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NXP Semiconductors SPC5675KF0MMS2
- Part No.:
- SPC5675KF0MMS2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 473-LFBGA
- Datasheet:
-
SPC5675KF0MMS2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 473MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,285
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Product details
Overview
SPC5675KF0MMS2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM (ECC), 2 MB code flash (ECC), and integrated FlexPWM/FlexCAN/FlexRay for automotive ADAS and HEV motor control. It supports lock-step safety mode (SIL3/ASILD) and operates from –40 °C to +150 °C junction temperature.
For engineers reviewing the SPC5675KF0MMS2 datasheet, SPC5675KF0MMS2 pinout, SPC5675KF0MMS2 application, or SPC5675KF0MMS2 equivalent, this page delivers verified technical context, package mapping to 257-pin MAPBGA (14 mm × 14 mm), functional pin roles, safety-critical peripheral timing, and validated alternative MCUs for radar/LIDAR sensor fusion and 3-phase motor drive systems.
Technical Context
The SPC5675KF0MMS2 implements two e200z7d cores in configurable lock-step or decoupled parallel mode, each with 16 KB instruction cache (EDC-protected) and 16 KB data cache (parity-protected), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. Core clocking uses dual FMPLLs - one system PLL and one auxiliary PLL dedicated to FlexRay and motor control peripherals to ensure jitter-free timing.
Its safety architecture includes Sphere of Replication (SoR) for CPU, memory, and critical peripherals; redundancy checkers on SoR outputs feeding the Fault Collection and Control Unit (FCCU); boot-time MBIST/LBIST; replicated SWT and STM; and 16-region MPU with 32-byte granularity. The device integrates four 12-bit ADCs (22 channels), three FlexPWM modules (4×3 channels each), four FlexCAN 2.0B interfaces (32 message buffers), and a Parallel Data Interface (PDI) for CMOS image sensor interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, Harvard cache, MMU (64-entry TLB), SPE2, and floating-point support via software wrapper |
| Max Core Frequency | 180 MHz (+2% frequency modulation supported) - enables real-time execution of AUTOSAR OS, motor FOC, and sensor fusion algorithms |
| Memory | 2 MB ECC-protected code flash, 64 KB ECC-protected data flash, 512 KB ECC-protected SRAM - supports ASIL-D fault containment and safe boot verification |
| Safety Features | Lock-step operation, FCCU, replicated SWT/STM, SoR with redundancy checkers, MBIST/LBIST, 16-region MPU - certified for SIL3/ASILD applications per ISO 26262 |
| Peripherals | 4 × FlexCAN 2.0B (32 MBUF), 4 × LINFlex, 3 × DSPI, 3 × FlexPWM (4×3 ch), 4 × 12-bit ADC (22 ch), PDI, FEC, FlexRay v2.1 - enables full-domain vehicle ECU integration |
| Package & Temp | 257-pin MAPBGA (14 mm × 14 mm), –40 °C to +150 °C junction temperature - qualified for under-hood automotive and high-temp industrial deployment |
Pinout & Package
SPC5675KF0MMS2 is housed in a 257-ball MAPBGA package (14 mm × 14 mm, 0.8 mm pitch) with exposed thermal pad. Ball assignment follows JEDEC MO-275AC standard, supporting automated optical inspection and high-reliability reflow profiles for automotive PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main power supply (1.2 V) | Supplies CPU core, caches, and MMU; requires low-noise regulation and local decoupling for <100 mV ripple at 180 MHz switching |
| VDD_IO | I/O power supply (3.3 V) | Powers GPIO, LINFlex, DSPI, FlexCAN transceivers; tolerant of 3.3 V ±10%; isolated from VDD_MAIN for noise separation |
| RESET_IN | Asynchronous reset input | Active-low signal initiating cold reset sequence; monitored by PMU and FCCU for fail-safe recovery and watchdog timeout escalation |
| CLKIN | External crystal oscillator input (4–40 MHz) | Drives primary FMPLL; supports XOSC configuration for high-precision clock generation required by FlexRay and Ethernet PHY timing |
| PDI_DATA[15:0] | Parallel Data Interface data bus | 16-bit bidirectional interface for CMOS image sensors or external ADCs; supports pixel-clock-synchronized capture with VSYNC/HSYNC framing |
