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NXP Semiconductors SPC5675KFF0VMS2
- Part No.:
- SPC5675KFF0VMS2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 473-LFBGA
- Datasheet:
-
SPC5675KFF0VMS2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 473MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5675KFF0VMS2 from NXP Semiconductors is a dual-core 32-bit Power Architecture® MCU with e200z7d cores operating up to 180 MHz, 512 KB SRAM with ECC, 2 MB code flash with ECC, and integrated FlexCAN, FlexPWM, and PDI for automotive ADAS and motor control. It supports lock-step safety operation (SIL3/ASILD) and operates from –40 °C to 150 °C junction temperature.
For engineers reviewing the SPC5675KFF0VMS2 datasheet, SPC5675KFF0VMS2 pinout, SPC5675KFF0VMS2 application, or SPC5675KFF0VMS2 equivalent, key selection criteria include dual-core lock-step reliability, on-chip PDI for CMOS image sensors, 4×12-bit ADCs with CTU synchronization, and ASIL-D–capable fault collection via FCCU and redundancy checkers.
Technical Context
The SPC5675KFF0VMS2 implements two e200z7d cores with VLE, MMU, 16 KB I-cache and 16 KB D-cache per core, and Sphere of Replication (SoR) architecture covering CPU, memory, and critical peripherals. Its FMPLL provides system and auxiliary clocks - the latter dedicated to FlexRay and motor control timing independence.
It integrates four 12-bit ADCs (22 external channels), three FlexPWM modules (each with 4×3 channels), four LINFlex modules, and a Parallel Data Interface (PDI) supporting 8–16-bit sensor data capture at system bus frequency with Vsync/Hsync/PIXCLK frame sync - all validated for radar, lidar, and multi-motor HEV systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200z7d Power Architecture® cores with VLE, MMU (64-entry TLB), and Harvard cache (16 KB I-cache + 16 KB D-cache per core) |
| Max Core Frequency | 180 MHz (+2% FM tolerance); platform clock up to 90 MHz in 1:2 mode - enables real-time motor control loop execution |
| Memory | 2 MB code flash + 64 KB data flash (both with ECC); 512 KB SRAM with single-bit correction/double-bit detection - meets ASIL-D memory integrity requirements |
| Safety Features | Lock-step mode, FCCU, redundancy checkers on SoR outputs, MBIST/LBIST, boot-time ADC/flash BIST, replicated SWT - certified for SIL3/ASILD applications |
| Peripherals | 4 FlexCAN (2.0B Active, 32 msg buffers each), 3 FlexPWM (4×3 channels/module), 4 LINFlex, 3 DSPI, PDI, DRAMC (473-pin only), 4×12-bit ADCs with CTU-triggered sampling |
| Package & Temp | 257-pin MAPBGA (14 mm × 14 mm); rated for –40 °C to +150 °C junction temperature - qualified for under-hood automotive use |
| Power Supply | Single 3.3 V supply for I/O, flash, oscillators; 1.8–3.3 V for DRAM/PDI; 3.3 V or 5 V support for ADCs - simplifies power rail design in mixed-voltage systems |
Pinout & Package
SPC5675KFF0VMS2 is housed in a 257-pin MAPBGA package measuring 14 mm × 14 mm with 0.8 mm ball pitch. The package supports high-density routing and thermal dissipation required for automotive engine control and ADAS processing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | I/O power supply | 3.3 V supply for GPIO, LINFlex, DSPI, FlexCAN transceivers - must be decoupled per NXP layout guidelines |
| VDD_CORE | Core power supply | 1.2 V regulated supply for CPU, caches, and internal logic - requires low-noise regulation and tight tolerance |
| RESET_IN | Asynchronous reset input | Active-low signal initiating cold reset sequence; monitored by PMC and FCCU for fail-safe recovery |
| CLKIN | External crystal oscillator input | Accepts 4–40 MHz crystal; feeds primary FMPLL for system clock generation - critical for timing-critical motor control loops |
| PDI_DATA[15:0] | PDI parallel data bus | 16-bit bidirectional interface for CMOS image sensors or external ADCs; supports rising/falling edge capture and FIFO-based DMA streaming |
| FLEXCAN0_TX/RX | CAN physical layer interface | Differential pair for CAN 2.0B communication; integrated transceiver drivers meet ISO 11898-2 electrical specs |
Key Features
| Feature | Design Value |
|---|---|
| Lock-step dual-core operation | Hardware-enforced instruction-level comparison between e200z7d cores with automatic fault detection and FCCU-triggered safe state entry |
