NXP Semiconductors SPC5674FAMVR3R

Overview

SPC5674FAMVR3R from NXP Semiconductors is a 32-bit Power Architecture® e200z7 dual-issue microcontroller with 200 MHz core frequency, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby RAM), and integrated FlexCAN, FlexRay, eTPU2, and eQADC modules - deployed in automotive powertrain and chassis control units requiring ASIL-B functional safety compliance.

For engineers reviewing the SPC5674FAMVR3R datasheet, SPC5674FAMVR3R pinout, SPC5674FAMVR3R application, or SPC5674FAMVR3R equivalent, key selection criteria include its 416-ball TEPBGA package, 200 MHz nominal operation without EBI support, -40 °C to 125 °C extended temperature range, and qualification for automotive flow (S-grade).

Technical Context

The SPC5674FAMVR3R implements a dual-issue e200z7 CPU core compliant with Power Architecture® embedded category, featuring 16 KB I-Cache and 16 KB D-Cache, VLE instruction encoding for code density reduction, and SPE2 extension for DSP and single-precision floating-point operations. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters.

It integrates two eTPU2 units (64 total channels), four eQADC modules supporting 64 analog inputs with decimation filters, four DSPI interfaces, three eSCI ports, four FlexCAN controllers, and a dual-channel FlexRay controller - all coordinated via an INTC interrupt controller and FMPLL clock generation with frequency modulation capability.

Key Specifications

Pinout & Package

SPC5674FAMVR3R uses a 416-ball TEPBGA package (23 mm × 23 mm) with 1.0 mm ball pitch. Pin functions are multiplexed across dedicated I/O banks supporting analog inputs (ANA0–ANA39, ANB0–ANB23), FlexCAN/FlexRay transceivers, eMIOS channels, eTPU2 timers, DSPI/SCK/SIN/SOUT signals, and power domains (VDD, VDDA, VDDEH, VSS, VSSA).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5674FAMVR3R, SPC5674FK0MVR3 offers identical packaging and performance but older silicon revision, while SPC5674FF3MVR3 matches all electrical and thermal specs with differentiated flash memory configuration - both serve as functionally aligned alternatives for ECU/TCM designs without EBI dependency.

Availability

SPC5674FAMVR3R is available at Aetrix Electronics and suitable for automotive powertrain control, chassis electronics, and electric vehicle subsystems requiring stable component supply, long-term lifecycle assurance, and ASIL-B-compliant microcontrollers.

Supply support for SPC5674FAMVR3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and real-time embedded processing.

The MPC5674F product line targets high-performance automotive control applications - specifically engine, transmission, steering, and braking systems - where deterministic timing, multi-protocol communication, and ASIL-B compliance are mandatory.

FAQ

What is the maximum operating frequency of the SPC5674FAMVR3R?

The SPC5674FAMVR3R operates at a nominal maximum frequency of 200 MHz with no frequency modulation support (fMAX = 200 MHz). This is confirmed in Table 1 of the MPC5674F Data Sheet Rev. 11, where SPC5674FAMVR3R is explicitly listed under the 200 MHz speed grade. The device does not support the 264 MHz nominal / 270 MHz FMPLL mode found in higher-grade variants like SPC5674FK0MVY3R.

Does the SPC5674FAMVR3R include an External Bus Interface (EBI)?

No, the SPC5674FAMVR3R does not include an External Bus Interface. Per Table 2 (MPC567xF Family Differences) in the MPC5674F Data Sheet Rev. 11, EBI is only available on 516-ball TEPBGA packages (e.g., SPC5674FK0MVY3), and the SPC5674FAMVR3R's 416-ball TEPBGA package is explicitly marked "no EBI". This aligns with its orderable part number suffix "VR", which denotes the 416-ball variant without EBI.

What is the package type and ball count for the SPC5674FAMVR3R?

The SPC5674FAMVR3R uses a 416-ball TEPBGA package measuring 23 mm × 23 mm with 1.0 mm ball pitch. This is confirmed in Section 3.2 ("416-ball TEPBGA Pin Assignments") of the MPC5674F Data Sheet Rev. 11 and in Table 1's "Package Description" column, which states "416 PBGA, no EBI, Pb-free" for this exact part number.

Is the SPC5674FAMVR3R qualified for automotive applications?

Yes, the SPC5674FAMVR3R is fully qualified for automotive applications under NXP's automotive flow (S-grade), with operating temperature range of -40 °C to +125 °C. Its qualification status is indicated by the "S" in the part number decoding (per Figure 1), and Table 1 confirms "Operating Temperature Min (TL) = –40 °C" and "Max (TH) = 125 °C" - meeting AEC-Q100 Grade 1 requirements.

How much on-chip flash and SRAM does the SPC5674FAMVR3R provide?

The SPC5674FAMVR3R integrates 4 MB of on-chip C90 flash memory and 256 KB of general-purpose SRAM, including 32 KB of battery-backed standby RAM. These values are specified in the "Dual issue, 32-bit CPU core complex" bullet and "256 KB on-chip general-purpose SRAM" section of the MPC5674F Data Sheet Rev. 11, and apply uniformly across all MPC5674F variants regardless of package or speed grade.