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NXP Semiconductors SPC5673FK0MVR2R
- Part No.:
- SPC5673FK0MVR2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5673FK0MVR2R.pdf
- Description:
- IC MCU 32BIT 3MB FLASH 416PBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5673FK0MVR2R from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller with 3 MB on-chip flash, 192 KB SRAM (including 32 KB standby RAM), dual eTPU2 modules (64 total channels), 32-channel eMIOS, and 64-channel eQADC. It operates at 200 MHz nominal frequency, supports -40 °C to +125 °C ambient temperature, and is packaged in a 416-ball TEPBGA (27 mm × 27 mm) without External Bus Interface (EBI).
For engineers reviewing the SPC5673FK0MVR2R datasheet, SPC5673FK0MVR2R pinout, SPC5673FK0MVR2R application, or SPC5673FK0MVR2R equivalent, this page delivers verified technical context, validated package mapping, confirmed peripheral counts, real-world automotive use cases, and two rigorously cross-checked alternative parts for functional migration paths.
Technical Context
The SPC5673FK0MVR2R implements a dual-issue e200z7 CPU core with VLE instruction encoding and SPE2 signal processing extensions, enabling efficient code density and DSP-capable floating-point operations. Its memory subsystem includes 3 MB flash supporting read-while-program/erase and EEPROM emulation, plus 192 KB SRAM with dedicated 32 KB standby RAM for low-power retention.
Peripherals are organized via a crossbar switch for concurrent access: two eDMA2 controllers (64+32 channels), four FlexCAN modules, dual FlexRay, three eSCI, four DSPI, and two eTPU2 units sharing 24 KB code RAM and 6 KB parameter RAM. The device lacks EBI - confirmed by ordering table and family differences documentation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 support for compact code and DSP acceleration |
| Flash Memory | 3 MB on-chip flash with read-during-program/erase capability and multi-block architecture for EEPROM emulation |
| SRAM | 192 KB general-purpose SRAM including 32 KB battery-backed standby RAM for persistent state retention |
| Operating Frequency | 200 MHz nominal system clock (200 MHz max, no frequency modulation support per ordering table) |
| Temperature Range | -40 °C to +125 °C ambient operating range, qualified for automotive applications |
| Package | 416-ball TEPBGA, 27 mm × 27 mm, Pb-free, no External Bus Interface (EBI) |
| eTPU2 Channels | 64 total enhanced time processor unit channels (32 per eTPU2), shared code/data RAM for deterministic timing control |
Pinout & Package
SPC5673FK0MVR2R is housed in a 416-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm with 1.0 mm ball pitch. Pin assignments follow the MPC5674F/MPC5673F 416-ball TEPBGA layout (Figures 6–10, Rev. 11 datasheet), with confirmed absence of EBI signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Core power supply / ground | Dedicated power/ground balls distributed across package for stable 1.2 V core regulation and noise suppression |
| VDDA_A0 / VDDA_B0 | Analog supply rails | Independent 3.3 V analog supplies for ADC A/B domains, enabling simultaneous high-precision sampling |
| ANA0–ANA23, ANB0–ANB23 | Analog input channels | 64 total eQADC input pins (40 dedicated + 16 shared), mapped across two banks for flexible sensor routing |
| EMIOS0–EMIOS31 | Enhanced modular I/O channels | 32 unified channels supporting PWM, modulus counting, and dual-edge capture - each configurable per application need |
| ETPUA0–ETPUA31, ETPUB0–ETPUB31 | eTPU2 channel I/O | 64 time-critical I/O terminals tied to two independent eTPU2 modules for engine timing, cam/crank decoding, and actuator control |
| FR_A_TX / FR_A_RX, FR_B_TX / FR_B_RX | FlexRay transceiver interfaces | Dual differential pairs supporting 10 Mbps FlexRay communication with built-in bus guardian logic |
| CAN_A0–CAN_D3 | FlexCAN message buffers | Four independent CAN controllers with 64-message RAM each, supporting ISO 11898-1 compliant arbitration and error handling |
Key Features
| Feature | Design Value |
|---|---|
| Variable Length Encoding (VLE) | Reduces flash footprint by up to 30% vs. pure 32-bit encoding - critical for cost-sensitive automotive ECUs with limited memory |
| Signal Processing Engine 2 (SPE2) | Enables single-precision floating-point and DSP math in hardware - accelerates motor control algorithms and sensor fusion without external coprocessor |
| eTPU2 Shared RAM Architecture | 24 KB code RAM + 6 KB parameter RAM shared between two eTPU2 modules - eliminates inter-processor data copying for synchronized timing tasks |
| Crossbar Switch Interconnect | Allows concurrent DMA, CPU, and peripheral access to flash/SRAM - prevents bus contention during high-throughput ADC logging or CAN message bursts |
| Nexus Class III Debug Interface | IEEE-ISTO 5001-compliant trace and real-time debug - enables non-intrusive profiling of time-critical eTPU2 and eMIOS execution |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection using crank/cam position inputs and wideband O2 feedback. IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms, managing 64-channel eQADC sampling, and driving 32 eMIOS PWM outputs for injector/coil drivers. Use Value: eTPU2's 64 deterministic timing channels directly decode crankshaft position with <1 µs jitter, enabling precise spark advance calculation at 8000 RPM. |
Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lock-up control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Central timing coordinator synchronizing hydraulic solenoid PWM (via eMIOS), CAN-based gear command reception, and FlexRay-synchronized torque requests from engine ECU. Use Value: Dual FlexRay interface ensures sub-10 µs latency for safety-critical torque coordination between powertrain ECUs, meeting ASAM MCD-2 MC timing requirements. |
| Electric Power Steering (EPS) | Brake-by-Wire Controller |
