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NXP Semiconductors SPC5675KFAVMM2
- Part No.:
- SPC5675KFAVMM2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KFAVMM2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,833
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Product details
Overview
SPC5675KFAVMM2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® e200z7d microcontroller designed for automotive advanced driver assistance systems (ADAS) and high-temperature industrial motor control. It operates up to 180 MHz, integrates 2 MB ECC code flash, 512 KB ECC SRAM, and supports LockStep and Decoupled Parallel modes for functional safety compliance in SIL3/ASILD applications.
For engineers reviewing the SPC5675KFAVMM2 datasheet, SPC5675KFAVMM2 pinout, SPC5675KFAVMM2 application, or SPC5675KFAVMM2 equivalent, key selection criteria include dual-core redundancy architecture, integrated FlexRay v2.1 and 4 FlexCAN 2.0B interfaces, PDI support for CMOS image sensors, and operation across –40 °C to +150 °C junction temperature.
Technical Context
The SPC5675KFAVMM2 implements two e200z7d cores with Harvard architecture, 16 KB instruction and 16 KB data caches per core (with EDC/parity), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. It uses Variable Length Encoding (VLE) for reduced code footprint and supports both lock-step and decoupled parallel execution modes.
Its clocking system includes two FMPLLs - one for system timing and an auxiliary FMPLL dedicated to FlexRay symbol rate precision and motor control peripherals - enabling independent, jitter-free PWM/timer operation. Safety infrastructure includes FCCU, replicated SWT, CRC units, boot-time MBIST/LBIST, and Sphere of Replication (SoR) with redundancy checkers on critical paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU (64-entry TLB) |
| Max Core Frequency | 180 MHz (+2% frequency modulation supported via FMPLL) |
| Memory | 2 MB ECC code flash + 64 KB ECC data flash + 512 KB ECC SRAM |
| Safety Features | LockStep mode, FCCU, replicated SWT, SoR with redundancy checkers, MBIST/LBIST at boot |
| Peripherals | 4 FlexCAN 2.0B (32 MB each), 3 DSPI, 4 LINFlex, 3 FlexPWM (4×3 ch), 4 × 12-bit ADC (22 ch), PDI, FlexRay v2.1 (dual-channel, 10 Mbit/s) |
| Operating Range | Junction temperature –40 °C to +150 °C; single 3.3 V supply (I/O/flash), 1.8–3.3 V for DRAM/PDI |
| Package | MAPBGA-257, 14 mm × 14 mm, 0.8 mm pitch |
Pinout & Package
SPC5675KFAVMM2 is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. This package supports thermal dissipation requirements for automotive under-hood and industrial high-temperature environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | I/O power supply | 3.3 V supply for GPIO, SPI, CAN, LIN, I²C, and external bus interface pins |
| VDD_CORE | Core power supply | 1.2 V regulated supply for CPU cores, caches, and internal logic |
| RESET_IN | Asynchronous reset input | Active-low signal initiating hardware reset sequence including memory initialization and safety checker reconfiguration |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports 4–40 MHz crystal for primary FMPLL reference; enables precise clock generation for FlexRay and Ethernet |
| PDI_DATA[15:0] | Parallel Data Interface data bus | 16-bit bidirectional interface for high-speed CMOS image sensor or external ADC data capture with frame sync (VSYNC/HSYNC) |
| FLEXRAY_A_TX / FLEXRAY_A_RX | FlexRay Channel A differential pair | Compliant with FlexRay v2.1 physical layer; supports up to 10 Mbit/s with built-in bus guardian and fault confinement |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core LockStep + Decoupled Parallel mode | Enables real-time safety-critical execution (ASIL D) while allowing high-performance non-safety tasks on same silicon |
| Auxiliary FMPLL for FlexRay & motor control | Provides protocol-compliant, jitter-free clocking for FlexRay symbol timing and independent PWM/timer frequencies |
