NXP Semiconductors SPC5674FF3MVZ2

Overview

SPC5674FF3MVZ2 from NXP Semiconductors is a 32-bit Power Architecture® e200z7-based automotive microcontroller with dual-issue CPU, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby), 64-channel eTPU2, and FlexRay/CAN/FlexCAN/DSPI/eSCI interfaces. It operates at up to 200 MHz nominal frequency, supports -40 °C to 125 °C ambient, and targets engine control units, transmission controllers, and chassis domain controllers.

For engineers reviewing the SPC5674FF3MVZ2 datasheet, SPC5674FF3MVZ2 pinout, SPC5674FF3MVZ2 application, or SPC5674FF3MVZ2 equivalent, key selection criteria include its TEPBGA–324 Pb-free package, 200 MHz core speed, integrated FMPLL clock generation, Nexus IEEE-ISTO 5001 debug interface, and automotive qualification status (S-flow).

Technical Context

The SPC5674FF3MVZ2 implements a dual-issue e200z7 core compliant with Power Architecture® embedded category, featuring 16 KB I-Cache and 16 KB D-Cache, VLE instruction encoding for code density reduction, and SPE2 extensions for DSP and single-precision floating-point operations. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters.

It integrates two eDMA2 controllers (64- and 32-channel), four eQADC modules supporting 64 analog inputs with decimation filters, dual FlexRay channels, four FlexCAN modules, and an external bus interface (EBI) - though EBI is not available in the 324-ball TEPBGA package variant.

Key Specifications

Pinout & Package

SPC5674FF3MVZ2 is housed in a 324-ball TEPBGA package (23 mm × 23 mm, Pb-free, 0.8 mm ball pitch). Pin assignments are defined per the MPC5674F datasheet Rev. 11 Figures 3–5, with primary functions including analog inputs (ANA0–ANA23, ANB0–ANB23), eMIOS channels (EMIOS0–EMIOS31), eTPU2 signals (ETPUA0–ETPUA31, ETPUB0–ETPUB31, ETPUC0–ETPUC31), FlexRay (FR_A_, FR_B_), CAN (CNRX/CTX), DSPI (SCKA/SINA/SOUTA, etc.), and Nexus debug (TMS/TCK/TDO/TDI).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5674FF3MVZ2, SPC5674FF3MVY3 adds EBI for external memory but increases package size and complexity, while SPC5673FF3MVV2 reduces cost and feature set at the expense of FlexRay, flash capacity, and eTPU2 scalability - making it suitable only for less demanding domains.

Availability

SPC5674FF3MVZ2 is available at Aetrix Electronics and suitable for engine control units, transmission control units, and chassis domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-B-aligned functional safety features.

Supply support for SPC5674FF3MVZ2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The MPC567xF family, including SPC5674FF3MVZ2, was designed specifically for high-performance, safety-critical automotive powertrain and chassis applications, emphasizing real-time determinism, functional safety compliance (ISO 26262), and robust EMI/ESD resilience.

FAQ

What is the package type and ball count for SPC5674FF3MVZ2?

SPC5674FF3MVZ2 uses a 324-ball TEPBGA package (23 mm × 23 mm, Pb-free, 0.8 mm ball pitch), as confirmed in the MPC5674F datasheet Rev. 11 Section 5.1 and Ordering Information Table 1. This package does not include the External Bus Interface (EBI), distinguishing it from 516-ball variants like SPC5674FF3MVY3.

Does SPC5674FF3MVZ2 support FlexRay communication?

Yes, SPC5674FF3MVZ2 integrates a dual-channel FlexRay controller, as documented in the MPC5674F datasheet Rev. 11 Section 1 "Features" and Block Diagram (Figure 2). The FlexRay interface uses dedicated differential pins (FR_A_, FR_B_) and supports protocol timing per FlexRay v2.1A, enabling deterministic communication in safety-critical chassis and powertrain networks.

What is the maximum operating frequency of SPC5674FF3MVZ2?

SPC5674FF3MVZ2 is rated for a nominal maximum frequency of 200 MHz, with no frequency modulation (FM) capability - unlike 264 MHz variants (e.g., SPC5674FK0MVY3). This is explicitly stated in Table 1 "Orderable Part Numbers" and Section 1.2 "MPC567xF Family Differences", where the "2" suffix in the part number denotes 200 MHz operation.

Is SPC5674FF3MVZ2 qualified for automotive applications?

Yes, SPC5674FF3MVZ2 is fully qualified for automotive use under NXP's S-flow qualification status, supporting operation from -40 °C to +125 °C ambient temperature. This qualification includes AEC-Q100 stress testing and functional safety alignment with ISO 26262 ASIL-B requirements, as detailed in the MPC5674F datasheet Rev. 11 Section 1.1 and Package Information.

How much on-chip flash and SRAM does SPC5674FF3MVZ2 provide?

SPC5674FF3MVZ2 integrates 4 MB of on-chip C90 flash memory with read-while-program/erase capability and EEPROM emulation support, plus 256 KB of general-purpose SRAM - including 32 KB of dedicated standby RAM for low-power retention. These values are specified in the "Features" section and electrical characteristics tables of the MPC5674F datasheet Rev. 11.