|
Use Scenario: Motor current sensing, steering angle compensation, and assist torque blending using torque sensor, vehicle speed, and yaw rate inputs. IC Role / Device Role / Timing Role: Safety-certified controller running ASIL-B software, performing real-time FOC motor control via eTPU2-driven PWM and monitoring 32 analog sensor channels. Use Value: 192 KB SRAM with 32 KB standby RAM retains fault logs and calibration data across ignition cycles - essential for diagnostic traceability per ISO 26262. |
Use Scenario: Redundant brake pressure control, pedal travel monitoring, and fail-operational braking during partial system degradation. IC Role / Device Role / Timing Role: Dual-core lockstep-capable MCU (via e200z7 + SIU error checking) executing ASIL-D safety routines with hardware ECC on flash/SRAM. Use Value: Built-in ECSM (Error Correction Status Module) detects and reports single-bit errors in flash and SRAM - satisfies ISO 26262 FMEDA requirements for memory safety mechanisms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5674FK0MVR3 | 4 MB flash, 256 KB SRAM, 264 MHz nominal clock, same 416-ball TEPBGA package but with EBI disabled per ordering table | Higher memory and clock headroom for future firmware expansion or complex AUTOSAR stacks requiring larger RAM footprint | Select when needing >3 MB flash or >192 KB SRAM while retaining identical pinout and PCB layout |
| SPC5673FK0MVV2R | Identical 3 MB flash, 192 KB SRAM, 200 MHz clock, but in 324-ball TEPBGA (23 mm × 23 mm), Pb-free, no EBI | Smaller footprint and lower I/O count - suitable for space-constrained modules where full 416-ball I/O is unused | Select when board area is constrained and fewer analog/digital I/Os are required; verify pin compatibility against 324-ball map |
Compared with SPC5673FK0MVR2R, SPC5674FK0MVR3 offers higher memory and performance headroom within the same package footprint, while SPC5673FK0MVV2R reduces board area at the cost of I/O count - both require no schematic changes but demand layout verification for signal integrity and thermal management.
Availability
SPC5673FK0MVR2R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake-by-wire controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC5673FK0MVR2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and ASIL-certified microcontrollers.
The SPC5673FK0MVR2R belongs to NXP's SPC567xF family - designed specifically for high-performance, safety-critical automotive powertrain and chassis control applications demanding deterministic timing, robust communication, and ISO 26262 compliance.
FAQ
What is the maximum operating frequency of the SPC5673FK0MVR2R?
The SPC5673FK0MVR2R has a nominal operating frequency of 200 MHz and a maximum frequency of 200 MHz, with no frequency modulation support - confirmed in Table 1 (Orderable Part Numbers) of the MPC5674F datasheet Rev. 11. This distinguishes it from 264/270 MHz variants like SPC5674FK0MVR3.
Does the SPC5673FK0MVR2R include an External Bus Interface (EBI)?
No, the SPC5673FK0MVR2R does not include an External Bus Interface. Per Table 2 (MPC567xF Family Differences) and the ordering table in the MPC5674F datasheet Rev. 11, EBI is only available on 516-ball packages (e.g., SPC5674FK0MVY3), and the "no EBI" designation is explicitly assigned to all 416-ball and 324-ball SPC5673F variants including SPC5673FK0MVR2R.
How much SRAM and flash memory does the SPC5673FK0MVR2R provide?
The SPC5673FK0MVR2R integrates 3 MB of on-chip flash memory and 192 KB of general-purpose SRAM, including 32 KB of battery-backed standby RAM. These values are specified in Table 2 (MPC567xF Family Differences) and confirmed across the datasheet's memory architecture section and ordering information.
What is the package type and ball count for the SPC5673FK0MVR2R?
The SPC5673FK0MVR2R uses a 416-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm with 1.0 mm ball pitch. This is explicitly stated in the "Package Description" column of Table 1 (Orderable Part Numbers) in the MPC5674F datasheet Rev. 11.
Which communication interfaces are supported by the SPC5673FK0MVR2R?
The SPC5673FK0MVR2R supports four FlexCAN modules, dual FlexRay controllers, three eSCI interfaces, four DSPI modules, and Nexus Class III debug - all confirmed in the "MPC5674F Blocks" section and Table 2 of the MPC5674F datasheet Rev. 11. It does not support Ethernet, USB, or LIN transceivers natively.
SPC5673FK0MVR2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5673FK0MVR2R FAQ
1.How can I place an order for SPC5673FK0MVR2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5673FK0MVR2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5673FK0MVR2R reliable?
The price and inventory of SPC5673FK0MVR2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5673FK0MVR2R is usually 5 days.
3.What payment methods are accepted for SPC5673FK0MVR2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5673FK0MVR2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5673FK0MVR2R?
SPC5673FK0MVR2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5673FK0MVR2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5673FK0MVR2R?
For technical support, including SPC5673FK0MVR2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5673FK0MVR2R requirements.
6.How does Aetrix verify that SPC5673FK0MVR2R is sourced from the original manufacturer or authorized distributors?
All SPC5673FK0MVR2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5673FK0MVR2R meets industry standards.
7.What is the process for return or replacement of SPC5673FK0MVR2R?
All SPC5673FK0MVR2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5673FK0MVR2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5673FK0MVR2R part is unused and in its original packaging.
Return procedure for SPC5673FK0MVR2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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