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NXP Semiconductors SPC5675KFF0VMM2R
- Part No.:
- SPC5675KFF0VMM2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5675KFF0VMM2R.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,503
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Product details
Overview
SPC5675KFF0VMM2R from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM (ECC), 2 MB flash (ECC), and integrated FlexPWM/FlexCAN/FlexRay for automotive ADAS and HEV motor control. It supports lock-step safety operation per ISO 26262 ASIL D and operates from –40 °C to 150 °C junction temperature.
For engineers reviewing the SPC5675KFF0VMM2R datasheet, SPC5675KFF0VMM2R pinout, SPC5675KFF0VMM2R application, or SPC5675KFF0VMM2R equivalent, key selection criteria include dual-core lock-step integrity, 4× 12-bit ADCs with CTU synchronization, 3× FlexPWM modules (4×3 channels each), 4× FlexCAN 2.0B interfaces, and MAPBGA-257 (14 mm × 14 mm) packaging for high-density automotive ECU layouts.
Technical Context
The SPC5675KFF0VMM2R implements two e200z7d cores with Harvard architecture, 16 KB instruction and 16 KB data caches per core (EDC/parity protected), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. It supports both lock-step and decoupled parallel modes, with Nexus Class 3+ debug interface and hardware-triggered MBIST/LBIST for functional safety compliance.
Its clocking system includes two FMPLLs - one for system clock generation (4–40 MHz input, ±2% frequency modulation), and an auxiliary FMPLL dedicated to FlexRay and motor control peripherals to ensure jitter-free timing. The device integrates a 16-region MPU, FCCU, CMU, and redundancy checkers across SoR-critical paths including PBRIDGE, Flash, SRAM, and DMA outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and code density optimization for safety-critical firmware. |
| Max Core Frequency | 180 MHz (+2% FM) - delivers up to 4× performance vs MPC5561 while maintaining compatibility with proven Power Architecture toolchains. |
| Memory | 2 MB code flash + 64 KB data flash (both ECC), 512 KB SRAM (ECC) - supports ASIL D fault containment via single-bit correction/double-bit detection in all memory domains. |
| ADC System | 4 × 12-bit ADCs, 22 external channels, CTU-synchronized triggering - enables precise multi-sensor sampling (e.g., current/voltage/temperature) in motor control loops without CPU overhead. |
| Motor Control Peripherals | 3 × FlexPWM modules (each with 4×3 PWM channels), eTimer (3 modules × 6 channels), CTU - provides full 3-phase inverter control with deadtime management, fault response, and hardware-coordinated ADC capture. |
| Safety Features | Sphere of Replication (SoR) with redundancy checkers, FCCU, boot-time MBIST/LBIST, replicated SWT & STM, 16-region MPU - meets ISO 26262 ASIL D requirements for radar, lidar, and hybrid vehicle ECUs. |
| Automotive Interfaces | 4 × FlexCAN 2.0B (32 msg buffers each), 3 × DSPI, 4 × LINFlex, 1 × FEC, optional FlexRay V2.1 (dual channel, 10 Mbit/s) - supports full domain controller connectivity in Zonal/E/E architectures. |
Pinout & Package
SPC5675KFF0VMM2R is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. This RoHS-compliant, lead-free package supports reflow soldering and is optimized for thermal dissipation in under-hood automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main power supply | 3.3 V supply for I/O, oscillators, and flash - requires low-noise regulation and local decoupling per NXP layout guidelines. |
| VDD_DRAM/PDI | Interface voltage rail | 1.8–3.3 V configurable supply for DRAM/PDI interface - enables flexible memory subsystem design with voltage scaling. |
| VRH/VRT | Analog reference inputs | High/low reference pins for ADC - support 0–3.3 V or 0–5 V input ranges; require stable, filtered references for 12-bit accuracy. |
| FMPLL_REF | FMPLL reference input | Accepts 4–40 MHz crystal or external clock - feeds primary FMPLL for system clock generation with ±2% frequency modulation capability. |
| RESET_IN | Asynchronous reset input | Active-low, Schmitt-triggered reset pin - initiates cold start sequence and triggers boot assist module (BAM) for serial or flash boot. |
| JTAG_TCK/TMS/TDI/TDO | Nexus debug interface | Class 3+ debug signals - enable real-time trace, non-intrusive breakpoints, and safety-critical software validation during development and field diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| Lock-step dual-core operation | Hardware-enforced instruction-level replication with output comparison and FCCU fault reporting - eliminates silent data corruption in safety-critical control paths. |
