NXP Semiconductors SPC5673FK0MVR2
- Part No.:
- SPC5673FK0MVR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5673FK0MVR2.pdf
- Description:
- IC MCU 32BIT 3MB FLASH 416PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,380
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5673FK0MVR2 from NXP Semiconductors is a 32-bit Power Architecture® microcontroller featuring the e200z7 dual-issue CPU core, 3 MB on-chip flash, 192 KB SRAM (including 32 KB standby RAM), 22-channel eMIOS, and dual eTPU2 modules totaling 47 time-processing channels. It operates at 200 MHz nominal frequency, supports -40 °C to +125 °C ambient temperature, and targets automotive powertrain and chassis control applications.
For engineers reviewing the SPC5673FK0MVR2 datasheet, SPC5673FK0MVR2 pinout, SPC5673FK0MVR2 application, or SPC5673FK0MVR2 equivalent, key selection criteria include its 416-ball TEPBGA package, absence of External Bus Interface (EBI), FlexCAN/FlexRay connectivity, and qualification for automotive flow (S-grade).
Technical Context
The SPC5673FK0MVR2 implements a dual-issue e200z7 core compliant with Power Architecture® embedded category, integrating VLE for code density reduction and SPE2 for DSP and single-precision floating-point operations. Its memory subsystem includes 3 MB flash supporting read-while-program/erase and EEPROM emulation, plus 192 KB SRAM with 32 KB dedicated to low-power standby operation.
Peripherals are organized via a crossbar switch enabling concurrent access by multiple bus masters. It integrates two eTPU2 units (47 total channels), 22-channel eMIOS, four FlexCAN controllers, dual-channel FlexRay, four DSPI modules, three eSCI interfaces, and four eQADC modules - two with 24 channels each - all operating under system-level error correction (ECSM) and boot assist (BAM) support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 extensions |
| Flash Memory | 3 MB on-chip flash with read-during-program/erase and EEPROM emulation capability |
| SRAM | 192 KB general-purpose SRAM, including 32 KB battery-backed standby RAM |
| Operating Frequency | 200 MHz nominal system clock (200 MHz max, no frequency modulation) |
| Temperature Range | -40 °C to +125 °C ambient, qualified for automotive applications (S-grade) |
| Package | 416-ball TEPBGA, 23 mm × 23 mm, Pb-free, no EBI interface |
| eTPU2 Channels | 47 total enhanced time-processing unit channels (eTPU_A: 26 ch, eTPU_B: 21 ch, no TCRCLK on B) |
Pinout & Package
SPC5673FK0MVR2 uses a 416-ball TEPBGA package (23 mm × 23 mm, Pb-free), as confirmed in Table 1 of the MPC5674F Data Sheet Rev. 11. Pin assignments follow the 416-ball layout shown in Figures 6–10, with primary functions including analog inputs (ANA0–ANA39, ANB0–ANB23), FlexCAN/FlexRay transceivers (FR_A_, FR_B_), eMIOS channels (EMIOS0–EMIOS31), eTPU signals (ETPUA0–ETPUA31, ETPUB0–ETPUB31), and debug interfaces (JTAG, Nexus).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Core power supply / ground | Dedicated power/ground balls distributed across package for noise suppression and thermal management |
| ANA0–ANA39, ANB0–ANB23 | Analog input channels | Supports up to 64-channel eQADC acquisition; grouped into A/B banks with independent reference (VDDA_A0/VDDA_B0, REF–) |
| FR_A_TX / FR_A_RX / FR_B_TX / FR_B_RX | FlexRay differential transceiver I/O | Enables deterministic, fault-tolerant communication for safety-critical chassis systems |
| EMIOS0–EMIOS31 | Enhanced modular I/O system pins | Configurable for PWM, modulus counting, or edge-triggered capture - critical for motor timing and valve control |
| ETPUA0–ETPUA31 / ETPUB0–ETPUB31 | eTPU2 time-processing unit I/O | Hardware-accelerated timing generation/capture; eTPU_A provides full 32-channel support, eTPU_B offers 21 channels without TCRCLK |
| TMS / TCK / TDI / TDO / TRST | JTAG boundary-scan interface | IEEE 1149.1-compliant test and debug access for production testing and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Boot Assist Module (BAM) | Enables serial bootload via CAN or SCI, eliminating need for external programming hardware during field updates |
| Error Correction Status Module (ECSM) | Provides real-time detection and reporting of memory errors in flash and SRAM, supporting ASIL-B compliance |
| Crossbar Switch Architecture | Allows simultaneous access to flash, SRAM, and peripherals by CPU, eDMA, and eTPU - reducing bus contention in high-throughput control loops |
| Variable Length Encoding (VLE) | Reduces firmware footprint by up to 30% vs. pure 32-bit encoding, lowering flash cost and improving cache efficiency |
| Signal Processing Engine 2 (SPE2) | Accelerates fixed- and floating-point math (e.g., PID, FFT) without burdening main CPU - essential for real-time engine modeling |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing closed-loop control algorithms with sub-microsecond timer resolution via eTPU2 and eMIOS. Use Value: 47 eTPU2 channels and 22 eMIOS channels enable concurrent management of 16+ injectors, 8+ ignition coils, and 4+ cam/crank sensors. |
Use Scenario: Clutch actuation timing, gear shift scheduling, and torque converter lock-up control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-aware controller interfacing with hydraulic solenoids, position sensors, and CAN networks using FlexCAN and eQADC. Use Value: Dual FlexRay channels provide redundant, deterministic communication for fail-operational transmission coordination. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
|
