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NXP Semiconductors SPC5675KFF0VMM2
- Part No.:
- SPC5675KFF0VMM2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KFF0VMM2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,770
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Product details
Overview
SPC5675KFF0VMM2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM with ECC, 2 MB code flash with ECC, and integrated FlexPWM, FlexCAN, LINFlex, DSPI, and PDI for automotive ADAS and motor control. It targets radar/LiDAR sensor fusion and 3-phase motor drives in hybrid electric vehicles.
For engineers reviewing the SPC5675KFF0VMM2 datasheet, SPC5675KFF0VMM2 pinout, SPC5675KFF0VMM2 application, or SPC5675KFF0VMM2 equivalent, key selection criteria include ASIL-D safety architecture (LockStep + FCCU), 4×12-bit ADCs with CTU-triggered sampling, 3×FlexPWM modules with independent deadtime control, and MAPBGA-257 (14 mm × 14 mm) packaging for high-density automotive ECU layouts.
Technical Context
The SPC5675KFF0VMM2 implements two e200z7d cores in configurable LockStep or Decoupled Parallel mode, each with 16 KB instruction cache (EDC-protected) and 16 KB data cache (parity-protected), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. Its safety architecture includes Sphere of Replication (SoR) for CPU, memory, and peripherals, with redundancy checkers feeding into the Fault Collection and Control Unit (FCCU).
It integrates dual FMPLLs - one system PLL and one auxiliary PLL dedicated to FlexRay and motor control peripherals - enabling jitter-free PWM generation at independent frequencies. The device supports concurrent high-bandwidth interfaces: 4×FlexCAN 2.0B (32 message buffers each), 3×DSPI (up to 60 Mbit/s in Rx-only), 4×LINFlex, and a Parallel Data Interface (PDI) for CMOS image sensors with frame sync (Vsync/Hsync/PIXCLK) and 8–16-bit data packing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and compact code footprint for safety-critical firmware. |
| Max Core Frequency | 180 MHz (+2% FM) - delivers up to 4× performance vs MPC5561 while maintaining Power Architecture compatibility. |
| Memory | 2 MB code flash + 64 KB data flash (both with ECC), 512 KB SRAM (ECC) - ensures data integrity and fault containment in ASIL-D systems. |
| Safety Features | LockStep mode, FCCU, boot-time MBIST/LBIST, replicated SWT, 16-region MPU, CMU, and RCCU - meets ISO 26262 ASIL-D requirements out-of-the-box. |
| Motor Control Peripherals | 3×FlexPWM (4×3 channels), CTU, 4×12-bit ADCs (22 channels), eTimer - enables synchronized, high-resolution 3-phase motor control with hardware-triggered sampling. |
| Connectivity | 4×FlexCAN 2.0B, 3×DSPI, 4×LINFlex, 3×I2C, FEC, FlexRay v2.1 - supports full vehicle network integration including radar sensor backhaul and actuator control. |
| Package | MAPBGA-257 (14 mm × 14 mm, 0.8 mm pitch) - optimized for automotive thermal dissipation and PCB routing density in engine bay ECUs. |
Pinout & Package
SPC5675KFF0VMM2 is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. The package supports industrial-grade thermal performance (TJ = –40°C to +150°C) and is qualified per AEC-Q100 Grade 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main power supply (3.3 V) | Supplies I/O, oscillators, flash, and most digital logic; requires low-noise regulation for ADC and PLL stability. |
| VDD_DRAM/PDI | DRAM/PDI interface supply (1.8–3.3 V) | Configurable voltage domain for external DDR or parallel sensor interface; decoupling critical for signal integrity. |
| VRX0–VRX3 | FlexCAN receive inputs | Differential CAN bus receivers supporting 2.0B protocol; internal termination and filtering reduce external component count. |
| PWM_A0–PWM_C3 | FlexPWM output pins | Three independent PWM modules with complementary pairs, deadtime insertion, and fault-controlled shutdown for inverter gate drivers. |
| PDI_DATA[0:15] | Parallel Data Interface data bus | 16-bit bidirectional bus for CMOS image sensors or ADCs; supports rising/falling edge capture and FIFO-based DMA streaming. |
