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NXP Semiconductors SPC5675KFAVMS2R
- Part No.:
- SPC5675KFAVMS2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 473-LFBGA
- Datasheet:
-
SPC5675KFAVMS2R.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 473MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,750
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Product details
Overview
SPC5675KFAVMS2R from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM with ECC, 2 MB code flash with ECC, and integrated FlexPWM/FlexCAN/FlexRay for automotive ADAS and HEV motor control. It supports lock-step safety operation (ASIL D/SIL 3) and operates from –40 °C to 150 °C junction temperature.
For engineers reviewing the SPC5675KFAVMS2R datasheet, SPC5675KFAVMS2R pinout, SPC5675KFAVMS2R application, or SPC5675KFAVMS2R equivalent, key selection criteria include dual-core lock-step integrity, 4× 12-bit ADCs with CTU synchronization, 3× FlexPWM modules (4×16-bit channels each), 4× FlexCAN 2.0B interfaces, and MAPBGA-257 (14 mm × 14 mm) packaging for high-density automotive ECU layouts.
Technical Context
The SPC5675KFAVMS2R implements two e200z7d cores in configurable lock-step or decoupled parallel mode, each with 16 KB instruction cache (EDC-protected) and 16 KB data cache (parity-protected), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. It uses Harvard architecture with dual-issue execution and VLE instruction set for reduced code footprint.
Its safety architecture includes Sphere of Replication (SoR) for CPU, memory, and peripherals; redundancy checkers on PBRIDGE, Flash, SRAM, and DMA outputs; FCCU for fault collection; and hardware-triggered MBIST/LBIST at boot. Clocking relies on dual FMPLLs - one system, one auxiliary - supporting ±2% frequency modulation and independent FlexRay/motor control timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, lock-step or decoupled operation - enables ASIL-D functional safety compliance via hardware replication. |
| Max Core Frequency | 180 MHz (+2% FM) - delivers real-time deterministic performance for radar/LIDAR sensor fusion and 3-phase motor field-oriented control. |
| Memory | 2 MB code flash + 64 KB data flash (both with ECC); 512 KB SRAM (ECC) - ensures robust code storage and runtime data integrity in harsh automotive environments. |
| ADC System | 4 × 12-bit ADCs, 22 external channels, CTU-synchronized triggering - supports simultaneous sampling across multiple sensors (e.g., current/voltage/temperature in inverter stacks). |
| PWM Capability | 3 × FlexPWM modules, each with 4 × 16-bit channels, independent deadtime, complementary pair control - enables precise gate driving for dual 3-phase inverters or hybrid traction systems. |
| Communication | 4 × FlexCAN 2.0B (32 MBs each), 3 × DSPI, 4 × LINFlex, 3 × I2C, FlexRay v2.1 (dual-channel, 10 Mbit/s) - meets full vehicle network requirements including safety-critical CAN FD–compatible domains and time-triggered FlexRay backbone. |
| Package & Temp | MAPBGA-257 (14 mm × 14 mm), –40 °C to +150 °C junction - qualified for under-hood placement in HEV powertrain and ADAS radar modules. |
Pinout & Package
SPC5675KFAVMS2R is housed in a 257-ball MAPBGA package (14 mm × 14 mm, 0.8 mm pitch), optimized for thermal dissipation and signal integrity in automotive power electronics. Ball mapping follows JEDEC MO-270AB standard with dedicated power/ground arrays, differential clock inputs (XOSC), and function-multiplexed I/O banks supporting 3.3 V or 5 V tolerant ADC inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply (1.2 V) | Power domain for e200z7d cores, caches, and MMU - requires low-noise regulation and local decoupling per NXP layout guidelines. |
| VDD_IO | I/O supply (3.3 V) | Supplies GPIO, LINFlex, DSPI, and FlexCAN transceivers - supports mixed-voltage interfacing with legacy automotive peripherals. |
| ADC_VREFH / ADC_VREFL | Analog reference inputs | Defines 0–5 V or 0–3.3 V conversion range for all 4 ADCs - enables direct connection to shunt-based current sensing or battery voltage monitoring circuits. |
| XOSC_IN / XOSC_OUT | Crystal oscillator interface | Accepts 4–40 MHz fundamental-mode crystal - feeds primary FMPLL for system clock generation; critical for jitter-sensitive motor control timing. |
| FLEXRAY_A_TX / FLEXRAY_A_RX | FlexRay Channel A differential pair | Compliant with ISO 17458-4; supports 10 Mbit/s deterministic communication for x-by-wire applications without protocol stack overhead. |
