualification yet increases system BOM and layout complexity due to external FlexRay components.
Availability
SPC564L54L3CBOQR is available at Aetrix Electronics and suitable for electric power steering (EPS), brake-by-wire (BBW), airbag control units (ACU), and ADAS domain controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC564L54L3CBOQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power solutions with vertical manufacturing and functional safety expertise.
The SPC56xL series targets ASIL-D automotive chassis and safety systems, designed specifically to consolidate safety-critical control, communication (FlexRay/CAN), and real-time processing onto a single die - reducing system complexity versus multi-chip safety architectures.
FAQ
What is the maximum ambient operating temperature for SPC564L54L3CBOQR?
The device is rated for ambient temperatures from –40 °C to 125 °C in LFBGA257 packaging. This rating is validated per AEC-Q100 Grade 1 and aligns with under-hood placement in EPS and BBW modules where airflow and thermal design ensure junction temperature remains ≤150 °C under full load.
Does SPC564L54L3CBOQR support boot-from-flash with ECC correction enabled?
Yes - the on-chip flash controller performs transparent single-bit error correction and multi-bit error detection during all read operations, including boot sequence. The boot ROM validates flash integrity using stored ECC syndromes before transferring control to user code, ensuring safe startup even after radiation-induced bit flips.
How is the FlexRay interface clocked and what external components are required?
The FlexRay module uses an internal FMPLL-derived clock; no external crystal is needed for basic operation. However, a 10 MHz or 20 MHz external oscillator is required for precise time-base synchronization across network nodes. External passive components include 100 Ω termination resistors and common-mode chokes per channel, as specified in ST's AN4221 application note.
Can the e200z4d cores execute different safety partitions simultaneously in Decoupled Parallel mode?
Yes - in Decoupled Parallel mode, each core runs independent code with separate MMU mappings, interrupt vectors, and memory spaces. This enables concurrent execution of ASIL-D safety monitor (Core 0) and ASIL-B application control (Core 1), with hardware-enforced isolation preventing interference, as verified in ST's SPC564Lx safety manual UM1802.
SPC564L54L3CBOQR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56xL
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4d
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 57
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.63V
- Data Converters:
- A/D 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC564L54L3CBOQR FAQ
1.How can I place an order for SPC564L54L3CBOQR through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC564L54L3CBOQR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC564L54L3CBOQR reliable?
The price and inventory of SPC564L54L3CBOQR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC564L54L3CBOQR is usually 5 days.
3.What payment methods are accepted for SPC564L54L3CBOQR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC564L54L3CBOQR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC564L54L3CBOQR?
SPC564L54L3CBOQR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC564L54L3CBOQR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC564L54L3CBOQR?
For technical support, including SPC564L54L3CBOQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC564L54L3CBOQR requirements.
6.How does Aetrix verify that SPC564L54L3CBOQR is sourced from the original manufacturer or authorized distributors?
All SPC564L54L3CBOQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC564L54L3CBOQR meets industry standards.
7.What is the process for return or replacement of SPC564L54L3CBOQR?
All SPC564L54L3CBOQR units undergo pre-shipment inspection (PSI). If there is an issue with SPC564L54L3CBOQR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC564L54L3CBOQR part is unused and in its original packaging.
Return procedure for SPC564L54L3CBOQR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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