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NXP Semiconductors SPC5675KFF0MMM2
- Part No.:
- SPC5675KFF0MMM2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KFF0MMM2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,371
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Product details
Overview
SPC5675KFF0MMM2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® e200z7d microcontroller designed for automotive advanced driver assistance systems (ADAS) and high-temperature industrial motor control. It operates up to 180 MHz, integrates 2 MB ECC code flash, 512 KB ECC SRAM, and supports LockStep and Decoupled Parallel modes for functional safety compliance in SIL3/ASILD applications.
For engineers reviewing the SPC5675KFF0MMM2 datasheet, SPC5675KFF0MMM2 pinout, SPC5675KFF0MMM2 application, or SPC5675KFF0MMM2 equivalent, key selection considerations include its dual e200z7d core architecture, integrated FlexRay v2.1 and 4 FlexCAN 2.0B interfaces, 4×12-bit ADCs with CTU synchronization, and MAPBGA-257 (14 mm × 14 mm) packaging for radar, lidar, and multi-motor HEV powertrain control.
Technical Context
The SPC5675KFF0MMM2 implements two tightly or loosely coupled e200z7d cores with VLE, MMU (64-entry TLB), 16 KB I-cache and 16 KB D-cache per core, and SPE2 auxiliary processing units. Its safety architecture includes Sphere of Replication (SoR) with redundancy checkers on PBRIDGE, Flash, SRAM, and DMA outputs, monitored by FCCU and supported by hardware-triggered MBIST/LBIST at boot.
It features two FMPLLs - one system PLL and one auxiliary PLL dedicated to FlexRay symbol timing and motor control peripherals - enabling independent, jitter-free clock domains for PWM, ADC, and communication modules. The cross-triggering unit (CTU) synchronizes ADC conversions with FlexPWM edges without CPU intervention, critical for real-time sensor fusion and motor phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and code density optimization for safety-critical firmware. |
| Max Core Frequency | 180 MHz (+2% FM) - delivers up to 4× performance vs MPC5561 while maintaining PowerPC™ UISA compatibility. |
| Memory | 2 MB ECC code flash + 64 KB ECC data flash + 512 KB ECC SRAM - provides robust storage for ASIL-D-compliant boot code, application logic, and runtime data with single-bit correction/double-bit detection. |
| Safety Features | LockStep mode, FCCU, SoR with redundancy checkers, MBIST/LBIST, replicated SWT and STM - meets ISO 26262 ASIL-D requirements for ADAS and HEV control. |
| Peripherals | 4 FlexCAN 2.0B (32 msg buffers each), 4 LINFlex, 3 DSPI, FlexRay v2.1 (dual channel, 10 Mbit/s), 4×12-bit ADC (22 ch), 3 FlexPWM (4×3 ch each), CTU - supports full vehicle network integration and synchronized multi-sensor/multi-motor control. |
| Package & Temp | MAPBGA-257 (14 mm × 14 mm), –40 °C to +150 °C junction - qualified for under-hood automotive and high-temp industrial environments. |
Pinout & Package
SPC5675KFF0MMM2 is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. This package supports high I/O count and thermal dissipation required for ADAS domain controllers and multi-axis motor drives.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_1P2 | Core power supply | 1.2 V ±5% supply for CPU, cache, and logic - requires low-noise regulation and decoupling per NXP layout guidelines. |
| VDD_3P3 | I/O and peripheral power | 3.3 V ±10% supply for GPIO, CAN transceivers, LIN, SPI, and flash interface - compatible with standard automotive LDOs. |
| XOSC_IN / XOSC_OUT | External crystal oscillator interface | Supports 4–40 MHz fundamental-mode crystals - feeds primary FMPLL for system clock generation and jitter-sensitive peripherals. |
| FMPLL_REF | Auxiliary FMPLL reference input | Accepts external clock (e.g., from FlexRay PHY) to drive auxiliary PLL - ensures protocol-compliant symbol timing independent of main system clock. |
| PDI_DATA[15:0] | Parallel Data Interface data bus | 16-bit bidirectional bus for CMOS image sensors or external ADCs - supports pixel clock rates up to MCU system frequency with edge-selectable capture. |
