My Inquiry
My Account
NXP Semiconductors SPC5675KF0MMM2
- Part No.:
- SPC5675KF0MMM2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KF0MMM2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,153
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5675KF0MMM2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM (ECC), 2 MB code flash (ECC), and integrated FlexPWM/FlexCAN/FlexRay for automotive ADAS and HEV motor control. It supports lock-step safety operation per ISO 26262 ASIL D and operates from –40 °C to +150 °C junction temperature.
For engineers reviewing the SPC5675KF0MMM2 datasheet, SPC5675KF0MMM2 pinout, SPC5675KF0MMM2 application, or SPC5675KF0MMM2 equivalent, key selection criteria include dual-core lock-step integrity, on-chip DRAM/PDI support for radar imaging, FMPLL jitter control for motor timing, and 473-pin MAPBGA package compatibility with DDR and EBI interfaces.
Technical Context
The SPC5675KF0MMM2 implements two e200z7d cores with Harvard architecture, 16 KB instruction and 16 KB data caches per core (EDC/parity), MMU with 64-entry TLB, and SPE2 auxiliary processing unit. It uses Variable Length Encoding (VLE) for reduced code footprint and supports both lock-step and decoupled parallel modes.
Its safety architecture includes Sphere of Replication (SoR) for CPU, cache, SRAM, and flash; redundancy checkers feeding into FCCU; boot-time MBIST/LBIST; and replicated STM, SWT, and CMU modules. The auxiliary FMPLL provides independent, modulation-free clocking for FlexRay and motor peripherals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and ASIL-D-compliant partitioning. |
| Max Core Frequency | 180 MHz (+2% FM tolerance) - delivers up to 4× performance vs MPC5561 while maintaining Power Architecture compatibility. |
| Memory | 2 MB code flash (ECC), 64 KB data flash (ECC), 512 KB SRAM (ECC) - supports safe firmware updates, EEPROM emulation, and fault-tolerant data storage. |
| Safety Features | Lock-step SoR, FCCU, replicated STM/SWT/CMU, MBIST/LBIST, CRC units - achieves SIL3/ASIL D compliance without external safety monitors. |
| Peripherals | 4 FlexCAN 2.0B (32 MB each), 4 LINFlex, 3 DSPI, 3 FlexPWM (4×3 ch), 4 ADC (12-bit, 22 ch), FlexRay v2.1 (10 Mbit/s) - integrates full ADAS sensor fusion and multi-motor control in one die. |
| Package & Temp | 473-pin MAPBGA (19 mm × 19 mm), –40 °C to +150 °C junction - qualified for under-hood automotive and high-temp industrial environments. |
| Power Supply | Single 3.3 V supply (I/O/flash/oscillators); 1.8–3.3 V for DRAM/PDI; 3.3 V or 5 V for ADC/VREG - simplifies power tree design with minimal external regulation. |
Pinout & Package
SPC5675KF0MMM2 is housed in a 473-pin MAPBGA package (19 mm × 19 mm, 0.8 mm pitch), supporting DDR, EBI, PDI, and high-density signal routing for automotive domain controllers. Pin assignments are defined in NXP Document MPC5675K Rev. 9, Sections 2.1–2.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO_0–VDD_IO_7 | I/O Power Supply | Eight independent 3.3 V domains enable selective I/O bank powering and noise isolation for mixed-signal interfaces. |
| DDR_DQ0–DDR_DQ15 | DDR Data Bus | 16-bit bidirectional data interface compliant with mDDR/DDR1 standards - supports real-time image buffer streaming from radar/CMOS sensors. |
| PDI_DATA0–PDI_DATA15 | Parallel Data Interface | 16-bit programmable-width input for CMOS image sensors or external ADCs - synchronized via PIXCLK/HSYNC/VSYNC with configurable edge capture. |
| FLEXCAN0_TX/RX | CAN 2.0B Physical Layer | Differential CAN transceiver interface with integrated termination - enables direct connection to automotive body/chassis networks without external PHY. |
| FMPLL_REF_CLK | FMPLL Reference Input | Accepts 4–40 MHz crystal or external clock - feeds primary and auxiliary FMPLLs for system and FlexRay/motor peripheral clock generation. |
| WKPU_IN0–WKPU_IN7 | Wake-Up Unit Inputs | Eight dedicated low-power wake sources - allows selective entry/exit from stop modes without CPU intervention for energy-efficient ADAS monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Decoupled Parallel Mode | Enables full utilization of both e200z7d cores for non-safety-critical tasks (e.g., sensor preprocessing, comms stack) while retaining lock-step for safety-critical control loops. |
