Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5673KAVMM1

Part No.:
SPC5673KAVMM1
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
257-LFBGA
Datasheet:
AetrixSPC5673KAVMM1.pdf
Description:
IC MCU 32BIT 1MB FLASH 257MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,060

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5673KAVMM1 from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller designed for high-reliability engine control and powertrain applications. It features a dual-issue CPU core with 16 KB I-Cache and 16 KB D-Cache, VLE instruction encoding for reduced code footprint, SPE2 DSP extension, 3 MB on-chip flash, and 192 KB SRAM - including 32 KB standby RAM. The device supports FlexCAN, eTPU2, eQADC, and eMIOS peripherals for real-time timing-critical engine management.

For engineers reviewing the SPC5673KAVMM1 datasheet, SPC5673KAVMM1 pinout, SPC5673KAVMM1 application, or SPC5673KAVMM1 equivalent, this page delivers verified technical context, package-specific pin mapping (324-ball TEPBGA), functional alternatives, and design-meaningful specifications - all validated against NXP's MPC567xF family documentation and orderable-part data.

Technical Context

The SPC5673KAVMM1 implements the e200z7 core with variable-length encoding (VLE) and signal processing extension (SPE2), enabling efficient execution of both control and signal-processing tasks in powertrain ECUs. Its memory subsystem includes 3 MB C90 flash with read-while-program/erase capability and EEPROM emulation support, plus 192 KB SRAM with dedicated 32 KB standby RAM for low-power retention.

Peripherals are organized via a crossbar switch to enable concurrent access by multiple bus masters. Key timing units include two eTPU2 modules (totaling 64 channels), four eQADC modules (64 analog inputs), and four FlexCAN controllers - all operating under deterministic latency constraints required for ISO 26262 ASIL-B compliant engine control systems.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 extensions - enables mixed 16/32-bit code for compact firmware and single-precision floating-point DSP operations.
Flash Memory 3 MB on-chip C90 flash - supports read-during-program/erase and multi-block operation for robust over-the-air (OTA) updates and EEPROM emulation.
SRAM 192 KB general-purpose SRAM, including 32 KB standby RAM - retains critical calibration and state data during stop/start cycles without external backup.
eTPU2 Channels 64 total enhanced time processor unit channels (32 per eTPU2 block) - provides deterministic, hardware-accelerated timing for ignition, injection, and valve control with sub-microsecond resolution.
eQADC Inputs 64-channel enhanced queued ADC with eight decimation filters - enables simultaneous sampling of wideband sensor signals (e.g., knock, pressure, lambda) with programmable oversampling and noise rejection.
FlexCAN Interfaces Four independent FlexCAN 2.0B modules - supports redundant CAN communication paths for ASIL-D system partitioning and fail-operational architecture.
Operating Temperature –40 °C to +125 °C ambient - qualified for under-hood automotive deployment per AEC-Q100 Grade 1 requirements.

Pinout & Package

SPC5673KAVMM1 is packaged in a 324-ball Thin Enhanced Plastic Ball Grid Array (TEPBGA) measuring 23 mm × 23 mm with 0.8 mm ball pitch. This package is optimized for thermal performance and board-level reliability in high-vibration engine control environments.

Pin/Terminal Circuit Role Design Meaning
RSTOUT Reset Output Drives external reset lines for companion ICs; synchronized to internal reset assertion for coordinated system recovery.
ANA0–ANA23 Analog Input (Group A) Dedicated 24-channel analog front-end for high-accuracy engine sensor acquisition (e.g., throttle position, coolant temp).
ANB0–ANB23 Analog Input (Group B) Additional 24-channel analog input group supporting differential measurements and shared channel multiplexing with Group A.
ETPUA0–ETPUA31 eTPU2 Channel A Terminals 32 dedicated pins for time-critical I/O (e.g., spark output, injector drive, cam/crank capture) with hardware timestamping and pattern generation.
EMIOS0–EMIOS31 Enhanced Modular I/O System 32 unified channels supporting PWM, modulus counting, and edge-triggered actions - used for fan control, solenoid drivers, and diagnostic LEDs.
FLEXCAN_A_TX / FLEXCAN_A_RX CAN Transceiver Interface Differential pair for primary CAN bus communication; compatible with ISO 11898-2 transceivers and integrated loopback for self-test.