| FLEXRAY_A_TX / FLEXRAY_A_RX | FlexRay Channel A differential pair | LVDS-compatible interface for FlexRay v2.1 communication - requires controlled-impedance routing and termination per protocol spec. |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z7d cores in LockStep or Decoupled mode | Enables ASIL-D fault detection via hardware comparison or parallel high-performance execution - eliminates need for external safety monitors. |
| Integrated CTU with 24-command ADC list | Automates precise, jitter-free ADC sampling aligned to PWM edges - reduces CPU load and timing uncertainty in motor current sensing and sensor fusion. |
| FlexRay v2.1 controller with dual 10 Mbit/s channels | Provides deterministic, time-triggered communication for radar/lidar synchronization and distributed ECU coordination - meets AUTOSAR FlexRay stack timing requirements. |
| 512 KB on-chip SRAM with ECC | Ensures data integrity for real-time control variables and safety-critical state machines - prevents silent corruption in long-life automotive deployments. |
| Boot Assist Module (BAM) in 8 KB ROM | Enables secure serial boot via FlexCAN or LINFlex - supports field firmware updates without external programming hardware or JTAG exposure. |
Applications
| Radar Signal Processing Unit | LIDAR Time-of-Flight Controller |
|---|---|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz radar echo data with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: Dual-core SPC5675KFF0MMM2 executes signal chain algorithms on one core while the second handles CAN/FlexRay comms and safety monitoring in LockStep. Use Value: On-chip 512 KB ECC SRAM and 2 MB flash enable full radar firmware storage; CTU-triggered ADCs synchronize sampling to chirp timing with <10 ns jitter. |
Use Scenario: High-speed time-of-flight measurement using SPAD arrays and precision TDC, requiring picosecond-level timestamping. IC Role / Device Role / Timing Role: SPC5675KFF0MMM2 acts as master controller interfacing PDI to CMOS image sensor and managing FlexRay sync frames across multiple LIDAR units. Use Value: Auxiliary FMPLL provides stable, non-modulated clock for TDC; 4×12-bit ADCs digitize analog return signals with programmable gain and offset calibration. |
| Hybrid Electric Vehicle Motor Drive | Ultrasonic Parking Assist ECU |
Use Scenario: Simultaneous control of three 3-phase inverters for traction, compressor, and cabin fan motors in HEV powertrain. IC Role / Device Role / Timing Role: SPC5675KFF0MMM2 runs motor FOC algorithms across dual cores, with FlexPWM generating gate signals and CTU triggering current-sense ADCs per PWM cycle. Use Value: Independent auxiliary PLL clocks FlexPWM at precise frequencies; 3 FlexPWM modules (12 channels total) support full-bridge control with deadtime insertion and fault response <2 µs. |
Use Scenario: Multi-channel ultrasonic echo processing for blind-spot detection and automatic parking, requiring synchronized transducer firing and echo capture. IC Role / Device Role / Timing Role: SPC5675KFF0MMM2 manages LINFlex network for sensor nodes, triggers 4 ADCs via CTU for simultaneous echo sampling, and aggregates data via CAN. Use Value: 22 ADC input channels support up to 8 transducers; LINFlex modules handle node addressing and diagnostics without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Single e200z7d core, 384 KB ECC SRAM, 1.5 MB ECC flash, no DRAMC, 257-pin MAPBGA - lower memory and compute capacity. | Targeted at mid-tier ADAS cameras or single-motor control where dual-core LockStep is not required. | Select when cost sensitivity outweighs ASIL-D certification needs and memory headroom is sufficient. |
| SPC574S54E3 | ARM Cortex-R5F dual core, 2 MB flash, 384 KB RAM, ASIL-D certified, but lacks FlexRay and has only 2×12-bit ADCs. | Better suited for gateway ECUs or chassis control where Ethernet and CAN FD dominate over FlexRay/radar interfaces. | Choose for new ARM-based AUTOSAR platforms requiring CAN FD/Ethernet; avoid when FlexRay or CTU-synchronized ADCs are mandatory. |
Compared with MPC5674K and SPC574S54E3, the SPC5675KFF0MMM2 uniquely combines dual Power Architecture cores with FlexRay v2.1, CTU-driven ADC synchronization, and 512 KB ECC SRAM - making it the only option for legacy PowerPC-based ASIL-D radar/lidar and multi-motor HEV designs requiring protocol-specific timing and hardware redundancy.
