NXP Semiconductors SPC5673KAVMM1R

Overview

SPC5673KAVMM1R from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller designed for high-reliability powertrain and chassis control. It features a dual-issue CPU core with 16 KB I-Cache/16 KB D-Cache, VLE instruction encoding, SPE2 DSP extension, 3 MB on-chip flash, 192 KB SRAM (including standby RAM), and integrated FlexCAN, eTPU2, eMIOS, and eQADC modules. It operates at 200 MHz nominal frequency across –40 °C to 125 °C.

For engineers reviewing the SPC5673KAVMM1R datasheet, SPC5673KAVMM1R pinout, SPC5673KAVMM1R application, or SPC5673KAVMM1R equivalent, key selection criteria include its 324-ball TEPBGA package, absence of External Bus Interface (EBI), 200 MHz clock capability, automotive AEC-Q100 qualification, and support for real-time motor control, transmission management, and brake-by-wire systems.

Technical Context

The SPC5673KAVMM1R implements a dual-issue e200z7 core compliant with Power Architecture® embedded category, featuring variable-length encoding (VLE) for reduced code footprint and Signal Processing Engine 2 (SPE2) for single-precision floating-point and DSP operations. Its memory subsystem includes 3 MB flash with read-while-program/erase capability and EEPROM emulation, plus 192 KB SRAM with 32 KB in standby mode.

Peripherals are organized via a crossbar switch enabling concurrent access by multiple bus masters. It integrates two eTPU2 units (totaling 47 channels), 22-channel eMIOS, 48-channel eQADC (with decimation filters), four DSPI modules, three eSCI interfaces, four FlexCAN controllers, and a dual-channel FlexRay controller - all optimized for deterministic timing in safety-critical automotive applications.

Key Specifications

Pinout & Package

SPC5673KAVMM1R uses a 324-ball TEPBGA package (23 mm × 23 mm, Pb-free). Pin assignments follow the MPC5673F-specific layout defined in NXP document MPC5674F Rev. 11, Section 3.1. The device lacks EBI signals, distinguishing it from 516-ball variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5673KAVMM1R, SPC5673FF3MVV2 offers identical functionality with SnPb packaging for legacy manufacturing, while SPC5674FK0MVR3 delivers +64 MHz clock, +1 MB flash, and EBI capability - making it suitable for scalable platform designs where future feature growth is anticipated.

Availability

SPC5673KAVMM1R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, brake-by-wire systems, and electric power steering applications requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100-compliant sourcing.

Supply support for SPC5673KAVMM1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in safety-critical microcontrollers and radar processing.

The SPC5673KAVMM1R belongs to NXP's SPC567xF family - engineered specifically for ASIL-B/C automotive powertrain and chassis control, emphasizing real-time determinism, functional safety, and integration of timing-critical peripherals like eTPU2 and FlexRay.

FAQ

What is the maximum operating frequency of the SPC5673KAVMM1R?

The SPC5673KAVMM1R operates at a nominal maximum frequency of 200 MHz, with the FMPLL supporting frequency modulation for EMI reduction. This speed grade is confirmed in NXP's MPC5674F datasheet Rev. 11, Table 1 (Orderable Part Numbers), and applies across the full –40 °C to 125 °C ambient temperature range. The SPC5673KAVMM1R does not support the 264 MHz speed grade found in MPC5674F variants.

Does the SPC5673KAVMM1R include an External Bus Interface (EBI)?

No, the SPC5673KAVMM1R does not include an External Bus Interface. As documented in Table 2 ("MPC567xF Family Differences") of the MPC5674F datasheet Rev. 11, EBI is only available on 516-ball TEPBGA packages (e.g., SPC5674FK0MVY3) and is explicitly excluded from all 324-ball and 416-ball variants, including the SPC5673KAVMM1R. This simplifies PCB layout and reduces pin count for cost-sensitive ECU designs.

How many eTPU2 channels does the SPC5673KAVMM1R support?

The SPC5673KAVMM1R supports 47 eTPU2 channels: 32 on eTPU_A and 15 on eTPU_B (with no TCRCLK input on eTPU_B, per Table 2 of the MPC5674F datasheet Rev. 11). This configuration matches the MPC5673F derivative specification and is distinct from the 64-channel capability of MPC5674F devices. The shared 24 KB code RAM and 6 KB parameter RAM enable coordinated waveform generation across both units.

What is the flash and SRAM capacity of the SPC5673KAVMM1R?

The SPC5673KAVMM1R integrates 3 MB of on-chip C90 flash memory with read-while-program/erase capability and EEPROM emulation support, plus 192 KB of general-purpose SRAM - including 32 KB of battery-backed standby RAM. These values are specified in Table 2 ("MPC567xF Family Differences") of the MPC5674F datasheet Rev. 11 and distinguish the SPC5673F series from the 4 MB flash / 256 KB SRAM of MPC5674F devices.

Which package type and ball count does the SPC5673KAVMM1R use?

The SPC5673KAVMM1R uses a 324-ball TEPBGA package measuring 23 mm × 23 mm with Pb-free finish, as confirmed in Table 1 ("Orderable Part Numbers") and Section 5.1 ("324-Pin Package") of the MPC5674F datasheet Rev. 11. The "VZ" package identifier in the part number decoding (per Figure 1) maps to 324-ball Pb-free, and the "R" suffix indicates tape-and-reel packaging.