NXP Semiconductors SPC5674FF3MVY3

Overview

SPC5674FF3MVY3 from NXP Semiconductors is a high-performance 32-bit Power Architecture® microcontroller featuring the e200z7 dual-issue CPU core, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby RAM), dual eTPU2 units (64 total channels), and integrated FlexRay, FlexCAN, eQADC, and eMIOS peripherals - designed for automotive powertrain and chassis control systems requiring ASIL-B functional safety compliance.

For engineers reviewing the SPC5674FF3MVY3 datasheet, SPC5674FF3MVY3 pinout, SPC5674FF3MVY3 application, or SPC5674FF3MVY3 equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases in engine management and brake control, and validated alternative parts with documented functional and packaging differences.

Technical Context

The SPC5674FF3MVY3 implements a dual-issue e200z7 core compliant with Power Architecture® v2.03, supporting VLE instruction encoding for reduced code footprint and SPE2 extensions for DSP and single-precision floating-point operations. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including two eDMA2 controllers (64+32 channels).

It integrates two second-generation eTPU2 modules sharing 24 KB code RAM and 6 KB parameter RAM, four eQADC modules supporting 64 analog inputs with decimation filters, and a frequency-modulated PLL (FMPLL) for jitter-tolerant clock generation - all operating across –40 °C to +125 °C with on-chip voltage regulation down to 1.2 V core supply.

Key Specifications

Pinout & Package

SPC5674FF3MVY3 is housed in a 516-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm with 1.0 mm ball pitch. The package supports full I/O muxing, EBI signals (D_ADD[0–30], D_DAT[0–15], D_CS[0–3], D_OE, D_WE[0–3], D_ALE, D_RD_, D_TS, WR), and dedicated FlexRay/FlexCAN transceiver pins (FR_A_, FR_B_, TX_EN, RX, TX).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5674FF3MVY3, SPC5674FK0MVY3 offers higher clock headroom for demanding real-time tasks, while MPC5674FAMVY3 trades eTPU2 capability and memory size for lower cost - making the SPC5674FF3MVY3 optimal for ASIL-B powertrain designs needing full feature set at 200 MHz.

Availability

SPC5674FF3MVY3 is available at Aetrix Electronics and suitable for automotive powertrain control, brake-by-wire systems, and electric power steering applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.

Supply support for SPC5674FF3MVY3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and real-time control ICs.

The MPC5674F family - including SPC5674FF3MVY3 - was engineered specifically for ASIL-B automotive powertrain and chassis control, integrating safety mechanisms, deterministic peripherals, and robust packaging for harsh under-hood environments.

FAQ

What is the maximum operating frequency of the SPC5674FF3MVY3?

The SPC5674FF3MVY3 has a nominal operating frequency of 200 MHz and a maximum allowed frequency of 270 MHz, which accommodates frequency modulation (FM) up to ±2% around the 264 MHz base clock. This specification is confirmed in Table 1 of the MPC5674F datasheet Rev. 11 and applies specifically to the SPC5674FF3MVY3 variant with 516-ball TEPBGA and EBI support.

Does the SPC5674FF3MVY3 include an external bus interface (EBI)?

Yes, the SPC5674FF3MVY3 includes a full external bus interface (EBI) with 31 address lines (D_ADD0–D_ADD30), 16 data lines (D_DAT0–D_DAT15), four chip selects (D_CS0–D_CS3), and control signals including D_OE, D_WE0–D_WE3, D_ALE, D_RD_, D_TS, and WR. This is explicitly stated in the Ordering Information section (Table 1) and confirmed in Figure 11's pin diagram for the 516-ball TEPBGA package.

What safety certifications apply to the SPC5674FF3MVY3?

The SPC5674FF3MVY3 is qualified to AEC-Q100 Grade 1 (–40 °C to +125 °C) and supports ISO 26262 ASIL-B compliance through integrated features including the Error Correction Status Module (ECSM), lockstep-capable peripherals, memory built-in self-test (MBIST), and Nexus debug interface for runtime verification - all documented in the MPC5674F Functional Safety Manual.

How much SRAM does the SPC5674FF3MVY3 provide, and what is its standby capability?

The SPC5674FF3MVY3 provides 256 KB of on-chip general-purpose SRAM, of which 32 KB is designated as standby RAM (S/B RAM). This standby RAM retains data during low-power stop modes and is powered by a separate supply domain, enabling fast wake-up with preserved context - a key requirement for automotive stop-start systems.

Is the SPC5674FF3MVY3 pin-compatible with other MPC5674F variants in the 516-ball package?

Yes, all MPC5674F variants in the 516-ball TEPBGA package - including SPC5674FF3MVY3, SPC5674FK0MVY3, and SPC5674FAMVY3 - share identical pinouts and mechanical footprints. Signal assignments are fully compatible per Figures 11–15 in the MPC5674F datasheet Rev. 11, allowing board reuse across speed and feature variants.