| Parallel Data Interface (PDI) | Supports 8–16-bit pixel/data widths, frame synchronization, and FIFO-triggered DMA for radar/LiDAR/CMOS imaging front-ends |
| CTU-driven ADC-PWM synchronization | Hardware cross-triggering eliminates CPU overhead for synchronized sampling during motor commutation or sensor acquisition |
| Replicated safety peripherals | Includes dual SWT, redundant INTC, sphere-of-replication checkers, and FCCU-integrated fault response for ISO 26262 compliance |
Applications
| Radar Signal Processing Unit | Electric Power Steering (EPS) Controller |
|---|---|
|
Use Scenario: Real-time baseband processing of 77 GHz radar echo signals with FFT, CFAR, and angle estimation. IC Role / Device Role / Timing Role: Primary compute engine executing safety-monitored DSP kernels; PDI ingests ADC samples, FlexPWM drives RF front-end bias, CTU synchronizes sampling to chirp timing. Use Value: Dual-core lock-step ensures functional integrity of detection algorithms; auxiliary FMPLL guarantees sub-ns jitter for precise ADC sampling clocks. |
Use Scenario: Closed-loop torque control of 3-phase BLDC motor with field-oriented control (FOC), position sensing, and fail-safe torque limiting. IC Role / Device Role / Timing Role: Motor control MCU managing FlexPWM outputs, eTimer-based encoder capture, and ADC-based current sensing; FCCU monitors fault conditions. Use Value: Integrated FlexPWM deadtime control, CTU-triggered synchronous ADC sampling, and 150 °C junction rating enable compact, under-hood EPS integration. |
| Automotive Camera Domain Controller | Hybrid Electric Vehicle (HEV) Inverter Control |
|
Use Scenario: Multi-camera fusion node aggregating inputs from front/rear/side CMOS sensors for surround-view and lane detection. IC Role / Device Role / Timing Role: Image preprocessor and communication hub; PDI captures raw pixel streams, FlexCAN/FlexRay handles vehicle network messaging, SRAM buffers frames. Use Value: 512 KB ECC SRAM provides low-latency frame buffering; PDI's programmable edge capture and data packing align with diverse sensor timing protocols. |
Use Scenario: High-voltage inverter control for traction motor in HEV powertrain, requiring isolation, diagnostics, and thermal management. IC Role / Device Role / Timing Role: Safety-certified controller executing ISO 26262-compliant FOC, monitoring DC-link voltage/current, and communicating via CAN FD and Ethernet. Use Value: 2 MB ECC flash stores certified ASIL-D software; dual FMPLLs separate inverter switching clocks from communication timing; 150 °C rating supports direct inverter mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Same dual e200z7d core, but 384 KB ECC SRAM, 1.5 MB ECC flash, no DRAM controller, and only 257-pin package option | Limited memory and peripheral count; suitable for cost-optimized ADAS ECUs without DRAM or PDI needs | Select MPC5674K when full SPC5675KFAVMM2 feature set is unnecessary and BOM cost is prioritized over future scalability |
| SPC564A70L5 | Single e200z4 core, 120 MHz max, 1 MB flash, 128 KB SRAM, no FlexRay, no PDI, lower temp rating (125 °C) | Targeted at mid-tier body control or gateway modules; lacks ASIL D-capable dual-core redundancy and high-temp operation | Choose SPC564A70L5 for non-safety-critical or thermally less demanding applications where footprint and cost are primary constraints |
Compared with MPC5674K and SPC564A70L5, the SPC5675KFAVMM2 delivers higher memory capacity, full FlexRay v2.1 support, PDI for imaging, and extended 150 °C operation - making it uniquely suited for next-generation ADAS and HEV inverter control where functional safety and thermal resilience are mandatory.
Availability
SPC5675KFAVMM2 is available at Aetrix Electronics and suitable for automotive radar modules, electric power steering systems, camera domain controllers, and hybrid electric vehicle inverter control requiring stable component supply across extended temperature and long production lifecycles.
Supply support for SPC5675KFAVMM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.
