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STMicroelectronics SPC564L70L3CBFSY

Part No.:
SPC564L70L3CBFSY
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC564L70L3CBFSY.pdf
Description:
IC MCU 32BIT 2MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,842

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Product details

Overview

SPC564L70L3CBFSY from STMicroelectronics is a 32-bit Power Architecture® automotive microcontroller with dual e200z4d cores operating up to 120 MHz, 2 MB flash with ECC, 192 KB SRAM with ECC, and SIL3/ASIL-D safety certification for chassis and safety-critical systems. It integrates FlexRay (2 channels, 10 Mbit/s), three FlexCAN 2.0B interfaces, and dual 12-bit ADCs with cross-triggering-deployed in electronic brake control units (EBCU) and steer-by-wire ECUs.

For engineers reviewing the SPC564L70L3CBFSY datasheet, SPC564L70L3CBFSY pinout, SPC564L70L3CBFSY application, or SPC564L70L3CBFSY equivalent, key selection criteria include lock-step core redundancy, FCCU fault reporting latency, RWW EEPROM emulation capability, and Nexus Class 3+ debug support for ISO 26262 ASIL-D development workflows.

Technical Context

The device implements a Sphere of Replication (SoR) architecture covering CPU cores, eDMA controllers, and crossbar switch-monitored by a dedicated Fault Collection and Control Unit (FCCU) that aggregates errors from replicated outputs via RCCU. Boot-time hardware-triggered MBIST/LBIST and software-triggered ADC/flash BIST provide deterministic safety coverage.

It supports Decoupled Parallel mode for non-safety high-performance tasks while maintaining lock-step operation for safety partitions; clock monitoring units (CMU) supervise both main oscillator and FMPLL outputs, and the 16-region MPU enforces memory isolation between safety and non-safety software partitions.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture e200z4d dual-core Power Architecture® with VLE, MMU, and SPE-enables real-time deterministic execution and signal processing in safety-critical control loops.
Max Core Frequency 120 MHz-supports sub-10 µs interrupt response time required for ABS and ESC actuator control.
Flash Memory 2 MB with ECC and RWW capability-allows safe background firmware updates without halting safety-critical functions.
SRAM 192 KB on-chip SRAM with ECC-provides error-resilient data storage for runtime variables and safety state machines.
Safety Certification ISO 26262 ASIL-D compliant with lock-step SoR, FCCU, and hardware BIST-meets full SIL3 requirements for chassis domain applications.
FlexRay Interface 2-channel V2.1 Rev. A module, 64 message buffers, up to 10 Mbit/s-enables time-triggered communication in x-by-wire systems.
ADC Dual 12-bit converters, 16 input channels, CTU-synchronized sampling-supports simultaneous voltage/current sensing for motor phase control.

Pinout & Package

LQFP100 package (14 × 14 × 1.4 mm), RoHS-compliant, with exposed thermal pad; rated for −40 °C to 125 °C ambient and −40 °C to 150 °C junction temperature.

Pin/Terminal Circuit Role Design Meaning
VDDA, VSSA Analog power supply/ground Isolated 3.3 V analog domain powering ADCs and internal references-ensures <±1 LSB INL under EMI stress.
VDD, VSS Digital core power supply/ground 3.0–3.6 V digital domain with decoupling per Table 10-supports stable 120 MHz operation with <500 ps jitter.
RESET Asynchronous reset input Active-low, Schmitt-triggered, with programmable glitch filter-initiates destructive or functional reset sequences per ISO 26262 startup requirements.
NMI Non-maskable interrupt Dedicated hard-fault path into FCCU-bypasses INTC to trigger immediate safety shutdown on critical hardware faults.
FRAY_TX0/FRAY_RX0 FlexRay channel 0 differential pair Integrated bus driver/receiver compliant with FlexRay Physical Layer Spec V2.1-eliminates need for external transceivers in cost-sensitive nodes.
CAN0_TX/CAN0_RX FlexCAN channel 0 differential signals On-die CAN physical layer supporting 1 Mbit/s-reduces board area and improves EMC robustness vs discrete transceivers.

Key Features

Feature Design Value
Lock-step Sphere of Replication (SoR) CPU, eDMA, XBAR, and watchdog replicated with RCCU comparison-detects transient faults with <1 µs latency before propagation.
Boot-time Hardware BIST MBIST and LBIST triggered automatically at power-on-verifies >99% stuck-at fault coverage in flash and logic before application code executes.
Replicated Junction Temperature Sensor Dual independent sensors with ±2.5 °C accuracy across −40 °C to 150 °C-enables redundant thermal derating in motor control inverters.
Programmable Cross Triggering Unit (CTU) Synchronizes ADC conversions with eTimer PWM edges-achieves <50 ns timing alignment for current-sensing in field-oriented control.
Nexus Class 3+ Debug Interface Real-time trace, data watchpoints, and non-intrusive core halt-supports ASIL-D tool qualification per ISO 26262-8 Annex D.

Applications

Electronic Brake Control Unit (EBCU) Steer-by-Wire Actuator Controller

Use Scenario: Real-time pressure modulation and wheel slip detection during ABS/EBD intervention.

IC Role / Device Role / Timing Role: Primary safety controller executing ISO 26262 ASIL-D braking algorithms with lock-step core validation and FCCU-monitored fault handling.

Use Value: Sub-100 µs end-to-end control loop latency with hardware-enforced memory protection prevents unsafe actuation during transient faults.