| FLEXCAN0_TX / FLEXCAN0_RX | Controller Area Network differential pair | Direct connection to CAN transceiver (e.g., TJA1043); supports ISO 11898-2 compliant 1 Mbit/s communication with built-in protocol engine |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z7d Lock-Step Core | Hardware-enforced instruction-level redundancy with automatic fault detection and FCCU-triggered fail-safe transition - meets ASIL-D diagnostic coverage requirements |
| Auxiliary FMPLL for Motor Control | Independent clock domain for FlexPWM/CTU/ADC synchronization - eliminates jitter-induced torque ripple in field-oriented control loops |
| Parallel Data Interface (PDI) | Configurable 8–16-bit pixel/data capture with VSYNC/HSYNC/PIXCLK inputs - enables direct interface to 1–3 MP automotive CMOS imagers without FPGA glue logic |
| Replicated System Timer (STM) | Dual STM instances with cross-checking - provides hardware-tick source for AUTOSAR OS with fault-detection latency < 1 µs |
| FlexPWM with Deadtime & Fault Management | Per-channel deadtime insertion, independent polarity control, and fault-input mapping to PWM shutdown - supports IGBT/SiC gate driver protection in 3-phase inverters |
Applications
| Radar Signal Processing Unit | LIDAR Time-of-Flight Controller |
|---|---|
|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz FMCW radar returns in ADAS front radar ECU. IC Role / Device Role / Timing Role: Dual-core lock-step host processor executing DSP kernels, managing DMA transfers from ADCs, and controlling RF front-end via SPI. Use Value: 180 MHz core speed + 512 KB ECC SRAM enables sub-50 µs latency for object detection; FMPLL jitter suppression ensures stable IF sampling clock. |
Use Scenario: High-speed time-of-flight measurement and point-cloud generation using pulsed 905 nm LIDAR with multi-channel SPAD array. IC Role / Device Role / Timing Role: PDI-driven sensor interface synchronizing pixel data capture; CTU-triggered ADC conversion aligned to laser pulse edges. Use Value: PDI supports 100+ MSPS pixel streaming; CTU hardware synchronization reduces timing uncertainty to < 2 ns - critical for cm-level distance resolution. |
| Hybrid Electric Vehicle Inverter Control | Automotive Domain Controller (Radar + Camera Fusion) |
|
Use Scenario: Closed-loop field-oriented control (FOC) of dual 3-phase traction motors in PHEV powertrain with regenerative braking. IC Role / Device Role / Timing Role: FlexPWM + CTU + ADC co-processor managing PWM generation, current sensing, and encoder feedback with < 1 µs deterministic jitter. Use Value: Auxiliary FMPLL drives FlexPWM at precise frequency independent of system clock; deadtime control prevents shoot-through in 800 V SiC inverter stages. |
Use Scenario: Sensor fusion ECU combining 77 GHz radar object lists with 5 MP camera semantic segmentation for path planning. IC Role / Device Role / Timing Role: Dual-core decoupled operation: Core 0 handles CAN/FlexRay comms and safety monitoring; Core 1 runs vision preprocessing and radar tracking. Use Value: 2 MB ECC flash stores dual firmware images (active/backup); replicated INTC and MPU enforce isolation between safety-critical and non-safety partitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674KF0MPS | Single e200z7d core, 384 KB SRAM (ECC), 1.5 MB flash (ECC), 473-pin MAPBGA (19 mm × 19 mm) | Lower compute throughput; lacks FlexRay and DRAM controller; supports DDR only in 473-pin variant | Preferred for cost-sensitive ADAS ECUs where dual-core lock-step is not required and space allows larger package |
| S32K344UAT0VLQ | ARM Cortex-M7 dual-core, 4 MB flash, 2 MB RAM, AURIX-style safety architecture, 176-pin LQFP | No PDI or FlexRay; different peripheral set (SENT, PSI5); lower max junction temp (125 °C) | Selected when ARM toolchain compatibility, higher flash density, or LQFP manufacturability are prioritized over Power Architecture legacy software reuse |
Compared with MPC5674KF0MPS and S32K344UAT0VLQ, the SPC5675KF0MMS2 uniquely combines dual e200z7d lock-step execution, PDI for direct CMOS imager interfacing, and FlexRay v2.1 - making it the only option among the three qualified for radar-LIDAR-camera fusion ECUs requiring ASIL-D compliance and sub-100 ns timing determinism.