| Parallel Data Interface (PDI) | Configurable 8–16-bit parallel capture synchronized to Vsync/Hsync/PIXCLK - enables direct connection to automotive CMOS imagers without FPGA glue logic |
| Cross Triggering Unit (CTU) | Hardware-synchronized ADC sampling triggered by FlexPWM edges or eTimer events - eliminates CPU overhead in motor current sensing loops |
| FlexPWM with independent deadtime | Per-channel top/bottom deadtime insertion, complementary pair control, and half-cycle register reload - ensures precise gate drive timing for 3-phase inverter stages |
| On-chip safety infrastructure | Integrated FCCU, redundancy checkers on SoR outputs, boot-time MBIST/LBIST, and replicated SWT - reduces external safety monitor IC count in ASIL-D designs |
Applications
| Radar Signal Processing Unit | Automotive Camera ECU |
|---|---|
|
Use Scenario: Real-time FFT and CFAR processing of 77 GHz radar echo data from multiple RX channels. IC Role / Device Role / Timing Role: Primary compute engine executing lock-step safety-critical signal chain firmware; PDI interfaces with high-speed ADCs; FlexPWM drives RF front-end bias controls. Use Value: Dual e200z7d cores deliver deterministic 180 MHz throughput; on-chip 512 KB SRAM with ECC avoids external memory access latency; FCCU ensures fail-safe shutdown on computation divergence. |
Use Scenario: High-resolution image acquisition, ISP preprocessing, and CAN-based object classification output in surround-view camera systems. IC Role / Device Role / Timing Role: PDI captures raw 12-bit Bayer data from CMOS sensor at up to system bus rate; CTU synchronizes ADC sampling to PWM-driven LED strobes; FlexCAN transmits processed frames. Use Value: Integrated PDI eliminates external serializer/deserializer; 4×12-bit ADCs with hardware CTU triggering enable precise ambient light and HDR exposure control; ASIL-D safety features satisfy OEM camera ECU certification. |
| Hybrid Electric Vehicle Motor Controller | LIDAR Beam Steering Control |
|
Use Scenario: Field-oriented control (FOC) of dual 3-phase traction and auxiliary motors with torque vectoring. IC Role / Device Role / Timing Role: FlexPWM generates gate signals with sub-microsecond deadtime precision; eTimer measures rotor position via encoder; ADCs sample phase currents with CTU-triggered zero-latency sampling. Use Value: Auxiliary FMPLL provides jitter-free PWM clock independent of system clock; lock-step cores validate FOC math in real time; 2 MB flash stores dual motor control algorithms with OTA update partitioning. |
Use Scenario: Closed-loop galvanometer mirror control and time-of-flight (ToF) pulse timing in solid-state LIDAR units. IC Role / Device Role / Timing Role: eTimer captures ToF pulse edges with 1 ns resolution; FlexPWM drives mirror coil drivers; LINFlex communicates with host ECU over diagnostic bus. Use Value: 150 °C junction rating enables under-hood placement; replicated STM and PIT modules ensure deterministic timing for safety-critical beam blanking; on-chip temperature sensor validates thermal derating thresholds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5674K | Same dual e200z7d core, but 384 KB SRAM (vs. 512 KB), 1.5 MB flash (vs. 2 MB), no DRAMC; 257-pin MAPBGA only | Targeted at mid-tier ADAS ECUs with lower memory footprint; lacks PDI and DRAMC - unsuitable for high-res imaging or DDR-buffered LIDAR | Select when cost-sensitive designs require lock-step safety but omit PDI, DRAM, or >384 KB SRAM |
| SPC574S54E3 | ARM Cortex-R5F dual-core (not Power Architecture); 2 MB flash, 384 KB RAM; ASIL-D certified; includes Ethernet MAC but no PDI or FlexRay | Designed for gateway and domain controller roles; lacks native parallel sensor interface and FlexRay - not drop-in for radar/motor control | Choose for AUTOSAR-compliant domain controllers needing Ethernet and functional safety, but not for sensor fusion or motor drive where PDI/FlexRay are essential |
Compared with MPC5674K and SPC574S54E3, the SPC5675KFF0VMS2 uniquely combines PDI for direct CMOS imager interfacing, FlexRay for deterministic x-by-wire communication, and 512 KB ECC SRAM for large real-time buffers - making it irreplaceable in high-integrity radar, camera, and multi-motor HEV control systems.