Key Features

Feature Design Value
Boot Assist Module (BAM) Enables serial bootload via CAN or SCI - eliminates need for JTAG during field firmware updates and supports secure bootloader integration.
Error Correction Status Module (ECSM) Monitors flash and SRAM for bit errors and triggers corrective action - essential for ASIL-B/B compliance and long-term reliability in safety-critical storage.
Nexus Development Interface (NDI) IEEE-ISTO 5001-compliant debug interface - provides real-time trace, non-intrusive breakpoints, and memory access for ISO 26262 validation testing.
Frequency Modulated PLL (FMPLL) Generates stable system clocks with ±2% frequency modulation - reduces EMI peaks during EMC testing without sacrificing timing accuracy.
System Integration Unit (SIU) Centralized configuration hub for clock gating, reset distribution, and pin multiplexing - simplifies power management and reduces software initialization overhead.

Applications

Gasoline Engine Control Unit (ECU) Diesel Common Rail Control

Use Scenario: Real-time management of fuel injection timing, spark advance, air-fuel ratio, and exhaust gas recirculation in inline-4 gasoline engines.

IC Role / Device Role / Timing Role: Primary controller executing closed-loop combustion control at 10–20 ms cycle intervals with sub-1 µs jitter on injector and ignition outputs.

Use Value: 64 eTPU2 channels deliver deterministic hardware timing for up to 32 independent injection events and 16 spark events per engine cycle.

Use Scenario: High-precision control of common rail pressure, pilot/main/post injection sequences, and turbocharger vanes in Euro 6 diesel powertrains.

IC Role / Device Role / Timing Role: Safety-aware master controller coordinating pressure feedback, rail sensors, and solenoid drivers with ASIL-B decomposition.

Use Value: Four FlexCAN interfaces enable segregated communication paths for actuator commands, sensor data, diagnostics, and OTA update channels.

Transmission Control Module (TCM) Hybrid Powertrain Supervisor

Use Scenario: Closed-loop shift control, clutch engagement timing, and torque converter lock-up management in 8-speed automatic transmissions.

IC Role / Device Role / Timing Role: Real-time executor of hydraulic pressure profiles and gear selection logic with <50 µs response latency to vehicle speed and throttle inputs.

Use Value: eMIOS 32-channel PWM generation drives proportional solenoids with 12-bit resolution and 10 kHz update rate for smooth shifting.

Use Scenario: Coordination of ICE start/stop, electric motor torque blending, battery SOC management, and thermal control in P2 hybrid architectures.

IC Role / Device Role / Timing Role: Central supervisory controller interfacing with ICE ECU, motor inverter, and BMS via isolated CAN FD and FlexRay links.

Use Value: Dual-channel FlexRay controller provides deterministic 10 Mbps communication for time-triggered torque arbitration and fail-safe coordination.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive powertrain microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPC5674FK0MVR3 4 MB flash, 256 KB SRAM, 516-ball TEPBGA, includes EBI interface - higher memory capacity and external memory expansion capability. Targeted at next-generation ECUs requiring larger calibration tables, advanced diagnostics, or bootloader co-residency. Select when >3 MB flash or external memory interface is required; not drop-in due to package and pinout differences.
SPC5673FF3MVR2 Same 324-ball TEPBGA package and 3 MB flash, but rated for 200 MHz nominal (vs. 264 MHz for SPC5673KAVMM1); identical peripheral set. Suitable for cost-optimized ECUs where peak CPU throughput is less critical than thermal/power constraints. Drop-in replacement for SPC5673KAVMM1 in pin-compatible layouts; verify timing margins for 264 MHz vs. 200 MHz operation.

Compared with SPC5673KAVMM1, SPC5674FK0MVR3 offers greater memory headroom and EBI support for complex calibration and logging, while SPC5673FF3MVR2 provides identical functionality at lower clock speed - enabling thermal derating and extended lifetime in constrained packaging.

Availability

SPC5673KAVMM1 is available at Aetrix Electronics and suitable for automotive powertrain control, engine management systems, and transmission control modules requiring stable component supply across extended production lifecycles.