| FlexPWM with Auxiliary FMPLL | Generates jitter-free PWM at precise frequencies independent of system clock - critical for field-oriented control (FOC) of BLDC/PMSM motors in HEVs. |
| CTU-ADC-FlexPWM Hardware Sync | Hardware-triggered ADC sampling aligned to PWM center/edge without CPU overhead - ensures repeatable current/voltage measurement timing for motor current control. |
| On-Chip PDI + DRAM Controller | Direct parallel interface to CMOS imagers + external DDR memory - eliminates FPGA glue logic in radar/LiDAR front-end processing units. |
| Nexus Class 3+ Debug | Real-time trace of dual-core execution, SRAM port access, and safety module status - enables end-to-end validation of ASIL-D software stacks per ISO 26262 tool qualification requirements. |
Applications
| Radar Signal Processing Unit | Hybrid Electric Vehicle Motor Control |
|---|---|
|
Use Scenario: Real-time FFT and CFAR processing of FMCW radar returns from 77 GHz RF front-end, with frame synchronization to vehicle speed and steering angle. IC Role / Device Role / Timing Role: Primary domain controller executing DSP kernels on dual e200z7d cores, managing PDI-fed ADC data, DDR-stored point clouds, and FlexCAN-distributed detection results. Use Value: On-die PDI + DDR controller eliminates external memory bottleneck; auxiliary FMPLL ensures sub-ns PWM jitter for precise chirp timing control. |
Use Scenario: Field-oriented control (FOC) of dual 3-phase traction and accessory motors in a 48 V mild hybrid architecture, with torque coordination and thermal derating. IC Role / Device Role / Timing Role: Safety-certified motor controller running lock-step position/speed loops and decoupled observer/state estimation, interfacing to gate drivers via FlexPWM and current sensors via ADC. Use Value: Integrated FlexPWM deadtime control, CTU-synchronized ADC sampling, and ECC-protected SRAM guarantee <1 µs loop latency and fault containment per ASIL D requirements. |
| Automotive Domain Gateway | Advanced Driver Assistance System (ADAS) ECU |
|
Use Scenario: Aggregation and protocol translation between CAN FD, LIN, FlexRay, and Ethernet networks in zonal architecture, with secure OTA update handling. IC Role / Device Role / Timing Role: Central gateway MCU managing four FlexCAN buses, three LINFlex modules, FlexRay channel, and FEC - routing messages with time-triggered scheduling. Use Value: Dual-core lock-step ensures fail-operational routing logic; 2 MB flash with ECC supports signed firmware images and rollback protection. |
Use Scenario: Fusion of camera, ultrasonic, and radar inputs for automatic emergency braking (AEB) and lane-keeping assist (LKA), with functional safety monitoring. IC Role / Device Role / Timing Role: Sensor fusion processor executing perception algorithms, validating outputs via FCCU, and triggering actuators through ASIL-D-certified FlexPWM/FlexCAN paths. Use Value: Sphere of Replication covers CPU, cache, SRAM, and flash - enabling diagnostic coverage >99% for ISO 26262 ASIL D decomposition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674KF0MLL2 | Same dual e200z7d core, but 384 KB SRAM (ECC), 1.5 MB flash (ECC), no DRAM controller, 257-pin MAPBGA (14 mm × 14 mm). | Limited to single-motor control or lower-bandwidth ADAS; lacks DDR/PDI for radar imaging. | Select when cost-sensitive designs require ASIL D capability without DDR/PDI bandwidth. |
| S32K344UAT0VLQY | ARM Cortex-M7 dual-core, 4 MB flash, 2 MB RAM, AURIX-style safety architecture, 256-pin LQFP - no native FlexRay or PDI. | Targets general-purpose automotive control; requires external PHY for FlexRay and FPGA for PDI interfacing. | Select for ARM ecosystem alignment and higher flash/RAM density where FlexRay/PDI are not required. |
Compared with MPC5674KF0MLL2, SPC5675KF0MMM2 adds 128 KB SRAM, 512 KB flash, DRAM/PDI, and 473-pin routing density for radar/HEV use cases; versus S32K344UAT0VLQY, it offers native FlexRay v2.1 and hardware-synced PDI-eliminating external components in safety-critical sensor fusion.