| CLKIN_XOSC | External crystal oscillator input | Accepts 4–40 MHz crystal; feeds primary FMPLL for system clock generation and provides reference for safety-critical timing paths. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-D Safety Architecture | Hardware-enforced LockStep operation, FCCU-managed fault response, and SoR-based redundancy checking eliminate need for software-level safety wrappers. |
| CTU-Synchronized Motor Control | Hardware cross-triggering between FlexPWM, ADC, and eTimer enables zero-CPU-overhead current/voltage sampling aligned to PWM edges. |
| Auxiliary FMPLL for Motor Peripherals | Dedicated PLL supplies jitter-free clocks to FlexPWM and CTU - isolates motor control timing from system clock modulation and noise. |
| PDI for CMOS Image Sensors | Parallel interface with Vsync/Hsync/PIXCLK support and 8–16-bit data packing - enables direct connection to automotive camera modules without FPGA bridging. |
| Replicated Nexus Class 3+ Debug | Full-core visibility with trace, memory access, and safety peripheral monitoring - accelerates ASIL-D validation and field failure root-cause analysis. |
Applications
| Radar Signal Processing ECU | Electric Power Steering (EPS) Controller |
|---|---|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz radar echo data from multiple RX channels, fused with camera inputs via PDI. IC Role / Device Role / Timing Role: Primary compute engine executing AUTOSAR-compliant radar stack; CTU triggers ADC sampling synchronized to chirp timing; auxiliary FMPLL clocks DSP-intensive CTU/ADC paths. Use Value: Dual-core LockStep ensures functional safety compliance while Decoupled mode offloads radar preprocessing - achieving <50 µs latency for emergency steering intervention. |
Use Scenario: Closed-loop torque control of 3-phase BLDC motor using field-oriented control (FOC), with position feedback from resolver or Hall sensors. IC Role / Device Role / Timing Role: Motor controller managing PWM generation, current sensing (via 4×ADC), and CAN communication to vehicle network; FlexPWM outputs drive gate drivers with programmable deadtime. Use Value: Hardware-synchronized ADC sampling and PWM updates eliminate phase delay - enabling >20 kHz FOC loop bandwidth and smooth low-speed torque delivery. |
| ADAS Domain Controller (LiDAR + Camera) | Hybrid Electric Vehicle Inverter Control |
Use Scenario: Aggregation and preprocessing of point cloud data from 905 nm LiDAR and 12 MP camera streams for object detection. IC Role / Device Role / Timing Role: Sensor hub interfacing via PDI (camera) and DSPI/FlexCAN (LiDAR); SRAM with ECC buffers raw sensor frames; FlexRay handles time-triggered inter-ECU coordination. Use Value: 512 KB on-chip ECC SRAM eliminates external memory bottlenecks - sustaining 1.2 Gbps aggregate sensor throughput without DRAM latency penalties. |
Use Scenario: High-voltage inverter control for traction motor in PHEV, requiring precise PWM timing, overcurrent protection, and thermal monitoring. IC Role / Device Role / Timing Role: Real-time inverter manager executing SVM algorithms; temperature sensor monitors die junction; FCCU triggers safe shutdown on fault detection within <1 µs. Use Value: Integrated safety logic (FCCU + RCCU) reduces BOM cost by eliminating external watchdog ICs and safety monitors - certified for ASIL-D per ISO 26262 Part 5. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674KFF0VMM2 | Same dual e200z7d core, but 384 KB SRAM (vs 512 KB), 1.5 MB flash (vs 2 MB), no DRAM controller - limited to 257-pin package only. | Targeted at mid-tier ADAS cameras without LiDAR fusion or high-channel-count motor control. | Select when lower memory footprint suffices and cost sensitivity outweighs future scalability needs. |
| SPC574SADK0MLU2 | ARM Cortex-R5F dual-core (not Power Architecture), 3 MB flash, 512 KB RAM, ASIL-D certified - different ISA, toolchain, and peripheral set. | Better suited for AUTOSAR Classic/Adaptive integration and Ethernet-based domain controllers, not legacy Power Architecture migration paths. | Choose for new ARM-based designs prioritizing ecosystem breadth over Power Architecture continuity. |
Compared with MPC5674KFF0VMM2, SPC5675KFF0VMM2 delivers higher memory bandwidth and safety coverage for complex sensor fusion; versus SPC574SADK0MLU2, it preserves existing Power Architecture toolchains and deterministic interrupt latency - critical for hard real-time motor control loops.