Availability
SPC5675KFF0MMM2 is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, hybrid electric vehicle powertrain systems, and high-temperature industrial motor drives requiring stable component supply, long lifecycle assurance, and ASIL-D qualification.
Supply support for SPC5675KFF0MMM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety and secure processing.
The SPC5675KFF0MMM2 belongs to NXP's MPC56xx family of SafeAssure MCUs, engineered specifically for ASIL-D automotive applications including radar, lidar, and multi-axis motor control in harsh thermal environments.
FAQ
What is the maximum operating temperature range for the SPC5675KFF0MMM2?
The SPC5675KFF0MMM2 is rated for a junction temperature range of –40 °C to +150 °C, making it suitable for under-hood automotive applications and high-temperature industrial environments. This rating is validated per JEDEC JESD22-A108 and confirmed in the MPC5675K datasheet Rev. 9, Section 3.3. Thermal derating curves and PCB layout guidance for thermal management are provided in the device's hardware design manual.
Does the SPC5675KFF0MMM2 support pin-to-pin compatibility with other MPC567xK variants?
No, the SPC5675KFF0MMM2 is not pin-to-pin compatible with MPC5673K or MPC5674K due to differences in peripheral integration - notably the inclusion of FlexRay, DRAMC (in 473-pin variants), and expanded PDI functionality. While all share the 257-pin MAPBGA footprint, signal assignments and power domain requirements differ. Refer to Table 1 and Section 2.1 of the MPC5675K datasheet for exact pin mapping.
How does the Cross Triggering Unit (CTU) in the SPC5675KFF0MMM2 improve motor control accuracy?
The CTU in the SPC5675KFF0MMM2 generates precise, hardware-timed ADC conversion triggers synchronized to FlexPWM edges - eliminating software-induced jitter and ensuring consistent current-sampling phase alignment across all motor phases. It supports up to 24 configurable ADC commands per trigger list and double-buffered update, enabling dynamic reconfiguration during runtime without sampling gaps. This capability is documented in Section 1.6.20.2 of the MPC5675K datasheet.
What safety certifications apply to the SPC5675KFF0MMM2?
The SPC5675KFF0MMM2 is part of NXP's SafeAssure program and supports ISO 26262 ASIL-D compliance when used per the Safety Manual (AN5279). It includes hardware safety mechanisms such as LockStep dual-core execution, FCCU, sphere-of-replication with redundancy checkers, MBIST/LBIST, and replicated SWT/STM. Certification evidence packages and FMEDA reports are available under NDA from NXP for qualified customers designing SPC5675KFF0MMM2 into safety-critical systems.
Can the SPC5675KFF0MMM2 boot from external flash via the External Bus Interface (EBI)?
No - the SPC5675KFF0MMM2 does not include an EBI in the 257-pin MAPBGA package (SPC5675KFF0MMM2). EBI is only available on the 473-pin variant (e.g., SPC5675KFF1MMM2). Boot options for SPC5675KFF0MMM2 are limited to internal flash, serial interfaces (FlexCAN, LINFlex), or JTAG. This limitation is explicitly stated in Table 1 and Section 1.6.7 of the MPC5675K datasheet Rev. 9.
SPC5675KFF0MMM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFF0MMM2 FAQ
1.How can I place an order for SPC5675KFF0MMM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFF0MMM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFF0MMM2 reliable?
The price and inventory of SPC5675KFF0MMM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0MMM2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFF0MMM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0MMM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFF0MMM2?
SPC5675KFF0MMM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFF0MMM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFF0MMM2?
For technical support, including SPC5675KFF0MMM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0MMM2 requirements.
6.How does Aetrix verify that SPC5675KFF0MMM2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFF0MMM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0MMM2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFF0MMM2?
All SPC5675KFF0MMM2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0MMM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFF0MMM2 part is unused and in its original packaging.
Return procedure for SPC5675KFF0MMM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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