My Inquiry
My Account
NXP Semiconductors SPC5675KFF0MMS2
- Part No.:
- SPC5675KFF0MMS2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 473-LFBGA
- Datasheet:
-
SPC5675KFF0MMS2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 473MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,793
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5675KFF0MMS2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM with ECC, 2 MB code flash with ECC, and integrated FlexPWM, FlexCAN, LINFlex, DSPI, ADC, and PDI for automotive ADAS and motor control. It targets radar, lidar, CMOS imaging, and hybrid electric vehicle (HEV) 3-phase motor systems.
For engineers reviewing the SPC5675KFF0MMS2 datasheet, SPC5675KFF0MMS2 pinout, SPC5675KFF0MMS2 application, or SPC5675KFF0MMS2 equivalent, key selection criteria include ASIL-D safety architecture (LockStep + Sphere of Replication), 473-pin MAPBGA package compatibility, dual FMPLL clocking with ±2% frequency modulation, and support for 16-bit DDR/EBI and parallel sensor interfaces.
Technical Context
The SPC5675KFF0MMS2 implements two e200z7d cores in configurable LockStep or Decoupled Parallel mode, each with 16 KB instruction cache (EDC-protected) and 16 KB data cache (parity-protected), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. It integrates three FlexPWM modules (4×3 channels each), four FlexCAN 2.0B controllers (32 message buffers each), and four 12-bit ADCs with 22 external channels.
Its safety architecture includes FCCU, replicated STM and SWT, CRC units (3 contexts each), CTU for hardware-synchronized ADC/PWM triggering, and redundancy checkers on PBRIDGE, Flash, SRAM, and DMA outputs. The device supports 473-pin MAPBGA (19 mm × 19 mm) packaging with 1.2 V core, 3.3 V I/O, and 1.8–3.3 V DRAM/PDI supply domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, Harvard cache, MMU (64-entry TLB) |
| Max Core Frequency | 180 MHz (+2% FM) - enables real-time motor control loop execution at ≤5.6 µs cycle time |
| Memory | 2 MB code flash (ECC), 64 KB data flash (ECC), 512 KB SRAM (ECC) - supports ASIL-D boot-time MBIST/LBIST |
| Safety Features | LockStep mode, Sphere of Replication (SoR), FCCU, replicated STM/SWT, CRC units - certified for SIL3/ASIL-D |
| Peripherals | 4× FlexCAN (2.0B), 4× LINFlex, 3× DSPI, 3× FlexPWM (4×3 ch), 4× 12-bit ADC (22 ch), PDI, EBI, FEC |
| Package & Temp | 473-pin MAPBGA (19 mm × 19 mm), –40 °C to +150 °C junction temperature - qualified for under-hood HEV use |
| Clock System | 2× FMPLL (system + auxiliary), 16 MHz IRCOSC, 4–40 MHz XOSC - auxiliary FMPLL provides jitter-free FlexRay/motor timing |
Pinout & Package
SPC5675KFF0MMS2 is packaged in a 473-pin MAPBGA with 19 mm × 19 mm body size and 0.8 mm ball pitch. This package supports full peripheral access including DDR, EBI, PDI, and all 4 FlexCAN/FlexPWM/LINFlex modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.2 V ±5% supply for CPU, cache, and logic - requires low-noise regulation for <150 °C operation |
| VDD_IO | I/O power supply | 3.3 V ±10% supply for GPIO, CAN, LIN, SPI, ADC reference - supports 5 V-tolerant inputs on select pins |
| VRX0–VRX3 | FlexCAN receive inputs | Differential CAN bus receivers - internal termination and slew rate control for ISO 11898-2 compliance |
| PWM_A0–PWM_C3 | FlexPWM output pins | Three independent PWM modules with complementary pair outputs, deadtime insertion, and fault protection |
| PDI_DATA[0:15] | Parallel Data Interface data bus | 16-bit bidirectional interface for CMOS image sensors or external ADCs - supports pixel clock synchronization |
| DDR_DQ[0:15] | DDR data bus | 16-bit mobile DDR interface - supports mDDR, DDR1, and optional DDR2 with programmable timing |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Safety Architecture | Sphere of Replication (SoR) with redundancy checkers on PBRIDGE, Flash, SRAM, and DMA outputs - enables diagnostic coverage >99% per ISO 26262 |