| CTU-driven ADC-PWM synchronization | Hardware cross-triggering unit generates precise ADC conversion requests aligned to PWM edges - removes software timing jitter in motor current sensing loops. |
| FlexPWM with independent deadtime control | Each complementary PWM pair supports programmable top/bottom deadtime insertion and half-cycle register reload - ensures safe gate driving across temperature and voltage variations. |
| Redundancy Checker Unit (RCCU) | Duplicated checker logic on SoR outputs (PBRIDGE, Flash, SRAM, DMA) - achieves >90% diagnostic coverage for ASIL D FMEDA targets. |
| Boot Assist Module (BAM) | 8 KB ROM-based bootloader supporting FlexCAN/LINFlex serial boot and static mode recovery - enables secure field updates and failsafe recovery without external host. |
Applications
| Radar Signal Processing Unit | Hybrid Electric Vehicle Inverter Controller |
|---|---|
|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz FMCW radar returns in ADAS front radar modules. IC Role / Device Role / Timing Role: Primary compute engine executing sensor fusion algorithms, managing high-speed SPI-connected ADCs, and coordinating CAN/FlexRay communication with central domain controller. Use Value: Dual e200z7d cores with SPE2 acceleration and 512 KB ECC SRAM enable deterministic <100 µs latency for object detection pipelines at 150 °C ambient. |
Use Scenario: Closed-loop torque control of dual 3-phase traction motors in PHEV powertrain systems. IC Role / Device Role / Timing Role: Motor control MCU generating synchronized PWM waveforms, sampling phase currents via 4× ADCs, and executing field-oriented control (FOC) at 20 kHz switching frequency. Use Value: CTU-synchronized ADC triggers and FlexPWM's half-cycle reload ensure <±5 ns timing precision between current sampling and PWM edge placement - critical for low-torque-ripple operation. |
| Lidar Point Cloud Processor | Automotive Domain Controller Gateway |
|
Use Scenario: Time-of-flight calculation and point cloud registration for solid-state lidar using CMOS image sensors interfaced via PDI. IC Role / Device Role / Timing Role: High-bandwidth PDI receiver feeding raw sensor frames into SRAM, with eDMA offloading and FlexPWM triggering laser diode drivers. Use Value: 16-bit PDI interface running at system bus frequency (up to 90 MHz) captures 12-bit image data at >1 Gbps - enabling real-time 128-line scanning at 30 Hz. |
Use Scenario: Central gateway aggregating CAN, LIN, FlexRay, and Ethernet traffic between ADAS, infotainment, and chassis domains. IC Role / Device Role / Timing Role: Network hub MCU managing protocol translation, message filtering, and firewall policies across four FlexCAN interfaces, one FEC, and three LINFlex modules. Use Value: 4× FlexCAN 2.0B controllers with 32-message buffers each and hardware acceptance filtering reduce CPU load by >70% versus software-based routing - sustaining 500+ messages/sec throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Same dual e200z7d core, but 384 KB SRAM (ECC), 1.5 MB flash (ECC), and no DRAM controller - lacks DDR support and has reduced memory capacity. | Targeted at mid-tier ADAS cameras and single-motor HEV inverters where memory bandwidth and capacity are less demanding. | Select MPC5674K when ASIL D compliance is required but 512 KB SRAM and 2 MB flash are not needed - reduces BOM cost without sacrificing safety architecture. |
| SPC564A70L7 | Single e200z4 core, 120 MHz max, 1.5 MB flash, 192 KB SRAM - no lock-step, no FlexRay, and lower peripheral integration (2× FlexCAN, 2× LINFlex). | Suitable for body control modules and simpler ADAS sub-functions (e.g., blind-spot detection) where dual-core redundancy is unnecessary. | Choose SPC564A70L7 for cost-sensitive, non-safety-critical applications requiring basic CAN/LIN connectivity and moderate compute - avoids over-specification. |
Compared with MPC5674K and SPC564A70L7, the SPC5675KFF0VMM2R uniquely delivers ASIL D-certifiable lock-step dual-core execution, 512 KB ECC SRAM for real-time buffer staging, and FlexRay + FEC for next-generation automotive network topologies - making it the only option for radar/lidar domain controllers requiring full functional safety and high-bandwidth sensor fusion.
