NXP Semiconductors SPC5674FK0MVY3
- Part No.:
- SPC5674FK0MVY3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 516-BBGA
- Datasheet:
-
SPC5674FK0MVY3.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 516FPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,962
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5674FK0MVY3 from NXP Semiconductors is a high-performance 32-bit Power Architecture® microcontroller featuring a dual-issue e200z7 core, 4 MB on-chip flash, 256 KB SRAM (including 32 KB standby RAM), dual eTPU2 units (64 total channels), and integrated FlexRay, FlexCAN, eQADC (64-channel), eMIOS (32-channel), and DSPI peripherals - designed for automotive powertrain and chassis control systems requiring deterministic real-time response.
For engineers reviewing the SPC5674FK0MVY3 datasheet, SPC5674FK0MVY3 pinout, SPC5674FK0MVY3 application, or SPC5674FK0MVY3 equivalent, key selection criteria include its 516-ball TEPBGA package with EBI support, 264 MHz nominal/270 MHz max system clock, –40 °C to 125 °C operating range, and functional integration of safety-critical timing, analog acquisition, and high-speed serial communication for ASIL-B/D-compliant designs.
Technical Context
The SPC5674FK0MVY3 implements a dual-issue e200z7 CPU core compliant with Power Architecture® embedded category, augmented with VLE instruction encoding for code density reduction and SPE2 extensions for DSP and single-precision floating-point operations. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including two eDMA2 controllers (64 + 32 channels).
It integrates two second-generation eTPU2 modules sharing 24 KB code RAM and 6 KB parameter RAM, four eQADC modules supporting 64 analog inputs with decimation filters, and a frequency-modulated PLL (FMPLL) for jitter-tolerant clock generation. The external bus interface (EBI) is enabled exclusively in the 516-ball TEPBGA variant, supporting calibration and development use cases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z7 dual-issue 32-bit Power Architecture® core with VLE and SPE2 support for compact code and DSP acceleration |
| Flash Memory | 4 MB on-chip C90 flash with read-while-program/erase capability and EEPROM emulation via multiple blocks |
| SRAM | 256 KB general-purpose SRAM, including 32 KB low-power standby RAM for retention during sleep modes |
| Max Clock Speed | 264 MHz nominal system clock (270 MHz with ±2% FM modulation), enabling sub-microsecond interrupt latency |
| Operating Temp | –40 °C to 125 °C ambient temperature range, qualified for automotive underhood applications per AEC-Q100 Grade 1 |
| Package | 516-ball TEPBGA (27 mm × 27 mm), Pb-free, with exposed thermal pad and EBI signal routing enabled |
| Analog Inputs | 64-channel eQADC with one absolute reference channel and eight decimation filters for noise suppression in motor current sensing |
Pinout & Package
SPC5674FK0MVY3 is housed in a 516-ball TEPBGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal pad and Pb-free finish. Pin assignments are defined in NXP Document MPC5674F Rev. 11, Section 3.3 (Figures 11–15), where EBI signals (D_ADD[0:31], D_DAT[0:15], D_CS[0:3], D_RD_, D_WR_, D_OE, D_ALE, D_TS) are allocated across rows AC–AF and columns 17–26.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D_ADD16–D_ADD29 | External Bus Address Lines | 14-bit address bus for EBI-based memory mapping; supports up to 128 MB address space in multiplexed mode |
| D_DAT0–D_DAT15 | External Bus Data Lines | 16-bit bidirectional data bus with byte-enable control (D_WE0–D_WE3) for interfacing with external PROM, RAM, or calibration devices |
| D_CS0–D_CS3 | Chip Select Outputs | Four independent chip selects enabling simultaneous connection to up to four external peripherals without glue logic |
| D_RD_, D_WR_, D_OE | Control Signals | Asynchronous read/write strobes and output enable for timing-critical calibration data transfers during runtime |
| VDD, VSS, VDDA, VSSA | Power & Ground | Dedicated analog/digital power domains with separate supply pins ensure <1 LSB ADC error at full speed under EMI stress |
Key Features
| Feature | Design Value |
|---|---|