Availability
SPC5675KFF0VMM2 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, electric power steering systems, hybrid vehicle inverters, and industrial motor drives requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KFF0VMM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.
The SPC5675KFF0VMM2 belongs to NXP's SafeAssure portfolio of ASIL-D-certified MCUs, engineered specifically for advanced driver assistance systems and high-reliability motor control in harsh automotive environments.
FAQ
What is the maximum operating junction temperature for the SPC5675KFF0VMM2?
The SPC5675KFF0VMM2 is rated for an operating junction temperature range of –40°C to +150°C, meeting AEC-Q100 Grade 1 requirements. This specification is validated per the device's thermal characteristics table (Section 3.4) and supports deployment in under-hood automotive applications such as engine control and inverter modules where ambient temperatures exceed 125°C.
Does the SPC5675KFF0VMM2 support pin-compatible migration from the MPC5561?
No, the SPC5675KFF0VMM2 is not pin-compatible with the MPC5561. While the External Bus Interface (EBI) offers MPC5561 324 BGA compatibility mode in software configuration, the physical package (MAPBGA-257) and pinout differ significantly. Migration requires PCB redesign and firmware adaptation due to architectural enhancements including dual cores, expanded memory, and new peripherals like PDI and FlexRay.
How does the SPC5675KFF0VMM2 implement ASIL-D compliance?
The SPC5675KFF0VMM2 achieves ASIL-D compliance through hardware-enforced mechanisms: dual e200z7d cores in LockStep mode with redundancy checkers (RCCU), Fault Collection and Control Unit (FCCU) for fail-safe response, boot-time MBIST/LBIST, replicated SWT and STM, and ECC on all memories. These features are documented in Sections 1.5 and 1.6 of the MPC5675K datasheet (Rev. 9) and certified per ISO 26262 Part 5.
Can the SPC5675KFF0VMM2 interface directly with a CMOS image sensor?
Yes, the SPC5675KFF0VMM2 supports direct CMOS image sensor interfacing via its Parallel Data Interface (PDI), which accepts 8–16-bit parallel data with Vsync, Hsync, and PIXCLK synchronization. The PDI includes a configurable FIFO and data packing unit - enabling seamless integration with automotive-grade camera modules without external framing logic or bridge ICs.
What clock sources are available for the FlexPWM modules on the SPC5675KFF0VMM2?
The FlexPWM modules on the SPC5675KFF0VMM2 can be clocked from the auxiliary FMPLL, which operates independently of the main system PLL. This design ensures jitter-free PWM generation unaffected by frequency modulation applied to the system clock - a critical requirement for high-resolution motor control and inverter switching. The auxiliary FMPLL is detailed in Section 1.6.6 of the MPC5675K datasheet.
SPC5675KFF0VMM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFF0VMM2 FAQ
1.How can I place an order for SPC5675KFF0VMM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFF0VMM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFF0VMM2 reliable?
The price and inventory of SPC5675KFF0VMM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0VMM2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFF0VMM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0VMM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFF0VMM2?
SPC5675KFF0VMM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFF0VMM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFF0VMM2?
For technical support, including SPC5675KFF0VMM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0VMM2 requirements.
6.How does Aetrix verify that SPC5675KFF0VMM2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFF0VMM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0VMM2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFF0VMM2?
All SPC5675KFF0VMM2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0VMM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFF0VMM2 part is unused and in its original packaging.
Return procedure for SPC5675KFF0VMM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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