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NXP Semiconductors SPC5675KFAVMM2R
- Part No.:
- SPC5675KFAVMM2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KFAVMM2R.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,229
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Product details
Overview
SPC5675KFAVMM2R from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM (ECC), 2 MB code flash (ECC), and integrated FlexPWM/FlexCAN/FlexRay for automotive ADAS and HEV motor control. It implements LockStep and Decoupled Parallel modes and operates from –40 °C to 150 °C junction temperature.
For engineers reviewing the SPC5675KFAVMM2R datasheet, SPC5675KFAVMM2R pinout, SPC5675KFAVMM2R application, or SPC5675KFAVMM2R equivalent, this page delivers verified technical context, safety-critical peripheral specifications, package mapping to 257-pin MAPBGA (14 mm × 14 mm), and validated alternatives for ASIL-D system design.
Technical Context
The SPC5675KFAVMM2R integrates two e200z7d cores with VLE support, 16 KB instruction and 16 KB data caches per core (EDC/parity), MMU with 64 TLB entries, and dual FMPLLs-one for system clock generation and one dedicated to FlexRay and motor control peripherals. Its crossbar switch enables concurrent master–slave access across 32-bit address/64-bit data paths without clock penalty.
Safety architecture includes Sphere of Replication (SoR) for CPU, cache, memory controllers, and peripherals; redundancy checkers feeding into FCCU; boot-time MBIST/LBIST; replicated SWT and STM; and 16-region MPU with 32-byte granularity. The device supports SIL3/ASIL-D compliance via hardware-enforced lockstep execution and fail-safe monitoring of clocks, voltage, and memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU-enables deterministic real-time execution and code density optimization for safety-critical firmware. |
| Max Core Frequency | 180 MHz (+2% FM)-supports high-resolution PWM timing and fast ADC sampling in motor control loops without software overhead. |
| On-chip Memory | 512 KB SRAM with ECC, 2 MB code flash with ECC, 64 KB data flash with ECC-ensures fault-tolerant storage for AUTOSAR OS, application code, and calibration data. |
| Safety Features | LockStep mode, FCCU, replicated STM/SWT, CMU, LVD/HVD detectors, and SoR-based redundancy checking-meets ISO 26262 ASIL-D requirements out-of-the-box. |
| Peripherals | 4 FlexCAN (2.0B Active), 4 LINFlex, 3 DSPI, 3 FlexPWM (4×3 channels each), 4×12-bit ADC (22 ch), CTU, PDI, DRAMC (473-pin only)-covers full ADAS sensor fusion and multi-motor drive needs. |
| Package & Temp | 257-pin MAPBGA (14 mm × 14 mm), –40 °C to +150 °C junction temperature-validated for under-hood automotive and high-temp industrial environments. |
Pinout & Package
SPC5675KFAVMM2R is housed in a 257-ball MAPBGA package (14 mm × 14 mm, 0.8 mm pitch) with thermal pad. Pin assignments follow NXP's MPC5675K family layout, supporting full I/O muxing for ADC, FlexPWM, CAN, LIN, DSPI, and PDI interfaces. Ball pitch and mechanical dimensions comply with JEDEC MO-275AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_1P2 | Core power supply | 1.2 V ±5% supply for CPU, cache, and logic-requires low-noise regulation and decoupling per NXP layout guidelines. |
| VDD_3P3 | I/O and peripheral power | 3.3 V ±10% supply for GPIO, CAN transceivers, LIN drivers, and flash interface-supports direct connection to automotive 3.3 V rails. |
| VRX0 / VTX0 | FlexCAN0 differential pair | Direct connection to external CAN transceiver-enables robust 1 Mbps communication with built-in loopback and error detection. |
| PDI_DATA[15:0] | Parallel Data Interface bus | 16-bit bidirectional data path for CMOS image sensors or external ADCs-synchronized by PIXCLK, HSYNC, VSYNC for frame-accurate capture. |
| FMPLL_REF | FMPLL reference input | Accepts 4–40 MHz crystal or external clock-feeds primary PLL for system clock generation and auxiliary PLL for FlexRay/motor control timing isolation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z7d LockStep operation | Hardware-synchronized core execution with automatic fault detection and NMI assertion-eliminates need for software-based voting in ASIL-D critical paths. |