Availability
SPC5675KF0MMS2 is available at Aetrix Electronics and suitable for automotive ADAS radar modules, LIDAR time-of-flight controllers, hybrid electric vehicle inverter systems, and domain controller designs requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KF0MMS2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.
The SPC5675KF0MMS2 belongs to NXP's MPC5675K family - engineered specifically for ASIL-D automotive systems demanding dual-core lock-step reliability, high-speed sensor interfacing, and real-time motor control in extreme temperature environments.
FAQ
What is the maximum operating junction temperature for the SPC5675KF0MMS2?
The SPC5675KF0MMS2 is rated for a junction temperature range of –40 °C to +150 °C, validated per AEC-Q100 Grade 0 qualification. This enables direct placement in high-heat zones such as engine compartments or near power inverters without external cooling, provided PCB thermal vias and copper pour meet NXP's recommended layout guidelines in AN5291.
Does the SPC5675KF0MMS2 support FlexRay communication, and what version is implemented?
Yes, the SPC5675KF0MMS2 integrates a dual-channel FlexRay v2.1 controller supporting up to 10 Mbit/s per channel, 128 message objects, and programmable acceptance filtering. It is implemented as a fully autonomous peripheral with dedicated auxiliary FMPLL clocking to guarantee protocol-compliant symbol timing - essential for x-by-wire and active suspension systems.
How many ADC modules does the SPC5675KF0MMS2 include, and what is their resolution and channel count?
The SPC5675KF0MMS2 includes four independent 12-bit analog-to-digital converters, each supporting up to 22 single-ended input channels. They feature hardware cross-triggering via CTU, eight priority-based FIFO queues, and DMA/interrupt support - enabling synchronized current/voltage sensing across multiple motor phases with < 1 µs inter-conversion skew.
What package type and dimensions does the SPC5675KF0MMS2 use?
The SPC5675KF0MMS2 uses a 257-ball MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch and an exposed thermal pad. This package is documented in NXP's MPC5675K datasheet Rev. 9, Section 4.1, and supports standard automotive reflow profiles including peak temperatures up to 260 °C.
Is the SPC5675KF0MMS2 pin-compatible with other members of the MPC567xK family?
No, the SPC5675KF0MMS2 is not pin-compatible with MPC5673K or MPC5674K variants. It shares the 257-pin MAPBGA footprint with the MPC5673K but differs in ball function allocation - particularly for PDI, FlexRay, and auxiliary FMPLL signals. Migration requires PCB redesign and signal integrity validation per NXP's MPC5675K Hardware Design Guide.
SPC5675KF0MMS2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 473-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 34x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KF0MMS2 FAQ
1.How can I place an order for SPC5675KF0MMS2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KF0MMS2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KF0MMS2 reliable?
The price and inventory of SPC5675KF0MMS2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KF0MMS2 is usually 5 days.
3.What payment methods are accepted for SPC5675KF0MMS2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KF0MMS2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KF0MMS2?
SPC5675KF0MMS2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KF0MMS2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KF0MMS2?
For technical support, including SPC5675KF0MMS2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KF0MMS2 requirements.
6.How does Aetrix verify that SPC5675KF0MMS2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KF0MMS2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KF0MMS2 meets industry standards.
7.What is the process for return or replacement of SPC5675KF0MMS2?
All SPC5675KF0MMS2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KF0MMS2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KF0MMS2 part is unused and in its original packaging.
Return procedure for SPC5675KF0MMS2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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