Use Scenario: Motor current regulation, torque feedback processing, and assist map interpolation in column- or rack-mounted EPS systems. IC Role / Device Role / Timing Role: High-speed motor control processor leveraging SPE2 for fast vector math and eMIOS for precise PWM generation. Use Value: 200 MHz e200z7 core with 16 KB I/D-cache ensures <5 µs interrupt latency for torque loop execution. |
Use Scenario: ABS/ESC pressure modulation, wheel speed monitoring, and brake-by-wire actuation in integrated braking systems. IC Role / Device Role / Timing Role: ASIL-D-capable controller using ECSM, lockstep peripherals, and dual FlexCAN for redundancy-critical safety functions. Use Value: 3 MB flash accommodates dual-application images and safety monitor firmware, meeting ISO 26262 tool qualification requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5673FK0MVV2 | 324-ball TEPBGA, SnPb finish, same 200 MHz speed and 3 MB/192 KB memory | Limited pin count reduces peripheral routing flexibility; no EBI; lower thermal dissipation capacity | Select when board space or legacy assembly process requires smaller package and SnPb solder compatibility |
| SPC5674FK0MVR3 | 416-ball TEPBGA, 264 MHz nominal, 4 MB flash, 256 KB SRAM, adds EBI support | Higher performance and memory enable complex middleware stacks (AUTOSAR OS, diagnostics); EBI allows external calibration memory | Choose for next-gen ECUs requiring higher compute headroom, extended flash for OTA updates, or external memory expansion |
Compared with SPC5673FK0MVR2, SPC5673FK0MVV2 trades package size and finish for identical functional capability, while SPC5674FK0MVR3 delivers measurable uplift in clock speed, memory, and peripheral breadth - justifying migration where algorithm complexity or future-proofing demands exceed current constraints.
Availability
SPC5673FK0MVR2 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake control applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.
Supply support for SPC5673FK0MVR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and ASIL-certified microcontrollers.
The SPC5673FK0MVR2 belongs to NXP's SPC567xF family - designed specifically for high-integrity automotive powertrain and chassis control, emphasizing real-time determinism, safety compliance (ISO 26262), and robust peripheral integration.
FAQ
What is the maximum operating frequency of the SPC5673FK0MVR2?
The SPC5673FK0MVR2 has a nominal operating frequency of 200 MHz and a maximum frequency of 200 MHz - it does not support frequency modulation (FM). This is confirmed in Table 1 of the MPC5674F Data Sheet Rev. 11, where SPC5673FK0MVR2 is explicitly listed with "200" under both Nominal and Max (fMAX) columns.
Does the SPC5673FK0MVR2 include an External Bus Interface (EBI)?
No, the SPC5673FK0MVR2 does not include an External Bus Interface. Per Table 2 ("MPC567xF Family Differences") in the MPC5674F Data Sheet Rev. 11, EBI is only available on 516-ball packages (both MPC5674F and MPC5673F variants), and SPC5673FK0MVR2 uses the 416-ball TEPBGA package with "No" EBI support.
How much flash and SRAM does the SPC5673FK0MVR2 have?
The SPC5673FK0MVR2 integrates 3 MB of on-chip flash memory and 192 KB of general-purpose SRAM, including 32 KB of standby RAM. These values are specified in Table 2 of the MPC5674F Data Sheet Rev. 11, which differentiates MPC5673F (3 MB flash, 192 KB SRAM) from MPC5674F (4 MB flash, 256 KB SRAM).
What is the qualification grade of the SPC5673FK0MVR2?
The SPC5673FK0MVR2 is fully specification-qualified for automotive applications (S-grade), as indicated by the "S" in its part number decoding per Figure 1 of the MPC5674F Data Sheet Rev. 11. It operates across -40 °C to +125 °C and meets AEC-Q100 stress test requirements for automotive use.
Which eTPU2 configuration does the SPC5673FK0MVR2 support?
The SPC5673FK0MVR2 supports dual eTPU2 modules totaling 47 channels: eTPU_A with 32 channels and eTPU_B with 21 channels. As noted in Table 2, eTPU_B lacks TCRCLK support - a hardware limitation confirmed in the "MPC567xF Family Differences" section of the MPC5674F Data Sheet Rev. 11.
SPC5673FK0MVR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5673FK0MVR2 FAQ
1.How can I place an order for SPC5673FK0MVR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5673FK0MVR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5673FK0MVR2 reliable?
The price and inventory of SPC5673FK0MVR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5673FK0MVR2 is usually 5 days.
3.What payment methods are accepted for SPC5673FK0MVR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5673FK0MVR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5673FK0MVR2?
SPC5673FK0MVR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5673FK0MVR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5673FK0MVR2?
For technical support, including SPC5673FK0MVR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5673FK0MVR2 requirements.
6.How does Aetrix verify that SPC5673FK0MVR2 is sourced from the original manufacturer or authorized distributors?
All SPC5673FK0MVR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5673FK0MVR2 meets industry standards.
7.What is the process for return or replacement of SPC5673FK0MVR2?
All SPC5673FK0MVR2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5673FK0MVR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5673FK0MVR2 part is unused and in its original packaging.
Return procedure for SPC5673FK0MVR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5673FK0MVR2 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