Use Scenario: Closed-loop torque control of dual-redundant steering motors with fail-operational behavior.

IC Role / Device Role / Timing Role: Dual-core coordination in Decoupled Parallel mode-safety partition runs torque arbitration, performance partition handles motor commutation.

Use Value: FlexRay + FlexCAN coexistence enables synchronized actuator commands and diagnostic feedback across heterogeneous networks.

Electric Power Steering (EPS) ECU Chassis Domain Controller

Use Scenario: Torque assist calculation, motor phase current sensing, and road feel emulation using sine wave generator.

IC Role / Device Role / Timing Role: Integrated SWG and dual ADCs enable analog output generation and synchronous sampling-replaces external DACs and timing ICs.

Use Value: On-chip SWG with low-pass filter delivers <1% THD sine waves for haptic feedback-reducing BOM count and PCB footprint.

Use Scenario: Centralized coordination of brake, steering, and suspension subsystems via time-triggered FlexRay backbone.

IC Role / Device Role / Timing Role: Domain master with 2 FlexRay channels and 3 FlexCAN interfaces-manages schedule synchronization and fault containment boundaries.

Use Value: 64-message FlexRay buffer and hardware CRC offload reduce CPU load by >35% vs software-based protocol stacks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPC56EL70L3CBKAY LQFP144 package (20 × 20 mm), same core/peripherals but higher pin count for expanded I/O and additional CAN/FlexRay routing flexibility. Better suited for multi-sensor chassis controllers requiring >80 GPIOs and separate power domains for analog/digital sections. Select when board layout requires larger I/O fanout or thermal dissipation margin beyond LQFP100 limits.
TC297TP128F200NAC TriCore™ architecture (Infineon), 200 MHz, 4 MB flash, ASIL-D certified-but lacks native FlexRay PHY and uses different safety library ecosystem. Preferred in German OEM platforms with existing AURIX™ toolchain investment and CAN FD + Ethernet focus over FlexRay. Choose only if migrating from legacy TriCore designs or when Ethernet AVB integration is mandatory.

Compared with SPC564L70L3CBFSY, the SPC56EL70L3CBKAY offers identical safety architecture in a larger package for complex I/O routing, while the TC297TP128F200NAC trades FlexRay integration for higher clock speed and Ethernet readiness-requiring revalidation of safety drivers and debug toolchains.

Availability

SPC564L70L3CBFSY is available at Aetrix Electronics and suitable for electronic brake control units, steer-by-wire actuators, and electric power steering ECUs requiring stable component supply through 2030 and beyond.

Supply support for SPC564L70L3CBFSY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power solutions with vertical manufacturing and functional safety expertise.

The SPC56x series targets ISO 26262 ASIL-D automotive chassis applications-designed from inception with hardware-level fault containment, replicated safety peripherals, and certified development processes.

FAQ

What is the maximum junction temperature rating for SPC564L70L3CBFSY?

The device is qualified for a junction temperature range of −40 °C to 150 °C, validated per JEDEC JESD22-A108 and reflected in thermal resistance values (θJA = 32.5 °C/W for LQFP100). This enables deployment in under-hood environments near powertrain components without forced cooling.

Does SPC564L70L3CBFSY support RWW (Read-While-Write) for EEPROM emulation?

Yes-it features built-in RWW capability in its 2 MB flash memory with ECC, allowing concurrent code execution from one flash bank while programming another. This enables seamless firmware updates and robust data logging without interrupting safety-critical tasks.

How does the Fault Collection and Control Unit (FCCU) interface with the Redundancy Control and Checker Unit (RCCU)?

The RCCU continuously compares outputs from replicated modules (e.g., CPU ALU results, eDMA descriptors) and sends mismatch flags directly to the FCCU. The FCCU then logs the fault type, location, and timestamp, and can assert NMI or initiate a controlled shutdown-meeting ASIL-D fault reaction time requirements (<10 ms).

Can the SPC564L70L3CBFSY operate with a single 3.3 V supply?

Yes-the device operates from a single 3.0 V to 3.6 V supply, internally generating all required voltage domains (core, analog, I/O) via integrated regulators. No external LDOs are needed for basic operation, though separate VDDA/VDD decoupling per datasheet Table 10 is mandatory for ADC accuracy and EMC compliance.

SPC564L70L3CBFSY Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-LQFP
Series:
SPC56xL
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4d
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
57
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

SPC564L70L3CBFSY FAQ

1.How can I place an order for SPC564L70L3CBFSY through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC564L70L3CBFSY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC564L70L3CBFSY reliable?

The price and inventory of SPC564L70L3CBFSY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC564L70L3CBFSY is usually 5 days.

3.What payment methods are accepted for SPC564L70L3CBFSY?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC564L70L3CBFSY transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC564L70L3CBFSY?

SPC564L70L3CBFSY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC564L70L3CBFSY order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC564L70L3CBFSY?

For technical support, including SPC564L70L3CBFSY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC564L70L3CBFSY requirements.

6.How does Aetrix verify that SPC564L70L3CBFSY is sourced from the original manufacturer or authorized distributors?

All SPC564L70L3CBFSY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC564L70L3CBFSY meets industry standards.

7.What is the process for return or replacement of SPC564L70L3CBFSY?

All SPC564L70L3CBFSY units undergo pre-shipment inspection (PSI). If there is an issue with SPC564L70L3CBFSY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC564L70L3CBFSY part is unused and in its original packaging.

Return procedure for SPC564L70L3CBFSY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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