Availability
SPC5675KF0MMM2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, hybrid electric vehicle motor drives, radar signal processors, and ASIL-D-certified gateway ECUs requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KF0MMM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety and secure processing.
The SPC5675KF0MMM2 belongs to NXP's MPC5675K family - engineered specifically for ISO 26262 ASIL D automotive systems demanding lock-step computation, sensor fusion, and real-time motor control in extreme temperature environments.
FAQ
What is the maximum operating junction temperature for SPC5675KF0MMM2?
The SPC5675KF0MMM2 is rated for continuous operation from –40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 requirements. This enables placement in high-heat zones such as engine compartments or near power inverters in hybrid electric vehicles, where thermal management margins are constrained.
Does SPC5675KF0MMM2 support pin-compatible migration from MPC5674K?
No, SPC5675KF0MMM2 uses a 473-pin MAPBGA package (19 mm × 19 mm), whereas MPC5674K variants use 257-pin MAPBGA (14 mm × 14 mm). While both share the same e200z7d dual-core architecture and peripheral IP, PCB layout redesign is required due to differing pin count, pitch, and signal mapping - especially for DDR, PDI, and EBI interfaces unique to the 473-pin variant.
How does the auxiliary FMPLL in SPC5675KF0MMM2 benefit motor control applications?
The auxiliary FMPLL in SPC5675KF0MMM2 generates a dedicated, modulation-free clock for FlexPWM and CTU modules - ensuring sub-nanosecond jitter stability critical for field-oriented control (FOC) of BLDC and PMSM motors. Unlike the main FMPLL, it avoids frequency modulation that could introduce timing uncertainty in PWM edge placement, directly improving torque ripple and efficiency in HEV traction inverters.
Can SPC5675KF0MMM2 execute AUTOSAR OS on both cores simultaneously?
Yes, SPC5675KF0MMM2 supports AUTOSAR 4.x on both e200z7d cores: the primary core runs safety-critical BSW and RTE in lock-step mode, while the secondary core executes non-safety Linux-based middleware or application layers in decoupled parallel mode. NXP provides certified MCAL drivers and SafeAssure development tools to validate dual-core AUTOSAR integration per ISO 26262 Part 6.
What debug interface does SPC5675KF0MMM2 provide for safety verification?
SPC5675KF0MMM2 features Nexus Class 3+ debug, supporting real-time trace of both e200z7d cores, SRAM port transactions, and safety module registers (FCCU, RCCU, STM). This enables full visibility into lock-step divergence events, memory error correction logs, and interrupt latency profiling - essential for ISO 26262 tool qualification and ASIL D software certification audits.
SPC5675KF0MMM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KF0MMM2 FAQ
1.How can I place an order for SPC5675KF0MMM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KF0MMM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KF0MMM2 reliable?
The price and inventory of SPC5675KF0MMM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KF0MMM2 is usually 5 days.
3.What payment methods are accepted for SPC5675KF0MMM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KF0MMM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KF0MMM2?
SPC5675KF0MMM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KF0MMM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KF0MMM2?
For technical support, including SPC5675KF0MMM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KF0MMM2 requirements.
6.How does Aetrix verify that SPC5675KF0MMM2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KF0MMM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KF0MMM2 meets industry standards.
7.What is the process for return or replacement of SPC5675KF0MMM2?
All SPC5675KF0MMM2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KF0MMM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KF0MMM2 part is unused and in its original packaging.
Return procedure for SPC5675KF0MMM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5675KF0MMM2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