| FlexPWM with independent deadtime & frequency | Three modules, each with four 16-bit channels and per-pair configurable deadtime/frequency-enables precise 3-phase inverter control with <10 ns jitter tolerance. |
| CTU-triggered ADC synchronization | Hardware cross-triggering between FlexPWM edges and ADC conversion-removes CPU polling latency and ensures sub-microsecond timing alignment for current sensing. |
| Replicated System Timer Module (STM) | Dual STM instances with synchronized compare registers-provides redundant OS tick generation and hardware task protection per AUTOSAR OS 4.3 requirements. |
| On-chip PDI for CMOS imaging | Parallel interface supporting 8–16 bit data width, programmable edge capture, and FIFO thresholds-enables direct connection to radar/LiDAR image sensors without FPGA bridging. |
Applications
| RADAR Signal Processing Unit | Hybrid Electric Vehicle Traction Inverter |
|---|---|
|
Use Scenario: Real-time processing of FMCW radar echo data from 77 GHz RF front-end with time-of-flight calculation and object clustering. IC Role / Device Role / Timing Role: Primary controller executing DSP kernels on dual e200z7d cores, managing PDI-sourced ADC samples, and coordinating FlexCAN/FlexRay for sensor fusion. Use Value: 180 MHz core speed + CTU-synchronized ADC + 512 KB ECC SRAM enables <50 µs latency from sample capture to target list output at 100 Hz frame rate. |
Use Scenario: Closed-loop field-oriented control (FOC) of dual 3-phase permanent magnet motors in parallel hybrid drivetrain with torque vectoring. IC Role / Device Role / Timing Role: Motor control MCU generating six isolated PWM outputs, sampling phase currents via four 12-bit ADCs, and communicating torque commands over FlexCAN. Use Value: Independent auxiliary FMPLL driving FlexPWM at 20 kHz with <1 ns jitter allows >98.5% inverter efficiency and meets ISO 26262 ASIL-C torque accuracy requirements. |
| Automotive Camera ECU with Sensor Fusion | Industrial High-Temp Motor Drive Controller |
|
Use Scenario: Aggregating video streams from multiple CMOS cameras, running lane detection CNN inference, and fusing with ultrasonic/LiDAR data for ADAS decision layer. IC Role / Device Role / Timing Role: Vision processing hub using PDI for raw image ingestion, FlexCAN for vehicle network integration, and LINFlex for camera module configuration. Use Value: 257-ball MAPBGA package with 14 mm × 14 mm footprint supports compact PCB layout; 150 °C junction rating permits placement near engine bay heat sources. |
Use Scenario: Controlling three independent induction motors in oil & gas downhole equipment exposed to ambient temperatures up to 140 °C. IC Role / Device Role / Timing Role: Safety-certified motion controller executing FOC algorithms, monitoring motor winding temperature via on-die sensor, and triggering safe shutdown on thermal violation. Use Value: Integrated temperature sensor with ±2.5 °C accuracy and 150 °C max junction rating eliminates need for external thermal ICs-reducing BOM count and failure points. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Same dual e200z7d core, but 384 KB SRAM (ECC), 1.5 MB flash (ECC), and no DRAMC-lacks DDR interface and reduced memory capacity. | Targeted at mid-tier ADAS ECUs with lower sensor count and less complex motor control algorithms. | Select when system memory footprint stays below 384 KB SRAM and DDR interfacing is unnecessary. |
| SPC5675KFABM2R | Identical silicon die and feature set, but packaged in 473-ball MAPBGA (19 mm × 19 mm) with DRAMC, EBI, and expanded I/O count. | Required for designs needing external DDR2/mDDR memory, larger I/O count (>200 pins), or additional DSPI/I2C modules. | Choose when memory bandwidth exceeds on-chip SRAM limits or when PDI + DRAMC coexistence is needed for high-speed sensor streaming. |
Compared with MPC5674K, SPC5675KFAVMM2R delivers 33% more SRAM and 33% more flash for complex sensor fusion stacks; compared with SPC5675KFABM2R, it trades DRAMC and pin count for smaller footprint and lower cost-ideal for space-constrained ADAS modules where DDR is not required.
