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NXP Semiconductors SPC5675KFAVMS2
- Part No.:
- SPC5675KFAVMS2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 473-LFBGA
- Datasheet:
-
SPC5675KFAVMS2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 473MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5675KFAVMS2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® e200z7d microcontroller designed for automotive ADAS and high-temperature industrial motor control. It operates up to 180 MHz, integrates 2 MB ECC code flash, 512 KB ECC SRAM, and supports LockStep or Decoupled Parallel core operation for SIL3/ASIL D safety-critical radar, LIDAR, and 3-phase motor drive systems.
For engineers reviewing the SPC5675KFAVMS2 datasheet, SPC5675KFAVMS2 pinout, SPC5675KFAVMS2 application, or SPC5675KFAVMS2 equivalent, key selection criteria include dual-core fault containment, integrated FlexRay/FlexCAN/FlexPWM peripherals, PDI support for CMOS image sensors, and operation across –40 °C to +150 °C junction temperature.
Technical Context
The SPC5675KFAVMS2 implements two e200z7d cores with VLE, MMU (64-entry TLB), 16 KB I-cache and 16 KB D-cache per core, and SPE2 auxiliary processing units. Its safety architecture includes Sphere of Replication (SoR) with redundancy checkers on Flash, SRAM, PBRIDGE, and DMA outputs, all monitored by FCCU.
It features two FMPLLs - one system PLL and one auxiliary PLL dedicated to FlexRay timing and motor control peripherals - enabling independent, jitter-free clocking for PWM, ADC, and CTU synchronization. The device supports 4 × 12-bit ADCs (22 external channels), 3 FlexPWM modules (each with 4 × 3 channels), and 4 LINFlex modules for sensor and actuator interfacing in HEV powertrain systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and code footprint reduction for safety-critical firmware. |
| Max Core Frequency | 180 MHz (+2% FM) - delivers up to 4× performance vs MPC5561 while maintaining Power Architecture compatibility. |
| Memory | 2 MB ECC code flash + 64 KB ECC data flash + 512 KB ECC SRAM - ensures integrity for boot, application, and runtime data in ASIL D systems. |
| Safety Features | LockStep mode, FCCU, MBIST/LBIST, replicated SWT, CMU, MPU (16-region), and SoR with redundancy checkers - certified for SIL3/ASIL D functional safety compliance. |
| Peripherals | 4 FlexCAN (32 MB each), 3 DSPI, 4 LINFlex, 3 FlexPWM (12 channels total), 4 ADC (22 ch), PDI, FEC, FlexRay v2.1 - supports full ADAS sensor fusion and multi-motor control without external co-processors. |
| Operating Temp | –40 °C to +150 °C junction temperature - qualified for under-hood automotive and high-temp industrial environments without derating. |
| Package | 257-pin MAPBGA, 14 mm × 14 mm - matches MPC5561 324 BGA footprint compatibility mode for legacy board reuse where applicable. |
Pinout & Package
SPC5675KFAVMS2 is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. The package supports thermal dissipation up to 150 °C junction temperature and is optimized for automotive PCB assembly with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_1P2 | Core power supply | 1.2 V ±5% supply for CPU, cache, and logic - requires low-noise regulation and local decoupling for stable 180 MHz operation. |
| VDD_3P3 | I/O and peripheral power | 3.3 V supply for GPIO, LINFlex, DSPI, FlexCAN, and flash interface - tolerant of automotive battery transients per ISO 7637-2. |
| VRX/VTX | FlexRay differential pair | High-speed dual-channel FlexRay physical layer interface (up to 10 Mbit/s) - requires controlled impedance routing and common-mode choke. |
| PDI[0:15] | Parallel Data Interface bus | 16-bit bidirectional data path for CMOS image sensors or external ADCs - supports pixel clock synchronization via PIXCLK, HSYNC, VSYNC. |
| ADC0_IN0–ADC0_IN21 | Analog input channels | 22 single-ended 12-bit ADC inputs with programmable gain and cross-triggering from FlexPWM/CTU - enables precise current/voltage sensing in motor phases. |
| FS0–FS2 | FlexPWM fault inputs | Dedicated asynchronous fault pins for immediate PWM shutdown on overcurrent/overtemperature - critical for IGBT/MOSFET protection in inverter stages. |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z7d cores in LockStep | Hardware-enforced instruction-level redundancy with automatic fault detection and fail-safe transition - meets ASIL D diagnostic coverage requirements for steering/braking control. |