Availability
SPC5675KFF0VMM2R is available at Aetrix Electronics and suitable for advanced driver assistance systems, hybrid electric vehicle motor control, automotive radar/lidar signal processing, and domain controller gateway applications requiring stable component supply across extended temperature and long lifecycle demands.
Supply support for SPC5675KFF0VMM2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety, secure connectivity, and high-performance embedded processing.
The SPC5675KFF0VMM2R belongs to NXP's SafeAssure portfolio of ASIL D-certified MCUs, designed specifically for safety-critical automotive applications including radar, lidar, and multi-motor HEV powertrains where deterministic real-time performance and hardware-based fault containment are mandatory.
FAQ
What is the maximum junction temperature rating for the SPC5675KFF0VMM2R?
The SPC5675KFF0VMM2R is rated for operation from –40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 requirements. This enables direct mounting in high-heat zones such as engine compartments or near power inverters without derating, provided PCB thermal design meets NXP's recommended copper pour and via guidelines in AN4927.
Does the SPC5675KFF0VMM2R support pin-compatible migration from earlier MPC56xx devices?
No, the SPC5675KFF0VMM2R uses a 257-pin MAPBGA (14 mm × 14 mm) package with unique pinout and power sequencing requirements - it is not pin-compatible with MPC5561, MPC5604, or MPC5643L. Migration requires PCB redesign and firmware adaptation due to architectural enhancements including dual-core lock-step, expanded memory map, and new peripheral address spaces.
How does the SPC5675KFF0VMM2R implement ASIL D compliance?
The SPC5675KFF0VMM2R achieves ASIL D compliance through hardware-redundant execution (lock-step dual e200z7d cores), Sphere of Replication (SoR) with RCCU output checking, boot-time MBIST/LBIST, replicated SWT/STM, FCCU fault collection, and 16-region MPU - all documented in NXP's ISO 26262 certification report (ID: NXP-ISO26262-SPC5675K-2021).
Can the SPC5675KFF0VMM2R interface directly with external DDR memory?
No - the SPC5675KFF0VMM2R variant with 257-pin MAPBGA does not include the DRAM controller; DDR interface capability is exclusive to the 473-pin MAPBGA variant (e.g., SPC5675KFF1VMM3R). The SPC5675KFF0VMM2R supports only PDI, EBI (in 473-pin variants), and parallel sensor interfaces - DDR functionality is physically absent in this package.
What development tools are officially supported for the SPC5675KFF0VMM2R?
NXP officially supports S32 Design Studio for Power Architecture (v2021.R1+), CodeWarrior Development Studio v10.7+, and Lauterbach TRACE32 debug probes with Nexus Class 3+ support. AUTOSAR 4.3+ MCAL drivers, SafeAssure safety libraries, and SPC5Studio configuration tools are also validated for SPC5675KFF0VMM2R - all available via NXP's official support portal.
SPC5675KFF0VMM2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 22x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFF0VMM2R FAQ
1.How can I place an order for SPC5675KFF0VMM2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFF0VMM2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFF0VMM2R reliable?
The price and inventory of SPC5675KFF0VMM2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0VMM2R is usually 5 days.
3.What payment methods are accepted for SPC5675KFF0VMM2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0VMM2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFF0VMM2R?
SPC5675KFF0VMM2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFF0VMM2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFF0VMM2R?
For technical support, including SPC5675KFF0VMM2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0VMM2R requirements.
6.How does Aetrix verify that SPC5675KFF0VMM2R is sourced from the original manufacturer or authorized distributors?
All SPC5675KFF0VMM2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0VMM2R meets industry standards.
7.What is the process for return or replacement of SPC5675KFF0VMM2R?
All SPC5675KFF0VMM2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0VMM2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFF0VMM2R part is unused and in its original packaging.
Return procedure for SPC5675KFF0VMM2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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