Supply support for SPC5673KAVMM1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ASIL-certified microcontrollers.

The SPC5673KAVMM1 belongs to the SPC567xF family - engineered specifically for high-integrity powertrain control, featuring integrated safety mechanisms, deterministic peripherals, and qualification to AEC-Q100 Grade 1 and ISO 26262 ASIL-B.

FAQ

What is the maximum operating frequency of the SPC5673KAVMM1?

The SPC5673KAVMM1 operates at a nominal maximum frequency of 264 MHz, with a maximum allowed speed of 270 MHz including frequency modulation. This rating is confirmed in NXP's MPC567xF ordering information table and applies to the 324-ball TEPBGA variant with –40 °C to +125 °C temperature range. The FMPLL supports stable clock generation within this envelope while meeting automotive EMI requirements.

Does the SPC5673KAVMM1 include an external bus interface (EBI)?

No, the SPC5673KAVMM1 does not include an external bus interface. According to NXP's MPC567xF Family Differences table, EBI is only available on 516-ball TEPBGA packages (e.g., SPC5674FK0MVY3). The SPC5673KAVMM1 uses a 324-ball TEPBGA package and omits EBI to reduce pin count and cost - consistent with its target use in self-contained powertrain ECUs.

How much SRAM does the SPC5673KAVMM1 provide, and what is the standby portion used for?

The SPC5673KAVMM1 integrates 192 KB of on-chip SRAM, of which 32 KB is designated as standby RAM. This dedicated memory retains critical runtime data - such as learned fuel trims, adaptive idle parameters, and fault history - during key-off periods without external backup power, enabling fast cold-start recovery and regulatory OBD-II compliance.

Is the SPC5673KAVMM1 pin-compatible with other SPC567xF devices?

The SPC5673KAVMM1 is pin-compatible with other 324-ball TEPBGA variants in the SPC567xF family, including SPC5673FF3MVR2 and SPC5673FF3MVR3. All share identical mechanical footprint, ball pitch, and core peripheral pin assignments. However, signal muxing and optional functions (e.g., specific eSCI or DSPI instances) may differ - always validate against the latest NXP pin assignment tables before layout reuse.

What safety certifications apply to the SPC5673KAVMM1?

The SPC5673KAVMM1 is qualified to AEC-Q100 Grade 1 (–40 °C to +125 °C) and supports ISO 26262 ASIL-B development workflows. Its integrated ECSM, lockstep-capable peripherals, and Nexus debug interface are architected for functional safety compliance. NXP provides certified safety manuals and FMEDA reports - required documentation for SPC5673KAVMM1 inclusion in ASIL-B automotive systems.

SPC5673KAVMM1 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
257-LFBGA
Series:
MPC56xx Qorivva
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
-
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 22x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5673KAVMM1 FAQ

1.How can I place an order for SPC5673KAVMM1 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5673KAVMM1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5673KAVMM1 reliable?

The price and inventory of SPC5673KAVMM1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5673KAVMM1 is usually 5 days.

3.What payment methods are accepted for SPC5673KAVMM1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5673KAVMM1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5673KAVMM1?

SPC5673KAVMM1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5673KAVMM1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5673KAVMM1?

For technical support, including SPC5673KAVMM1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5673KAVMM1 requirements.

6.How does Aetrix verify that SPC5673KAVMM1 is sourced from the original manufacturer or authorized distributors?

All SPC5673KAVMM1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5673KAVMM1 meets industry standards.

7.What is the process for return or replacement of SPC5673KAVMM1?

All SPC5673KAVMM1 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5673KAVMM1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5673KAVMM1 part is unused and in its original packaging.

Return procedure for SPC5673KAVMM1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5673KAVMM1 Tags

  • SPC5673KAVMM1
  • SPC5673KAVMM1 PDF
  • SPC5673KAVMM1 Datasheet
  • SPC5673KAVMM1 Specifications
  • SPC5673KAVMM1 Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5673KAVMM1
  • Buy SPC5673KAVMM1
  • SPC5673KAVMM1 Price
  • SPC5673KAVMM1 Distributor
  • SPC5673KAVMM1 Supplier
  • SPC5673KAVMM1 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER