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NXP Semiconductors SPC5674FF3MVV3
- Part No.:
- SPC5674FF3MVV3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 516-BBGA
- Datasheet:
-
SPC5674FF3MVV3.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 516FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,069
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Product details
Overview
SPC5674FF3MVV3 from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller with dual-issue CPU, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby), 64-channel eDMA, dual eTPU2 (64 total channels), 4 FlexCAN modules, and FlexRay controller - deployed in engine control units and transmission control modules requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC5674FF3MVV3 datasheet, SPC5674FF3MVV3 pinout, SPC5674FF3MVV3 application, or SPC5674FF3MVV3 equivalent, key selection criteria include its 516-ball TEPBGA package with EBI support, 200 MHz nominal/264 MHz max system clock, -40°C to +125°C operating range, and integrated Nexus debug interface per IEEE-ISTO 5001-2008.
Technical Context
The SPC5674FF3MVV3 implements a dual-issue e200z7 core compliant with Power Architecture® embedded category, featuring VLE instruction encoding for code density reduction and SPE2 extension for DSP and single-precision floating-point operations. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including two eDMA controllers (64+32 channels).
It integrates two second-generation eTPU2 units sharing 24 KB code RAM and 6 KB parameter RAM, four eQADC modules supporting 64 analog inputs with decimation filters, and a frequency-modulated PLL (FMPLL) for jitter-tolerant clock generation - all designed for deterministic real-time control in powertrain systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 extensions for compact code and signal processing |
| Flash Memory | 4 MB on-chip C90 flash supporting read-during-program/erase and EEPROM emulation across multiple blocks |
| SRAM | 256 KB general-purpose SRAM, including 32 KB low-leakage standby RAM for battery-backed operation |
| Package | 516-ball TEPBGA (27 mm × 27 mm), SnPb finish, with External Bus Interface (EBI) enabled |
| Operating Speed | 200 MHz nominal system clock, 264 MHz maximum (including ±2% FM modulation) |
| Temperature Range | -40 °C to +125 °C ambient, qualified for automotive AEC-Q100 Grade 1 |
| Peripherals | 4× FlexCAN, 1× Dual-channel FlexRay, 4× DSPI, 3× eSCI, 4× eQADC (64 ch), 32-channel eMIOS, 64-channel eTPU2 |
Pinout & Package
SPC5674FF3MVV3 uses a 516-ball TEPBGA package (27 mm × 27 mm, SnPb finish) with EBI functionality enabled. Pin assignments follow the MPC5674F 516-ball layout defined in Figures 11–15 of Rev. 11 datasheet, supporting full external memory expansion via D_ADD[0:31], D_DAT[0:15], D_CS[0:3], D_OE, D_WE[0:3], D_ALE, D_RD_, D_TS, and D_BDIP signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D_ADD[0:31] | External address bus | 32-bit multiplexed address/data bus enabling up to 4 GB external memory space mapping |
| D_DAT[0:15] | External data bus | 16-bit bidirectional data path for EBI transfers; supports byte/word access modes |
| D_CS0–D_CS3 | Chip select outputs | Four independent chip selects for partitioning external memory or peripheral devices |
| D_OE / D_WE[0:3] | Output enable / write enable | Asynchronous read/write control with per-byte write enable for NAND/NOR flash or SRAM interfacing |
| D_ALE / D_RD_ / D_TS | Address latch enable / read strobe / transfer start | Timing control signals supporting standard asynchronous and burst-mode EBI protocols |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces firmware footprint by up to 30% vs. pure 32-bit encoding, critical for flash-constrained ECU designs |
| SPE2 signal processing engine | Accelerates motor control algorithms (FOC, PMSM) and sensor fusion with native single-precision FP and SIMD operations |
| eTPU2 time-processing units | 64 dedicated I/O timing channels with 24 KB shared code RAM for high-resolution PWM, capture, and waveform generation |
| FMPLL clock synthesis | Provides spread-spectrum clocking to reduce EMI emissions without external filtering components |
| Nexus Class III+ debug interface | Enables real-time trace, non-intrusive breakpoints, and hardware-assisted profiling per IEEE-ISTO 5001-2008 |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID and model-based control at ≤100 µs loop intervals using eTPU2 and eQADC. Use Value: Deterministic 264 MHz execution and 64-channel eTPU2 eliminate need for external timing co-processors, reducing BOM cost and PCB area. | Use Scenario: Clutch pressure modulation, gear shift scheduling, and torque converter lock-up control in automatic transmissions. IC Role / Device Role / Timing Role: Safety-critical actuator driver coordinating hydraulic solenoids and position sensors via eMIOS PWM and FlexCAN messaging. Use Value: Integrated ASIL-B-ready peripherals (eQADC, eMIOS, FlexCAN) meet ISO 26262 requirements without external safety monitors. |
| Electric Power Steering (EPS) | Hybrid Vehicle Inverter Control |
Use Scenario: Torque assist calculation, motor phase current sensing, and fault-safe shutdown in 12V/48V EPS systems. IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms using SPE2 acceleration and 12-bit eQADC with decimation filters. Use Value: On-chip 4 MB flash stores multiple motor profiles and calibration maps; 32 KB standby RAM retains steering angle during ignition-off. | Use Scenario: Gate drive signal generation, DC-link voltage monitoring, and thermal management in traction inverters. IC Role / Device Role / Timing Role: High-precision timing controller synchronizing IGBT/SiC gate drivers via eTPU2 outputs and capturing current/voltage feedback via eQADC. Use Value: 200 MHz deterministic timing ensures <150 ns PWM dead-time accuracy; FMPLL suppresses conducted EMI from switching noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674FK0MVY3 | Pb-free 516-ball TEPBGA; identical core/peripherals but RoHS-compliant finish | Same EBI-enabled functionality; preferred for new designs targeting lead-free manufacturing | Select when Pb-free compliance is mandatory and SnPb reflow is not permitted in production. |
| SPC5674FF3MVR3 | 416-ball TEPBGA (23 mm × 23 mm); no EBI support; same speed/temp grade | Reduced external memory capability; suitable for cost-sensitive ECUs without calibration flash or boot ROM expansion | Choose when board space is constrained and EBI is unnecessary - saves ~20% package area and assembly cost. |
Compared with MPC5674FK0MVY3 and SPC5674FF3MVR3, the SPC5674FF3MVV3 uniquely delivers SnPb-compatible 516-ball packaging with full EBI functionality - enabling legacy automotive manufacturing compatibility while retaining external memory expansion for complex calibration and OTA update storage.