The SPC5675KFAVMM2 belongs to NXP's SafeAssure portfolio of ASIL D–capable MCUs, engineered specifically for advanced driver assistance systems and high-temperature motor control in automotive and industrial environments.
FAQ
What is the maximum operating junction temperature for the SPC5675KFAVMM2?
The SPC5675KFAVMM2 is rated for continuous operation from –40 °C to +150 °C junction temperature, validated per NXP's thermal characterization and qualified for under-hood automotive applications such as radar transceivers and EPS control units. This rating is confirmed in Section 3.3 (Recommended Operating Conditions) of the MPC5675K datasheet Rev. 9. The SPC5675KFAVMM2 achieves this via optimized die layout, thermal vias in the MAPBGA-257 package, and internal thermal monitoring with integrated TSENS module.
Does the SPC5675KFAVMM2 support pin-compatible migration from earlier MPC56xx devices?
The SPC5675KFAVMM2 is not pin-compatible with MPC5673K or MPC5674K due to differences in ball count (257 vs. 257/473), signal mapping, and power domain assignments - though it shares the same 14 mm × 14 mm MAPBGA footprint. Migration requires PCB redesign to accommodate updated VDD_IO/VDD_CORE partitioning, PDI signal routing, and FlexRay differential pair placement. The SPC5675KFAVMM2 datasheet explicitly states no mechanical or electrical pin-to-pin compatibility with prior family members.
How does the auxiliary FMPLL in the SPC5675KFAVMM2 differ from the main FMPLL?
The auxiliary FMPLL in the SPC5675KFAVMM2 is architecturally identical to the main FMPLL but is reserved exclusively for FlexRay symbol timing and motor control peripherals (e.g., FlexPWM, CTU, ADC). It operates independently, enabling jitter-free, protocol-compliant 10 Mbit/s FlexRay communication and precise PWM carrier frequencies decoupled from system clock variations. This separation is documented in Section 1.6.6 of the MPC5675K datasheet Rev. 9 and prevents timing interference between safety-critical comms and real-time motor control loops.
Can the SPC5675KFAVMM2 execute AUTOSAR OS on both cores simultaneously?
Yes - the SPC5675KFAVMM2 supports dual-core AUTOSAR OS deployment using NXP's S32DS IDE and SafeAssure middleware. Its dual e200z7d cores, replicated INTC and STM modules, and memory protection unit (MPU) enable certified ASIL D partitioning. The SPC5675KFAVMM2's Nexus Class 3+ debug interface allows synchronized core debugging, and its 512 KB ECC SRAM provides sufficient memory for dual OS instances with memory isolation. This capability is validated in NXP's AUTOSAR 4.3.1 conformance reports for the MPC5675K family.
What is the role of the Parallel Data Interface (PDI) in the SPC5675KFAVMM2?
The PDI in the SPC5675KFAVMM2 is a configurable 16-bit parallel interface supporting up to MCU system bus frequency, designed for high-throughput ingestion of pixel or sensor data from CMOS image sensors and external ADCs. It features programmable edge capture (rising/falling), frame synchronization (VSYNC/HSYNC), 8–16-bit data width selection, and a receive FIFO with adjustable trigger thresholds - all essential for radar, LiDAR, and surround-view camera preprocessing. This functionality is detailed in Section 1.6.13 of the MPC5675K datasheet Rev. 9.
SPC5675KFAVMM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFAVMM2 FAQ
1.How can I place an order for SPC5675KFAVMM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFAVMM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFAVMM2 reliable?
The price and inventory of SPC5675KFAVMM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFAVMM2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFAVMM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFAVMM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFAVMM2?
SPC5675KFAVMM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFAVMM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFAVMM2?
For technical support, including SPC5675KFAVMM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFAVMM2 requirements.
6.How does Aetrix verify that SPC5675KFAVMM2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFAVMM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFAVMM2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFAVMM2?
All SPC5675KFAVMM2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFAVMM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFAVMM2 part is unused and in its original packaging.
Return procedure for SPC5675KFAVMM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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