NXP Semiconductors SPC5673FF3MVR2R
- Part No.:
- SPC5673FF3MVR2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5673FF3MVR2R.pdf
- Description:
- IC MCU 32BIT 3MB FLASH 416PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5673FF3MVR2R from NXP Semiconductors is a 200 MHz automotive-qualified Power Architecture® e200z7-based 32-bit microcontroller with 3 MB on-chip flash, 192 KB SRAM (including 32 KB standby RAM), dual eTPU2 units (64 total channels), 32-channel eMIOS, and four FlexCAN interfaces. It targets engine control units (ECUs) requiring deterministic real-time I/O timing, sensor signal conditioning, and CAN-based vehicle networking.
For engineers reviewing the SPC5673FF3MVR2R datasheet, SPC5673FF3MVR2R pinout, SPC5673FF3MVR2R application, or SPC5673FF3MVR2R equivalent, this page delivers verified technical context, package mapping to 416-ball TEPBGA (27 mm × 27 mm), functional pin roles, validated alternatives, and supply-chain support for high-reliability automotive embedded design.
Technical Context
The SPC5673FF3MVR2R integrates a dual-issue e200z7 CPU core compliant with Power Architecture® embedded category, featuring 16 KB instruction cache and 16 KB data cache, VLE instruction encoding for code density reduction, and SPE2 extensions for DSP and single-precision floating-point operations. Its FMPLL provides frequency-modulated clock generation with ±2% modulation capability.
It implements two independent eTPU2 modules sharing 24 KB code RAM and 6 KB parameter RAM, supporting 32 standard channels each with programmable time-stamped I/O processing. The crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including two eDMA2 controllers (64- and 32-channel).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 support for compact code and DSP acceleration |
| Max Operating Frequency | 200 MHz nominal system clock; supports frequency modulation up to ±2% for EMI reduction |
| Flash Memory | 3 MB on-chip C90 flash with read-while-program/erase capability and EEPROM emulation across multiple blocks |
| SRAM | 192 KB general-purpose SRAM, including 32 KB low-leakage standby RAM for battery-backed operation |
| eTPU2 Channels | 64 total enhanced time processor unit channels (32 per eTPU2), enabling precise capture/generation of PWM, encoder, and cam/crank signals |
| eMIOS Channels | 32 unified modular I/O channels supporting PWM, modulus counting, and dual-action timing functions per channel |
| FlexCAN Interfaces | Four independent Controller Area Network modules compliant with ISO 11898-1, supporting CAN FD-ready message filtering and buffering |
Pinout & Package
SPC5673FF3MVR2R uses a 416-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm with 0.8 mm ball pitch. This Pb-free package is optimized for automotive thermal cycling and mechanical reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Core power supply / ground | Multiple dedicated VDD/VSS balls distributed across package for low-impedance power delivery and noise suppression |
| ANA0–ANA23, ANB0–ANB23 | Analog input channels | 64-channel eQADC interface with shared and dedicated inputs; supports simultaneous sampling and decimation filtering |
| EMIOS0–EMIOS31 | Enhanced modular I/O signals | 32 configurable I/O pins supporting PWM, edge-triggered capture, and modulus counter modes with independent prescalers |
| ETPUA0–ETPUA31, ETPUB0–ETPUB31 | eTPU2 channel I/O | 64 time-critical I/O terminals with hardware timestamping, supporting cam/crank, injector, and ignition timing in engine control |
| CAN_A_TX/RX, CAN_B_TX/RX, CAN_C_TX/RX, CAN_D_TX/RX | FlexCAN differential transceiver interfaces | Four isolated CAN physical layer connections with internal termination resistors and wake-on-CAN capability |
| RESET, PLLCFG0–2, BOOT_RDY | Configuration and reset control | Non-volatile configuration pins defining boot source (CAN/SCI), PLL multiplier, and device initialization state |
Key Features
| Feature | Design Value |
|---|---|
| Boot Assist Module (BAM) | Enables serial bootload via CAN or SCI without external programmer, reducing production test complexity |
| Nexus Development Interface | IEEE-ISTO 5001-2003/2008-compliant debug interface supporting real-time trace, breakpoints, and memory access during runtime |
| Error Correction Status Module (ECSM) | Monitors flash and SRAM for bit errors and triggers corrective action or fault reporting for ASIL-B compliance |
| System Integration Unit (SIU) | Centralized peripheral configuration hub managing clock gating, reset distribution, and interrupt routing across all subsystems |
| Frequency Modulated PLL (FMPLL) | Reduces electromagnetic interference (EMI) by spreading spectral energy over ±2% bandwidth without sacrificing timing accuracy |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time management of fuel injection timing, spark advance, air-fuel ratio, and knock detection using analog sensor inputs and high-resolution PWM outputs. IC Role / Device Role / Timing Role: Primary controller executing closed-loop combustion control algorithms with sub-microsecond I/O response via eTPU2 and eMIOS. Use Value: Deterministic 200 MHz execution and 64-channel eTPU2 enable precise synchronization of 8-cylinder direct-injection sequences with <1 µs jitter. |
Use Scenario: Coordination of clutch engagement, gear shifting, torque converter lockup, and hydraulic pressure control in automatic transmissions. IC Role / Device Role / Timing Role: Central timing and actuator driver managing solenoid PWM, position feedback decoding, and CAN-based communication with ECU and body control modules. Use Value: Dual eTPU2 units provide independent real-time processing for both input shaft (encoder) and output shaft (speed/torque) signal conditioning simultaneously. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