Availability
SPC5674FF3MVV3 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across extended automotive product lifecycles.
Supply support for SPC5674FF3MVV3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and real-time control.
The MPC5674F product line targets high-performance automotive powertrain and chassis control, delivering ASIL-B-capable real-time processing, robust peripheral integration, and long-term automotive qualification.
FAQ
What is the maximum operating frequency of the SPC5674FF3MVV3?
The SPC5674FF3MVV3 has a nominal system clock frequency of 200 MHz and a maximum allowable frequency of 264 MHz, which includes ±2% frequency modulation (FM) from the FMPLL. This specification is validated across the full -40°C to +125°C temperature range and is documented in Table 1 of the MPC5674F datasheet Rev. 11. The SPC5674FF3MVV3 achieves this performance while maintaining ASIL-B compliance for automotive powertrain applications.
Does the SPC5674FF3MVV3 support external memory expansion?
Yes, the SPC5674FF3MVV3 supports external memory expansion via its External Bus Interface (EBI), which is enabled in the 516-ball TEPBGA package variant. It provides a 32-bit address bus (D_ADD[0:31]), 16-bit data bus (D_DAT[0:15]), four chip selects (D_CS0–D_CS3), and full control signaling (D_OE, D_WE[0:3], D_ALE, D_RD_, D_TS). This capability is confirmed in Section 1.2 (MPC567xF Family Differences) and Figure 11 of the SPC5674FF3MVV3 datasheet.
What is the package type and finish of the SPC5674FF3MVV3?
The SPC5674FF3MVV3 uses a 516-ball TEPBGA package measuring 27 mm × 27 mm with SnPb (tin-lead) surface finish, as explicitly stated in Table 1 (Orderable Part Numbers) of the MPC5674F datasheet Rev. 11. This distinguishes it from Pb-free variants like MPC5674FK0MVY3 and confirms compatibility with legacy solder reflow profiles used in automotive manufacturing.
How many eTPU2 channels does the SPC5674FF3MVV3 provide?
The SPC5674FF3MVV3 integrates two second-generation enhanced time processor units (eTPU2), providing a total of 64 dedicated timing channels - 32 per unit - with shared 24 KB code RAM and 6 KB parameter RAM. This configuration is specified in the "Blocks" section (Section 2.1) and Table 2 (MPC567xF Family Differences) of the MPC5674F datasheet Rev. 11, and applies specifically to the 516-ball package variant like the SPC5674FF3MVV3.
Is the SPC5674FF3MVV3 qualified for automotive use?
Yes, the SPC5674FF3MVV3 is fully qualified for automotive applications under AEC-Q100 Grade 1 (-40°C to +125°C), with functional safety features aligned to ASIL-B per ISO 26262. Its qualification status is indicated by the 'M' in the part number's qualification field (per Figure 1), and its design includes error correction status module (ECSM), memory protection unit (MPU), and lockstep-capable peripherals - all verified in the MPC5674F datasheet Rev. 11 and reference manual.
SPC5674FF3MVV3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 264MHz
- Connectivity:
- CANbus, EBI/EMI, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5674FF3MVV3 FAQ
1.How can I place an order for SPC5674FF3MVV3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5674FF3MVV3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5674FF3MVV3 reliable?
The price and inventory of SPC5674FF3MVV3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5674FF3MVV3 is usually 5 days.
3.What payment methods are accepted for SPC5674FF3MVV3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5674FF3MVV3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5674FF3MVV3?
SPC5674FF3MVV3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5674FF3MVV3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5674FF3MVV3?
For technical support, including SPC5674FF3MVV3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5674FF3MVV3 requirements.
6.How does Aetrix verify that SPC5674FF3MVV3 is sourced from the original manufacturer or authorized distributors?
All SPC5674FF3MVV3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5674FF3MVV3 meets industry standards.
7.What is the process for return or replacement of SPC5674FF3MVV3?
All SPC5674FF3MVV3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5674FF3MVV3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5674FF3MVV3 part is unused and in its original packaging.
Return procedure for SPC5674FF3MVV3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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