My Inquiry
My Account
NXP Semiconductors SPC5674FF3MVR3
- Part No.:
- SPC5674FF3MVR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5674FF3MVR3.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 416PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:110
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5674FF3MVR3 from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller with 200 MHz nominal core frequency, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby RAM), dual eTPU2 units (64 total channels), and FlexCAN/FlexRay/DSPI/eQADC peripherals - deployed in engine control units and transmission control modules.
For engineers reviewing the SPC5674FF3MVR3 datasheet, SPC5674FF3MVR3 pinout, SPC5674FF3MVR3 application, or SPC5674FF3MVR3 equivalent, key selection considerations include its 416-ball TEPBGA package, -40°C to +125°C operating range, EBI omission, and qualification for automotive AEC-Q100 Grade 1 applications.
Technical Context
The SPC5674FF3MVR3 integrates a dual-issue e200z7 CPU with VLE and SPE2 extensions for code density and DSP capability, coupled with a crossbar switch enabling concurrent access to flash, SRAM, and peripherals by multiple bus masters. Its FMPLL provides precise clock generation with frequency modulation support.
It features two independent eDMA2 controllers (64+32 channels), an INTC interrupt controller, SIU system integration unit, ECSM error correction module, and BAM boot assist supporting CAN/SCI serial bootload - all configured for real-time deterministic operation in safety-critical powertrain systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 instruction sets |
| Max Core Frequency | 200 MHz nominal (200 MHz max without FM; no 264/270 MHz capability) |
| Flash Memory | 4 MB on-chip C90 flash with read-while-program/erase and EEPROM emulation support |
| SRAM | 256 KB general-purpose SRAM, including 32 KB low-power standby RAM |
| eTPU2 Channels | 64 total time-processing channels across two eTPU2 units sharing 24 KB code + 6 KB data RAM |
| Analog Inputs | 64-channel eQADC with 8 decimation filters and one absolute reference channel |
| Communication Interfaces | 4× FlexCAN, 1× Dual-channel FlexRay, 4× DSPI, 3× eSCI, 32-channel eMIOS |
| Package & Temp | 416-ball TEPBGA (23 mm × 23 mm), Pb-free, qualified for -40°C to +125°C automotive operation |
Pinout & Package
SPC5674FF3MVR3 uses a 416-ball TEPBGA package (23 mm × 23 mm, 0.8 mm ball pitch) with thermal pad. Pin functions are defined per Figure 6–10 of MPC5674F Rev. 11 datasheet, including dedicated analog inputs (ANA0–ANA39, ANB0–ANB23), eTPU/EMIOS I/Os, FlexCAN/FlexRay transceiver pins, DSPI/eSCI signals, and power/ground balls distributed across the array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Core power / ground | Multiple dedicated 1.2 V core supply and return balls ensure stable low-noise operation for e200z7 core |
| VDDA_A0 / VDDA_B0 | Analog domain supply | Separate 3.3 V analog supplies for ADC A/B domains enable high-precision signal acquisition |
| ANA0–ANA39, ANB0–ANB23 | Analog input channels | 64 total ADC input pins mapped to eQADC_A/B modules with configurable gain and filtering |
| ETPUA0–ETPUA31, ETPUB0–ETPUB31 | eTPU2 channel I/O | 64 pins assigned to two eTPU2 units for high-resolution timing capture/generation (e.g., ignition, injection) |
| PCSA0–PCSA5, PCSB0–PCSB5, PCSC0–PCSC5 | FlexCAN physical layer | Dedicated differential CANH/CANL pins per module; supports ISO 11898-1 compliant communication |
| FR_A_TX / FR_A_RX / FR_B_TX / FR_B_RX | FlexRay transceiver I/O | Two independent FlexRay channels with separate TX/RX pairs for deterministic time-triggered networking |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces flash footprint up to 30% vs. pure 32-bit encoding - critical for memory-constrained ECU designs |
| SPE2 signal processing extension | Enables single-precision floating-point and DSP operations directly in hardware, accelerating motor control algorithms |
| eTPU2 shared RAM architecture | 24 KB code + 6 KB parameter RAM shared between two 32-channel eTPU2 units simplifies synchronization of timing-critical tasks |
| Read-while-program/erase flash | Allows background firmware updates without halting real-time control execution - essential for OTA-capable ECUs |
| Nexus Class III debug interface | IEEE-ISTO 5001-2003/2008 compliant trace and debug support enables full visibility into runtime behavior for ASIL-B/D validation |
| AEC-Q100 Grade 1 qualification | Validated for continuous operation at +125°C ambient - meets requirements for under-hood engine control applications |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time management of fuel injection timing, spark advance, air-fuel ratio, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing closed-loop combustion control algorithms with sub-microsecond timing precision via eTPU2 and eQADC. Use Value: 64-channel eQADC with decimation filters enables simultaneous high-resolution sampling of cylinder pressure, O2, MAP, and throttle position sensors. | Use Scenario: Closed-loop shift control, torque converter clutch management, and hydraulic pressure regulation in automatic transmissions. IC Role / Device Role / Timing Role: Central timing and actuator driver coordinating solenoid PWM, gear position sensing, and CAN-based vehicle network coordination. Use Value: 32-channel eMIOS with modulus counter and double-action PWM supports precise duty-cycle control of up to 32 electrohydraulic valves. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