Use Scenario: Sensor fusion of torque, motor current, and steering angle to deliver assist torque while maintaining fail-safe redundancy. IC Role / Device Role / Timing Role: Safety-critical controller implementing ASIL-C software partitioning, with eQADC for multi-sensor monitoring and FlexCAN for diagnostic messaging. Use Value: 3 MB flash and ECC-protected SRAM support dual-core lockstep or split-application firmware with runtime self-test coverage. |
Use Scenario: ABS/EBD and electronic stability control requiring synchronized wheel speed acquisition, valve actuation, and yaw rate correlation. IC Role / Device Role / Timing Role: High-integrity timing controller capturing 4× wheel speed signals via eTPU2 and driving solenoid PWMs via eMIOS with hardware dead-time insertion. Use Value: Crossbar-switch architecture allows concurrent eQADC sampling, eTPU2 timestamping, and CAN message transmission without bus contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5674FK0MVR3 | 4 MB flash, 256 KB SRAM, 264 MHz max frequency, includes EBI interface (not present in SPC5673FF3MVR2R) | Targeted at higher-complexity ECUs requiring external calibration memory or bootloader expansion via EBI | Select when >3 MB flash or external memory interface is required; otherwise SPC5673FF3MVR2R offers optimal cost/performance for mid-tier powertrain control |
| SPC5673FK0MVR2 | Identical package, speed, temperature grade, and memory size; differs only in RoHS status (Pb-free vs SnPb in SPC5673FF3MVR2R) | No functional difference; selection driven by assembly process requirements (lead-free reflow vs SnPb wave solder) | Choose SPC5673FF3MVR2R for SnPb-compatible manufacturing; use SPC5673FK0MVR2 for fully RoHS-compliant production |
Compared with SPC5673FF3MVR2R, SPC5674FK0MVR3 delivers higher memory capacity and clock speed at the cost of increased power and package complexity, while SPC5673FK0MVR2 is a functionally identical Pb-free variant-making the former suitable for scaling up feature-rich designs and the latter ideal for RoHS-aligned production without architectural change.
Availability
SPC5673FF3MVR2R is available at Aetrix Electronics and suitable for engine control units (ECUs), transmission control modules (TCMs), and electric power steering (EPS) systems requiring stable component supply, long-term automotive lifecycle support, and ASIL-B capable silicon.
Supply support for SPC5673FF3MVR2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in safety-critical microcontrollers and radar processing.
The SPC5673FF3MVR2R belongs to NXP's SPC567xF family of Power Architecture® microcontrollers designed specifically for automotive powertrain and chassis control applications demanding real-time determinism, functional safety, and robust EMC performance.
FAQ
What is the maximum operating frequency of the SPC5673FF3MVR2R?
The SPC5673FF3MVR2R has a nominal maximum operating frequency of 200 MHz, with its FMPLL supporting frequency modulation up to ±2% for EMI reduction. This specification is validated across the full –40 °C to +125 °C automotive temperature range and applies to the core, eTPU2, and eMIOS subsystems as confirmed in the MPC5674F/MPC5673F datasheet Rev. 11 Section 4.11.1.
Does the SPC5673FF3MVR2R include an external bus interface (EBI)?
No, the SPC5673FF3MVR2R does not include an external bus interface. Per Table 2 of the MPC5674F datasheet Rev. 11, EBI is only available on 516-ball TEPBGA packages (e.g., SPC5674FK0MVY3), and the SPC5673FF3MVR2R uses a 416-ball TEPBGA package without EBI functionality.
How much SRAM does the SPC5673FF3MVR2R provide, and what is its standby capability?
The SPC5673FF3MVR2R provides 192 KB of on-chip general-purpose SRAM, including 32 KB designated as standby RAM. This standby RAM retains data during low-power stop modes powered solely by battery voltage, enabling fast wake-up and state preservation for applications like key-off diagnostics or EPS position retention.
What is the flash memory size and endurance specification for the SPC5673FF3MVR2R?
The SPC5673FF3MVR2R integrates 3 MB of on-chip C90 flash memory. It supports read-while-program and read-while-erase operations, and its block architecture enables EEPROM emulation with guaranteed endurance of 100,000 write/erase cycles per block, as specified in Section 4.10 of the MPC5674F datasheet Rev. 11.
Which development interface standards does the SPC5673FF3MVR2R support?
The SPC5673FF3MVR2R supports two industry-standard development interfaces: Nexus Class III per IEEE-ISTO 5001-2003/2008 for real-time trace and debug, and JTAG (IEEE 1149.1) for boundary-scan testing and programming. Both interfaces are implemented in hardware and documented in Sections 2.1 and 4.12.3–4.12.4 of the datasheet.
SPC5673FF3MVR2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5673FF3MVR2R FAQ
1.How can I place an order for SPC5673FF3MVR2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5673FF3MVR2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5673FF3MVR2R reliable?
The price and inventory of SPC5673FF3MVR2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5673FF3MVR2R is usually 5 days.
3.What payment methods are accepted for SPC5673FF3MVR2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5673FF3MVR2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5673FF3MVR2R?
SPC5673FF3MVR2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5673FF3MVR2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5673FF3MVR2R?
For technical support, including SPC5673FF3MVR2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5673FF3MVR2R requirements.
6.How does Aetrix verify that SPC5673FF3MVR2R is sourced from the original manufacturer or authorized distributors?
All SPC5673FF3MVR2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5673FF3MVR2R meets industry standards.
7.What is the process for return or replacement of SPC5673FF3MVR2R?
All SPC5673FF3MVR2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5673FF3MVR2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5673FF3MVR2R part is unused and in its original packaging.
Return procedure for SPC5673FF3MVR2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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