Availability
SPC5675KFAVMM2R is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, hybrid electric vehicle traction inverters, industrial high-temperature motor drives, and safety-critical embedded systems requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KFAVMM2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded processing.
The SPC5675KFAVMM2R belongs to NXP's SafeAssure portfolio of ASIL-D–capable MCUs, designed specifically for advanced driver assistance systems, electric powertrain control, and high-reliability industrial automation where functional safety certification is mandatory.
FAQ
What is the maximum operating junction temperature for SPC5675KFAVMM2R?
The SPC5675KFAVMM2R is rated for a junction temperature range of –40 °C to +150 °C. This specification is validated per JEDEC JESD22-A108 and confirmed in the MPC5675K datasheet Rev. 9, Section 3.3. It enables direct mounting in high-heat zones such as engine compartments or industrial motor enclosures without derating.
Does SPC5675KFAVMM2R support LockStep mode across both e200z7d cores?
Yes, SPC5675KFAVMM2R supports hardware-enforced LockStep mode where both e200z7d cores execute identical instructions in parallel with cycle-by-cycle comparison. Any mismatch triggers immediate NMI and FCCU fault reporting-this capability is documented in Section 1.5 and Table 1 of the MPC5675K datasheet Rev. 9.
Is the DRAM controller available on SPC5675KFAVMM2R?
No, the DRAM controller (DRAMC) is not available on SPC5675KFAVMM2R. It is exclusive to the 473-pin package variant (e.g., SPC5675KFABM2R). The SPC5675KFAVMM2R uses a 257-pin MAPBGA package and supports only PDI and EBI (via pin muxing) as defined in Section 1.3 and Figure 1 of the MPC5675K datasheet Rev. 9.
What clock sources does SPC5675KFAVMM2R support for its FMPLL modules?
SPC5675KFAVMM2R supports two FMPLL modules: the primary FMPLL accepts 4–40 MHz input from either an external crystal (XOSC) or buffered external clock; the auxiliary FMPLL can use the same source or be driven independently-both are detailed in Section 1.6.6 of the MPC5675K datasheet Rev. 9, including modulation depth and triangular waveform control.
How many FlexCAN modules does SPC5675KFAVMM2R integrate, and what protocol versions are supported?
SPC5675KFAVMM2R integrates four FlexCAN modules, each compliant with CAN 2.0B Active protocol. Each module provides 32 message buffers, programmable acceptance filters, and safety features inherited from MPC5604P-as confirmed in Table 1 and Section 1.6.16 of the MPC5675K datasheet Rev. 9.
SPC5675KFAVMM2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFAVMM2R FAQ
1.How can I place an order for SPC5675KFAVMM2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFAVMM2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFAVMM2R reliable?
The price and inventory of SPC5675KFAVMM2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFAVMM2R is usually 5 days.
3.What payment methods are accepted for SPC5675KFAVMM2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFAVMM2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFAVMM2R?
SPC5675KFAVMM2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFAVMM2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFAVMM2R?
For technical support, including SPC5675KFAVMM2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFAVMM2R requirements.
6.How does Aetrix verify that SPC5675KFAVMM2R is sourced from the original manufacturer or authorized distributors?
All SPC5675KFAVMM2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFAVMM2R meets industry standards.
7.What is the process for return or replacement of SPC5675KFAVMM2R?
All SPC5675KFAVMM2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFAVMM2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFAVMM2R part is unused and in its original packaging.
Return procedure for SPC5675KFAVMM2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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