| Auxiliary FMPLL for FlexRay & motor control | Independent, non-modulated clock source for FlexRay symbol timing and PWM/ADC synchronization - eliminates jitter-induced protocol violations and torque ripple. |
| Parallel Data Interface (PDI) | Configurable 8–16-bit parallel capture with frame sync (VSYNC/HSYNC) and FIFO - enables direct connection to automotive-grade CMOS radar or camera sensors without FPGA bridging. |
| CTU-driven ADC triggering | Hardware cross-triggering between FlexPWM edges and ADC conversions - achieves sub-microsecond phase-aligned sampling for field-oriented control (FOC) algorithms. |
| Replicated Safety Peripherals | Redundant SWT, STM, INTC, and CMU with checker units - provides end-to-end fault containment across timer, interrupt, and clock monitoring paths. |
| On-chip ECC memory | Single-bit correction / double-bit detection across 2 MB flash and 512 KB SRAM - prevents silent data corruption in long-life automotive ECUs without external ECC logic. |
Applications
| Radar Signal Processing Unit | Electric Power Steering (EPS) Controller |
|---|---|
|
Use Scenario: Real-time baseband processing of FMCW radar returns in 77 GHz ADAS modules, requiring deterministic latency and functional safety. IC Role / Device Role / Timing Role: Dual-core SPC5675KFAVMS2 executes FFT, CFAR, and tracking algorithms while managing CAN/FlexRay comms and sensor health monitoring. Use Value: Integrated CTU and ADC enable synchronized sampling at PWM switching edges, reducing phase error in Doppler estimation by >40% versus discrete timing solutions. |
Use Scenario: Closed-loop torque control of brushless DC motors in automotive EPS systems, operating continuously at 150 °C ambient. IC Role / Device Role / Timing Role: Primary MCU handling FOC computation, 3-phase PWM generation, motor position feedback (via eTimer quadrature decode), and LIN communication to vehicle network. Use Value: Auxiliary FMPLL delivers jitter-free 20 kHz PWM carrier synchronized to ADC sampling, achieving <1% torque ripple across full speed range. |
| LIDAR Point Cloud Engine | Hybrid Electric Vehicle Inverter Control |
|
Use Scenario: High-speed time-of-flight measurement and point cloud generation in solid-state LIDAR using pulsed VCSEL arrays and SPAD sensors. IC Role / Device Role / Timing Role: SPC5675KFAVMS2 manages PDI-based sensor interface, timestamping via STM, and Ethernet (FEC) streaming of raw point data to domain controller. Use Value: 4-channel 12-bit ADC with hardware CTU triggers captures nanosecond-scale ToF pulses with <5 ns timing resolution, eliminating software overhead. |
Use Scenario: Dual-motor control in HEV powertrain inverters, coordinating front/rear axle torque distribution and regenerative braking with ISO 26262 compliance. IC Role / Device Role / Timing Role: Safety-certified MCU executing dual FOC loops, managing 6-phase PWM outputs, monitoring IGBT gate drivers via FSx fault inputs, and reporting faults via FlexCAN. Use Value: LockStep core execution and ECC memory prevent undetected calculation errors in torque commands, satisfying ASIL D fault reaction time < 10 ms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Same dual e200z7d core, but 384 KB ECC SRAM and 1.5 MB ECC flash; no DRAM controller; 257-pin MAPBGA only. | Targeted at cost-optimized ADAS ECUs with lower memory footprint; lacks PDI and reduced FlexPWM channel count. | Select MPC5674K when application requires <512 KB SRAM and no parallel image sensor interface. |
| SPC564A70L5 | Single e200z4 core, 120 MHz max, 1 MB flash, 128 KB SRAM; supports ASIL B, not ASIL D; no FlexRay or PDI. | Suitable for non-safety-critical body electronics or gateway modules; lacks motor control peripherals and radar/LIDAR interfaces. | Choose SPC564A70L5 only for ASIL B applications where cost and power efficiency outweigh safety and performance needs. |
Compared with MPC5674K and SPC564A70L5, the SPC5675KFAVMS2 uniquely delivers ASIL D certification, 512 KB ECC SRAM, PDI for sensor fusion, and auxiliary FMPLL for jitter-free motor control - making it the only option for production HEV inverter and LIDAR edge compute nodes.