| Motor Control Integration | 3× FlexPWM (4×3 ch), CTU for hardware-triggered ADC sampling, eTimer quad-decode - supports field-oriented control (FOC) of BLDC/PMSM motors |
| Radar/Lidar Sensor Interface | PDI with 8–16 bit data width, VSYNC/HSYNC/PIXCLK sync, FIFO trigger thresholds - enables direct connection to CMOS radar transceivers |
| Automotive Network Stack | 4× FlexCAN (32 msg buf), 3× LINFlex, FlexRay v2.1 dual-channel (10 Mbit/s), FEC - meets AUTOSAR-compliant gateway requirements |
| Secure Boot & Memory Protection | BAM ROM-based boot loader, MPU (16 regions), flash censorship, ECC on all memory - prevents unauthorized firmware access and corruption |
Applications
| Radar Signal Processing Unit | Hybrid Electric Vehicle Motor Controller |
|---|---|
Use Scenario: Real-time baseband processing of FMCW radar returns in 77 GHz ADAS front radar modules. IC Role / Device Role / Timing Role: Primary controller executing FFT, CFAR, and angle estimation algorithms while managing CMOS sensor interface via PDI and CAN communication. Use Value: Dual e200z7d cores in Decoupled Parallel mode deliver deterministic latency for sub-10 µs interrupt response; auxiliary FMPLL ensures jitter-free ADC sampling synchronized to chirp timing. |
Use Scenario: Field-oriented control (FOC) of dual 3-phase traction inverters in plug-in hybrid powertrain systems. IC Role / Device Role / Timing Role: Central motor controller coordinating PWM generation, current sensing (via 4× ADC), position feedback (eTimer quadrature decode), and thermal monitoring (TSENS). Use Value: Integrated CTU triggers ADC conversions precisely at PWM center-point; FlexPWM deadtime insertion and fault handling prevent shoot-through in 600 V IGBT gate drivers. |
| Lidar Point Cloud Processor | Automotive Domain Controller Gateway |
Use Scenario: High-speed acquisition and preprocessing of time-of-flight (ToF) data from solid-state flash lidar arrays. IC Role / Device Role / Timing Role: Sensor hub aggregating parallel pixel data via PDI, performing histogram equalization and ROI extraction before CAN/FlexRay transmission. Use Value: 512 KB ECC SRAM buffers full frame data; 473-pin MAPBGA provides dedicated high-speed traces for PDI and DDR interfaces to minimize skew. |
Use Scenario: Central communication gateway routing messages between CAN FD, LIN, FlexRay, and Ethernet domains in zonal E/E architecture. IC Role / Device Role / Timing Role: Network bridge with 4 FlexCAN, 3 LINFlex, FlexRay v2.1, and Fast Ethernet Controller (FEC) supporting AUTOSAR COM and SOME/IP stacks. Use Value: Nexus Class 3+ debug interface enables real-time trace of multi-bus traffic; FCCU monitors protocol-level errors and initiates safe state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | 384 KB SRAM (ECC), 1.5 MB flash (ECC), 257-pin MAPBGA (14 mm × 14 mm), no DRAMC or EBI | Limited to single-motor control or lower-bandwidth ADAS sensors; lacks DDR/EBI for high-throughput data buffering | Select when cost-sensitive designs require ASIL-D capability but do not need 473-pin peripheral density or DDR bandwidth |
| SPC58NG84C3 | Tri-core e200z7, 6 MB flash, 2 MB SRAM, 512-pin BGA, ISO 26262 ASIL-D certified, supports HSM | Higher integration for central domain controllers; adds hardware security module (HSM) and PCIe interface | Select for next-gen zonal controllers requiring secure over-the-air updates and higher compute throughput than SPC5675KFF0MMS2 offers |
Compared with MPC5674K, SPC5675KFF0MMS2 delivers 33% more SRAM and 33% more flash in a larger package enabling DDR/EBI expansion; compared with SPC58NG84C3, it offers lower cost and proven qualification for radar/lidar sensor hubs without HSM overhead.