Availability
SPC5675KFF0VMS2 is available at Aetrix Electronics and suitable for automotive ADAS, hybrid electric vehicle motor control, LIDAR beam steering, and industrial high-temperature embedded systems requiring stable component supply across extended product lifecycles.
Supply support for SPC5675KFF0VMS2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5675KFF0VMS2 belongs to NXP's SafeAssure MPC5675K family - engineered specifically for ASIL-D–compliant advanced driver assistance systems and high-temperature motor control, integrating lock-step cores, hardware safety monitors, and sensor-optimized peripherals.
FAQ
What is the maximum operating junction temperature for the SPC5675KFF0VMS2?
The SPC5675KFF0VMS2 is qualified for continuous operation from –40 °C to +150 °C junction temperature, meeting AEC-Q100 Grade 0 requirements for under-hood automotive applications. This rating is validated across all operating modes including lock-step and decoupled core configurations, and applies to both 257-pin MAPBGA variants. Thermal derating curves and PCB copper pour recommendations are specified in Section 4.1 of the MPC5675K datasheet Rev. 9.
Does the SPC5675KFF0VMS2 support pin-compatible replacement with other MPC5675K variants?
No - the SPC5675KFF0VMS2 is a specific orderable part with fixed configuration: 257-pin MAPBGA, 512 KB SRAM, 2 MB flash, and full peripheral set including PDI and FlexRay. While it shares the same die as other MPC5675K variants, pinouts differ between 257-pin and 473-pin packages, and feature enablement (e.g., DRAMC, DDR interface) is package-dependent. Always verify pin mapping and electrical characteristics against the MPC5675K datasheet Rev. 9 before substitution.
How does the Cross Triggering Unit (CTU) enhance motor control performance in the SPC5675KFF0VMS2?
The CTU in the SPC5675KFF0VMS2 enables hardware-synchronized ADC sampling triggered directly by FlexPWM edges or eTimer events - eliminating CPU intervention and interrupt latency in current-sensing loops. It supports up to 24 programmable ADC commands per trigger list, double-buffered updates, and configurable delay compensation for analog filter lag. This allows precise, jitter-free sampling aligned to PWM switching transitions, critical for field-oriented control accuracy in 3-phase inverters.
Is the Parallel Data Interface (PDI) on the SPC5675KFF0VMS2 capable of interfacing with standard CMOS image sensors?
Yes - the SPC5675KFF0VMS2's PDI supports 8-, 10-, 12-, 14-, and 16-bit parallel data widths, programmable capture on rising or falling PIXCLK, and frame synchronization via dedicated Vsync and Hsync inputs. It includes a receive FIFO with adjustable trigger thresholds and a Data Packing Unit that aligns sensor data into 64-bit words. These features enable direct connection to automotive-grade CMOS imagers (e.g., ON Semiconductor AR0237, Sony IMX327) without external serialization logic.
What safety certifications apply to the SPC5675KFF0VMS2 for automotive use?
The SPC5675KFF0VMS2 is part of NXP's SafeAssure portfolio and designed to support ISO 26262 ASIL-D compliance. It incorporates lock-step dual-core execution, FCCU, redundancy checkers on sphere-of-replication outputs, boot-time MBIST/LBIST, and replicated safety peripherals (SWT, STM, PIT). While the device itself is not individually certified, NXP provides certified safety documentation (FMEDA, safety manual, HW/SW safety analysis) enabling system-level ASIL-D qualification - confirmed in the MPC5675K Safety Manual Rev. 3.0.
SPC5675KFF0VMS2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 473-LFBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z7d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.5V
- Data Converters:
- A/D 34x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5675KFF0VMS2 FAQ
1.How can I place an order for SPC5675KFF0VMS2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5675KFF0VMS2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5675KFF0VMS2 reliable?
The price and inventory of SPC5675KFF0VMS2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0VMS2 is usually 5 days.
3.What payment methods are accepted for SPC5675KFF0VMS2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0VMS2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5675KFF0VMS2?
SPC5675KFF0VMS2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5675KFF0VMS2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5675KFF0VMS2?
For technical support, including SPC5675KFF0VMS2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0VMS2 requirements.
6.How does Aetrix verify that SPC5675KFF0VMS2 is sourced from the original manufacturer or authorized distributors?
All SPC5675KFF0VMS2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0VMS2 meets industry standards.
7.What is the process for return or replacement of SPC5675KFF0VMS2?
All SPC5675KFF0VMS2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0VMS2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5675KFF0VMS2 part is unused and in its original packaging.
Return procedure for SPC5675KFF0VMS2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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