| Nexus Class III+ Debug | Fully compliant IEEE-ISTO 5001-2003/2008 interface enabling real-time trace, complex breakpointing, and non-intrusive profiling for ISO 26262 tool qualification |
| FlexRay Controller | Dual-channel deterministic time-triggered bus controller supporting 10 Mbps, static/dynamic segments, and fault-tolerant frame transmission for X-by-wire systems |
| eTPU2 Timing Precision | Two 32-channel eTPU2 units with 5 ns resolution and hardware-based PWM capture/generation eliminate CPU overhead in ignition and injection timing |
| Boot Assist Module (BAM) | Serial bootload via CAN or SCI with CRC-16 validation ensures secure field firmware updates without external programming hardware |
| Error Correction Status Module | ECSM monitors flash and SRAM for single-bit errors and reports multi-bit faults to SIU for ASIL-D diagnostic coverage |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary engine management MCU executing closed-loop control at ≤1 ms cycle intervals with synchronized eQADC sampling and eTPU2 spark timing. Use Value: 64-channel eQADC with decimation filters enables simultaneous cylinder pressure, throttle position, and O2 sensor acquisition; FMPLL ensures stable timing under battery voltage transients. |
Use Scenario: Torque assist calculation, motor phase current regulation, and fault monitoring in 12V/48V EPS systems. IC Role / Device Role / Timing Role: Safety-critical controller managing FOC algorithms, torque overlay, and ASIL-B diagnostics using dual eTPU2 for PWM generation and current sensing synchronization. Use Value: 256 KB SRAM includes 32 KB standby RAM for fast wake-from-sleep torque continuity; FlexCAN interfaces with vehicle CAN FD backbone for driver assistance coordination. |
| Brake-by-Wire System | Transmission Control Module (TCM) |
|
Use Scenario: Redundant actuator control, pressure feedback processing, and fail-operational braking decisions in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-core-equivalent timing resource via eTPU2 + eMIOS delivering deterministic 50 µs PWM update cycles for solenoid valve drivers. Use Value: Crossbar switch allows concurrent eQADC sampling, FlexRay message transmission, and flash reprogramming - critical for ISO 26262 ASIL-D partitioning. |
Use Scenario: Gear shift scheduling, clutch pressure control, and adaptive learning in automatic transmissions. IC Role / Device Role / Timing Role: High-integration MCU hosting transmission software stack with integrated eMIOS (32-channel) for solenoid timing and eSCI for diagnostic communication. Use Value: 4 MB flash accommodates dual-bank firmware for seamless OTA updates; EBI enables external calibration storage for adaptive shift maps without flash wear. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5674FK0MVR3 | 416-ball TEPBGA, no EBI support, identical core/peripheral set except missing EBI pins and associated functionality | Suitable for cost-sensitive ECUs where external calibration memory is not required; lacks EBI-driven development flexibility | Select when board space, BOM cost, or thermal envelope constraints preclude 516-ball package; verify EBI absence aligns with calibration architecture |
| MPC5674FK0MVY3R | Identical 516-ball TEPBGA package and electrical specs; differs only in tape-and-reel packaging (R suffix) vs. tray (no suffix) | No functional difference; used for automated SMT assembly requiring reel-fed feeders | Choose for high-volume production lines requiring tape-and-reel delivery; otherwise functionally interchangeable with SPC5674FK0MVY3 |
Compared with SPC5674FK0MVY3, the SPC5674FK0MVR3 sacrifices EBI expandability for smaller footprint and lower cost, while the MPC5674FK0MVY3R offers identical silicon in logistics-optimized packaging - making the original SPC5674FK0MVY3 optimal for prototyping, calibration-heavy development, and medium-volume ASIL-B/D applications requiring EBI.
Availability
SPC5674FK0MVY3 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake-by-wire systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant traceability.
Supply support for SPC5674FK0MVY3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and ASIL-certified microcontrollers.