| PDI_DATA[15:0] | Parallel Data Interface data bus | 16-bit bidirectional bus for CMOS image sensor or external ADC streaming - synchronized to PIXCLK/VSYNC for ADAS camera preprocessing. |
Key Features
| Feature | Design Value |
|---|---|
| LockStep Dual-Core Operation | Hardware-replicated e200z7d cores with real-time output comparison and FCCU fault reporting - eliminates single-point failures in safety-critical control loops. |
| Sphere of Replication (SoR) | Redundancy applied to CPU, caches, SRAM, Flash controller, and PBRIDGE - achieves >90% diagnostic coverage per ISO 26262 ASIL D requirements. |
| CTU-ADC-PWM Synchronization | Hardware cross-triggering unit coordinates ADC sampling, PWM edge updates, and eTimer captures within <100 ns jitter - enables precise current loop sampling aligned to PWM center pulses. |
| FlexPWM Independent Deadtime | Per-complementary-pair programmable deadtime (1–255 ns resolution) with independent top/bottom control - prevents shoot-through in SiC/GaN inverter designs. |
| On-Chip Bootloader | ROM-resident BAM supporting CAN/LIN serial boot - allows secure field firmware updates without external programming hardware in production ECUs. |
| Temperature Sensor Integration | Digital die-temperature sensor with ±2.5 °C accuracy over –40 °C to +150 °C - enables real-time thermal derating of motor torque or inverter switching frequency. |
Applications
| Radar Signal Processing Unit | Hybrid Electric Vehicle Traction Inverter |
|---|---|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz FMCW radar returns in front-facing ADAS modules. IC Role / Device Role / Timing Role: Primary compute engine executing sensor fusion algorithms, managing high-speed SPI-connected ADCs, and controlling RF front-end timing via eTimer-triggered DAC updates. Use Value: Dual-core lock-step ensures functional safety compliance while decoupled mode delivers 3× throughput boost for FFT kernels versus MPC5674K - reducing latency below 50 µs per chirp. |
Use Scenario: Closed-loop field-oriented control (FOC) of dual 3-phase permanent magnet motors in P2/P4 HEV architectures. IC Role / Device Role / Timing Role: Central motor controller synchronizing 6-phase PWM generation, 12-channel current/voltage ADC sampling, and CAN-based torque command arbitration. Use Value: CTU-synchronized ADC triggers and FlexPWM's half-cycle reload capability enable <1 µs current loop update - meeting ISO 26262 ASIL C timing constraints for torque error detection. |
| LIDAR Point Cloud Generation | Automotive Domain Controller (ADAS) |
Use Scenario: Time-of-flight (ToF) processing and point cloud stitching for 128-line mechanical LIDAR systems. IC Role / Device Role / Timing Role: High-bandwidth PDI interface ingests raw sensor data from CMOS SPAD arrays; eDMA offloads pixel processing to SRAM; FlexRay distributes processed points to central ECU. Use Value: 16-bit PDI operating at 100 MHz system bus rate sustains 1.6 Gbps sustained throughput - enabling full-resolution 128×1200 @ 20 Hz without frame dropping. |
Use Scenario: Centralized ADAS domain controller aggregating inputs from radar, camera, ultrasonic, and vehicle bus networks. IC Role / Device Role / Timing Role: Safety gateway managing 4× FlexCAN buses (chassis, powertrain, ADAS, infotainment), 3× DSPI links to radar SoCs, and Ethernet FEC for OTA updates. Use Value: Dual FMPLLs isolate FlexRay symbol timing (±50 ppm) from system clock jitter - ensuring deterministic 10 Mbit/s communication across 32-node FlexRay clusters per ISO 17458-4. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Single e200z7d core, 384 KB SRAM, 1.5 MB flash, no DRAMC, 257-pin MAPBGA only - lacks dual-core lock-step and FlexRay. | Targeted at non-safety-critical ADAS sub-modules (e.g., ultrasonic parking assist) where ASIL B suffices. | Select when cost sensitivity outweighs ASIL D requirement and FlexRay is unnecessary. |
| SPC58NG84C3 | Tri-core e200z7/z4/z7, 4 MB flash, 2 MB SRAM, ARM Cortex-M4 co-processor, 473-pin MAPBGA - higher integration but different architecture and toolchain. | Designed for next-gen zonal controllers requiring heterogeneous compute (real-time + application layer) and AUTOSAR Adaptive support. | Choose for future-proofing beyond ASIL D, especially where Linux/AUTOSAR Adaptive coexistence is required. |
Compared with MPC5674K, SPC5675KFAVMS2R adds lock-step dual-core safety, FlexRay, and larger memory - essential for radar/LIDAR fusion; compared with SPC58NG84C3, it offers mature Power Architecture tooling and lower BOM cost but lacks ARM co-processing and zonal networking features.