Availability
SPC5675KFF0MMS2 is available at Aetrix Electronics and suitable for advanced driver assistance systems (ADAS), hybrid electric vehicle (HEV) motor control, automotive radar signal processing, and industrial high-temperature embedded applications requiring stable component supply and long-term lifecycle assurance.
Supply support for SPC5675KFF0MMS2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The SPC5675KFF0MMS2 belongs to NXP's SafeAssure automotive MCU family, designed specifically for ASIL-D functional safety applications in radar, lidar, CMOS imaging, and multi-motor control systems operating up to 150 °C junction temperature.
FAQ
What is the maximum operating junction temperature for the SPC5675KFF0MMS2?
The SPC5675KFF0MMS2 is rated for a junction temperature range of –40 °C to +150 °C, making it suitable for under-hood automotive applications including hybrid electric vehicle motor control and radar modules. This rating is validated per JEDEC JESD22-A108 and supported by thermal characterization in the official datasheet Rev. 9, Section 3.4.
Does the SPC5675KFF0MMS2 support DDR memory interfaces?
Yes, the SPC5675KFF0MMS2 includes a 16-bit mobile DDR (mDDR) controller supporting mDDR, DDR1, and optionally DDR2 memory types. This interface is available only on the 473-pin MAPBGA package variant and is documented in Section 1.6.11 of the MPC5675K datasheet Rev. 9.
How many FlexCAN modules does the SPC5675KFF0MMS2 integrate?
The SPC5675KFF0MMS2 integrates four fully compliant FlexCAN 2.0B modules, each supporting 32 message buffers, programmable acceptance filtering, and listen-only mode. This configuration is confirmed in Table 1 (Device Comparison) and Section 1.6.16 of the MPC5675K datasheet Rev. 9.
Is the SPC5675KFF0MMS2 pin-compatible with other MPC567xK family members?
No, the SPC5675KFF0MMS2 uses a 473-pin MAPBGA package (19 mm × 19 mm), while MPC5673K and MPC5674K use 257-pin MAPBGA (14 mm × 14 mm). Pinouts differ significantly due to expanded peripheral sets including DDR, EBI, and additional FlexPWM/LINFlex channels - no mechanical or electrical pin compatibility exists.
What safety certifications apply to the SPC5675KFF0MMS2?
The SPC5675KFF0MMS2 is part of NXP's SafeAssure portfolio and supports ISO 26262 ASIL-D development workflows. Its safety architecture - including LockStep cores, Sphere of Replication, FCCU, and boot-time MBIST/LBIST - is documented in Sections 1.5 and 1.6 of the MPC5675K datasheet Rev. 9, with certification evidence provided in NXP's Functional Safety Manual.
SPC5675KFF0MMS2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 473-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 34x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFF0MMS2 FAQ
1.How can I place an order for SPC5675KFF0MMS2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFF0MMS2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFF0MMS2 reliable?
The price and inventory of SPC5675KFF0MMS2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0MMS2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFF0MMS2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0MMS2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFF0MMS2?
SPC5675KFF0MMS2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFF0MMS2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFF0MMS2?
For technical support, including SPC5675KFF0MMS2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0MMS2 requirements.
6.How does Aetrix verify that SPC5675KFF0MMS2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFF0MMS2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0MMS2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFF0MMS2?
All SPC5675KFF0MMS2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0MMS2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFF0MMS2 part is unused and in its original packaging.
Return procedure for SPC5675KFF0MMS2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5675KFF0MMS2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