The SPC5674FK0MVY3 belongs to NXP's SPC56 family of automotive MCUs, engineered specifically for real-time powertrain, chassis, and safety-critical control applications demanding high computational throughput, deterministic I/O, and ISO 26262 compliance support.
FAQ
What is the maximum operating frequency of the SPC5674FK0MVY3?
The SPC5674FK0MVY3 operates at a nominal maximum frequency of 264 MHz, with a peak allowable frequency of 270 MHz when frequency modulation (FM) is enabled (±2% modulation). This is confirmed in Table 1 of the MPC5674F datasheet Rev. 11, where the "Speed (MHz)" column lists Nominal = 264 and Max = 270 for SPC5674FK0MVY3. The FMPLL generates this clock with jitter tolerance essential for automotive timing stability.
Does the SPC5674FK0MVY3 support external memory expansion?
Yes, the SPC5674FK0MVY3 supports external memory expansion via its External Bus Interface (EBI), which is enabled exclusively in the 516-ball TEPBGA package variant. As stated in Table 2 ("MPC567xF Family Differences") and Section 3.3 of the datasheet, EBI signals (address, data, control) are routed on pins in rows AC–AF and columns 17–26 - confirming that SPC5674FK0MVY3 provides full EBI functionality for connecting external PROM, RAM, or calibration storage devices.
What safety certifications apply to the SPC5674FK0MVY3?
The SPC5674FK0MVY3 is AEC-Q100 Grade 1 qualified (–40 °C to 125 °C), and its architecture supports ISO 26262 ASIL-B and ASIL-D development through integrated safety mechanisms: ECC-protected flash/SRAM, ECSM error reporting, lockstep-capable peripherals, Nexus Class III+ debug for traceability, and hardware-assisted self-tests. These capabilities are documented in the MPC5674F Functional Safety Manual and are inherent to the SPC5674FK0MVY3 silicon revision.
How many analog-to-digital converter channels does the SPC5674FK0MVY3 have?
The SPC5674FK0MVY3 integrates four enhanced queued ADC (eQADC) modules supporting a total of 64 analog input channels. As specified in Table 2 and Section 1.1 of the datasheet, this includes two pairs of 24-channel ADCs plus 16 shared channels - yielding 64 unique inputs. One channel is designated as an absolute reference ADC, and all modules include eight decimation filters for noise reduction in motor current and sensor signal acquisition.
Is the SPC5674FK0MVY3 pin-compatible with other MPC5674F variants?
No - the SPC5674FK0MVY3 is not pin-compatible with 324-ball or 416-ball MPC5674F variants due to differing ball counts (516 vs. 324/416), distinct pinouts, and exclusive allocation of EBI signals only in the 516-ball package. Figure 11 (516-ball) and Figures 3/6 show non-overlapping pin layouts; Table 2 explicitly states EBI is "Yes (516 BGA only)". Therefore, PCB redesign is required when migrating to or from SPC5674FK0MVY3.
SPC5674FK0MVY3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 264MHz
- Connectivity:
- CANbus, EBI/EMI, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- 32
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 5.25V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5674FK0MVY3 FAQ
1.How can I place an order for SPC5674FK0MVY3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5674FK0MVY3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5674FK0MVY3 reliable?
The price and inventory of SPC5674FK0MVY3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5674FK0MVY3 is usually 5 days.
3.What payment methods are accepted for SPC5674FK0MVY3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5674FK0MVY3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5674FK0MVY3?
SPC5674FK0MVY3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5674FK0MVY3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5674FK0MVY3?
For technical support, including SPC5674FK0MVY3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5674FK0MVY3 requirements.
6.How does Aetrix verify that SPC5674FK0MVY3 is sourced from the original manufacturer or authorized distributors?
All SPC5674FK0MVY3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5674FK0MVY3 meets industry standards.
7.What is the process for return or replacement of SPC5674FK0MVY3?
All SPC5674FK0MVY3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5674FK0MVY3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5674FK0MVY3 part is unused and in its original packaging.
Return procedure for SPC5674FK0MVY3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5674FK0MVY3 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