Availability
SPC5675KFAVMS2R is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), hybrid electric vehicle (HEV) powertrain control, and industrial motor drives requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for SPC5675KFAVMS2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety and secure processing.
The SPC5675KFAVMS2R belongs to NXP's SafeAssure portfolio of ASIL D–certified MCUs, engineered specifically for radar, LIDAR, and multi-motor control in automotive electrification and autonomous driving systems.
FAQ
What is the maximum operating junction temperature for the SPC5675KFAVMS2R?
The SPC5675KFAVMS2R is rated for continuous operation from –40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 qualification. This enables direct mounting on power modules in HEV traction inverters without additional heatsinking. Thermal derating curves and PCB copper pour recommendations are provided in Section 3.4 of the MPC5675K datasheet Rev. 9. The on-die temperature sensor in SPC5675KFAVMS2R provides real-time monitoring with ±2.5 °C accuracy across this full range.
Does the SPC5675KFAVMS2R support pin-compatible migration from the MPC5674K?
No, the SPC5675KFAVMS2R is not pin-compatible with the MPC5674K despite sharing the same 257-ball MAPBGA package footprint. Critical signal assignments differ - notably FlexRay, additional DSPI chip selects, and PDI pins are relocated or added. Migration requires PCB redesign and validation per NXP's MPC5675K Migration Guide (AN5422). SPC5675KFAVMS2R pinout is defined in Section 2.1 of the MPC5675K datasheet Rev. 9.
How does the Cross Triggering Unit (CTU) in the SPC5675KFAVMS2R improve motor control loop performance?
The CTU in SPC5675KFAVMS2R eliminates CPU intervention by hardware-synchronizing ADC conversions, FlexPWM period updates, and eTimer captures within a single PWM cycle. It supports up to 24 double-buffered ADC commands with sub-100 ns jitter, enabling center-aligned current sampling precisely at the PWM midpoint. This reduces current loop latency to <1 µs - critical for meeting ISO 26262 ASIL C timing constraints in high-speed PMSM control. Configuration is done via CTU registers in the SPC5675KFAVMS2R memory map.
What safety certifications apply to the SPC5675KFAVMS2R?
The SPC5675KFAVMS2R is certified to ISO 26262 ASIL D (hardware level) and IEC 61508 SIL 3 per NXP's SafeAssure documentation suite. Certification covers lock-step core operation, Sphere of Replication, FCCU fault handling, and hardware BIST (MBIST/LBIST). Functional safety documentation - including FMEDA, safety manual, and diagnostic software library - is available under NDA from NXP. SPC5675KFAVMS2R qualification evidence is documented in NXP's FS-SPC5675K-001 report.
Can the SPC5675KFAVMS2R execute both cores in decoupled mode while maintaining safety compliance?
Yes, the SPC5675KFAVMS2R supports decoupled parallel mode for non-safety-critical tasks (e.g., diagnostics, communication stack processing) while retaining lock-step operation for safety-critical functions (e.g., torque calculation, PWM generation). Mode selection is controlled via BAM and FCCU registers. Decoupled mode maintains ASIL D compliance only when safety-critical IP remains in lock-step - verified by NXP's SafeAssure safety manual. Full dual-core decoupled operation without lock-step is permitted only in non-automotive applications.
SPC5675KFAVMS2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 473-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 34x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFAVMS2R FAQ
1.How can I place an order for SPC5675KFAVMS2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFAVMS2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFAVMS2R reliable?
The price and inventory of SPC5675KFAVMS2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFAVMS2R is usually 5 days.
3.What payment methods are accepted for SPC5675KFAVMS2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFAVMS2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFAVMS2R?
SPC5675KFAVMS2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFAVMS2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFAVMS2R?
For technical support, including SPC5675KFAVMS2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFAVMS2R requirements.
6.How does Aetrix verify that SPC5675KFAVMS2R is sourced from the original manufacturer or authorized distributors?
All SPC5675KFAVMS2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFAVMS2R meets industry standards.
7.What is the process for return or replacement of SPC5675KFAVMS2R?
All SPC5675KFAVMS2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFAVMS2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFAVMS2R part is unused and in its original packaging.
Return procedure for SPC5675KFAVMS2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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