Use Scenario: Torque assist calculation, motor current control, and fault-tolerant steering angle monitoring in steer-by-wire and column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-oriented controller implementing ASIL-C software partitioning with lockstep-capable peripherals and ECC-protected memory. Use Value: Dual eTPU2 units provide independent timing paths for motor phase commutation and sensor sampling - enabling redundant control loops. | Use Scenario: ABS, ESC, and electronic parking brake actuation using wheel speed, yaw rate, and hydraulic pressure feedback. IC Role / Device Role / Timing Role: Deterministic real-time processor managing high-speed CAN/FlexRay messaging, analog sensor fusion, and solenoid driver timing. Use Value: Four FlexCAN modules allow concurrent communication with body, powertrain, chassis, and diagnostic networks without message arbitration bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5674FK0MVR3 | Same 416-ball TEPBGA package and no EBI, but rated for 264 MHz nominal frequency and 270 MHz max with FM | Higher performance headroom for future algorithm scaling; identical peripheral set and pinout | Select when >200 MHz sustained core throughput is required for complex model-based control or multi-sensor fusion |
| SPC5673FF3MVR2 | Same 416-ball TEPBGA, 200 MHz rating, but only 3 MB flash and 192 KB SRAM; no eTPU2 B unit (47 total channels) | Reduced memory and timing resources limit use to simpler powertrain subsystems or cost-sensitive Tier 2 applications | Select when flash/SRAM budget allows reduction and full 64-channel eTPU2 capability is not required |
Compared with SPC5674FF3MVR3, SPC5674FK0MVR3 offers higher clock headroom while maintaining identical packaging and peripheral compatibility, whereas SPC5673FF3MVR2 trades memory capacity and eTPU2 channel count for lower cost - making the former a performance upgrade path and the latter a cost-optimized alternative.
Availability
SPC5674FF3MVR3 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across long automotive production lifecycles.
Supply support for SPC5674FF3MVR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MPC5674F product line delivers high-integrity, ASIL-capable microcontrollers optimized for real-time powertrain and chassis control - combining Power Architecture® performance with automotive-grade reliability and functional safety features.
FAQ
What is the maximum operating frequency of the SPC5674FF3MVR3?
The SPC5674FF3MVR3 has a nominal maximum core frequency of 200 MHz and a maximum allowed frequency of 200 MHz (no frequency modulation support). It does not support the 264 MHz nominal or 270 MHz max configurations found in higher-grade variants like SPC5674FK0MVR3.
Does the SPC5674FF3MVR3 include an external bus interface (EBI)?
No, the SPC5674FF3MVR3 does not include an external bus interface. Per Table 2 of the MPC5674F datasheet Rev. 11, EBI is only available on 516-ball TEPBGA packages (e.g., SPC5674FK0MVY3), not on the 416-ball variant used by SPC5674FF3MVR3.
What automotive qualification level does the SPC5674FF3MVR3 meet?
The SPC5674FF3MVR3 is fully qualified to AEC-Q100 Grade 1, meaning it is certified for continuous operation from -40°C to +125°C ambient temperature - meeting requirements for under-hood engine and transmission control applications.
How much on-chip flash and SRAM does the SPC5674FF3MVR3 provide?
The SPC5674FF3MVR3 integrates 4 MB of on-chip C90 flash memory with read-while-program/erase capability and 256 KB of general-purpose SRAM, including 32 KB of dedicated standby RAM for low-power retention during sleep modes.
Which communication interfaces are supported by the SPC5674FF3MVR3?
The SPC5674FF3MVR3 supports four FlexCAN modules, one dual-channel FlexRay controller, four DSPI modules, three eSCI modules, and a 32-channel eMIOS - providing comprehensive connectivity for automotive networking, sensor interfacing, and actuator control.
SPC5674FF3MVR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 264MHz
- Connectivity:
- CANbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5674FF3MVR3 FAQ
1.How can I place an order for SPC5674FF3MVR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5674FF3MVR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5674FF3MVR3 reliable?
The price and inventory of SPC5674FF3MVR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5674FF3MVR3 is usually 5 days.
3.What payment methods are accepted for SPC5674FF3MVR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5674FF3MVR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5674FF3MVR3?
SPC5674FF3MVR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5674FF3MVR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5674FF3MVR3?
For technical support, including SPC5674FF3MVR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5674FF3MVR3 requirements.
6.How does Aetrix verify that SPC5674FF3MVR3 is sourced from the original manufacturer or authorized distributors?
All SPC5674FF3MVR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5674FF3MVR3 meets industry standards.
7.What is the process for return or replacement of SPC5674FF3MVR3?
All SPC5674FF3MVR3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5674FF3MVR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5674FF3MVR3 part is unused and in its original packaging.
Return procedure for SPC5674FF3MVR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5674FF3MVR3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