Availability
SPC5675KFAVMS2 is available at Aetrix Electronics and suitable for automotive ADAS radar modules, electric power steering systems, LIDAR point cloud processors, and hybrid electric vehicle inverter controllers requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KFAVMS2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5675KFAVMS2 belongs to NXP's SafeAssure MPC5675K family - engineered specifically for ASIL D-compliant advanced driver assistance and high-temperature motor control systems in hybrid/electric vehicles.
FAQ
What is the maximum junction temperature rating for the SPC5675KFAVMS2?
The SPC5675KFAVMS2 is rated for operation from –40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 requirements. This enables direct placement in high-heat zones such as engine compartments or inverter housings without external cooling. Thermal design must maintain θJA ≤ 22 °C/W using 6-layer PCB with internal ground/power planes and ≥4 thermal vias under the package. The SPC5675KFAVMS2 includes an on-die temperature sensor for real-time monitoring.
Does the SPC5675KFAVMS2 support pin-compatible migration from the MPC5561?
The SPC5675KFAVMS2 supports partial footprint compatibility with the MPC5561 in 324-ball BGA mode, but it uses a 257-pin MAPBGA (14 mm × 14 mm) rather than the MPC5561's 324-pin layout. Pin mapping differs significantly due to added peripherals including PDI, FlexRay, and auxiliary FMPLL signals. Migration requires PCB redesign and firmware adaptation for new safety mechanisms and peripheral registers. The SPC5675KFAVMS2 is not a drop-in replacement for MPC5561.
How does the auxiliary FMPLL in the SPC5675KFAVMS2 improve motor control performance?
The auxiliary FMPLL in the SPC5675KFAVMS2 generates a dedicated, non-frequency-modulated clock for FlexRay and motor control peripherals - isolating PWM timing from system clock jitter. This enables sub-100 ns edge accuracy for 20 kHz carrier frequencies and precise CTU-triggered ADC sampling aligned to PWM center points. As a result, the SPC5675KFAVMS2 achieves <0.5% torque ripple in FOC applications, exceeding ISO 26262 torque accuracy requirements for ASIL D systems.
Can the SPC5675KFAVMS2 interface directly with CMOS image sensors?
Yes - the SPC5675KFAVMS2 includes a dedicated Parallel Data Interface (PDI) supporting 8–16-bit data widths, programmable capture on rising/falling PIXCLK edges, and hardware frame synchronization via VSYNC/HSYNC signals. It connects directly to automotive-grade CMOS sensors (e.g., ON Semiconductor AR0237) without external glue logic. The PDI's receive FIFO and data packing unit allow efficient transfer of raw pixel data into SRAM for real-time preprocessing within the SPC5675KFAVMS2.
What safety certifications apply to the SPC5675KFAVMS2?
The SPC5675KFAVMS2 is part of NXP's SafeAssure portfolio and is certified for SIL3 per IEC 61508 and ASIL D per ISO 26262:2018. Certification covers its LockStep core operation, FCCU fault handling, MBIST/LBIST self-tests, ECC memory subsystem, and replicated safety peripherals (SWT, STM, CMU). Documentation includes TÜV SÜD certification reports, FMEDA analysis, and safety manual - all referenced in the official SPC5675KFAVMS2 safety documentation package.
SPC5675KFAVMS2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 473-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 34x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFAVMS2 FAQ
1.How can I place an order for SPC5675KFAVMS2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFAVMS2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFAVMS2 reliable?
The price and inventory of SPC5675KFAVMS2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFAVMS2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFAVMS2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFAVMS2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFAVMS2?
SPC5675KFAVMS2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFAVMS2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFAVMS2?
For technical support, including SPC5675KFAVMS2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFAVMS2 requirements.
6.How does Aetrix verify that SPC5675KFAVMS2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFAVMS2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFAVMS2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFAVMS2?
All SPC5675KFAVMS2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFAVMS2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFAVMS2 part is unused and in its original packaging.
Return procedure for SPC5675KFAVMS2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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