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NXP Semiconductors SPC5675KFF0VMS2R

Part No.:
SPC5675KFF0VMS2R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
473-LFBGA
Datasheet:
AetrixSPC5675KFF0VMS2R.pdf
Description:
IC MCU 32BIT 2MB FLASH 473MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,326

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Product details

Overview

SPC5675KFF0VMS2R from NXP Semiconductors is a dual-core 32-bit Power Architecture® e200z7d microcontroller designed for automotive ADAS and high-temperature industrial motor control. It operates up to 180 MHz, integrates 2 MB ECC code flash, 512 KB ECC SRAM, and supports LockStep or Decoupled Parallel core operation for SIL3/ASIL D safety-critical radar, LIDAR, and 3-phase motor drive systems.

For engineers reviewing the SPC5675KFF0VMS2R datasheet, SPC5675KFF0VMS2R pinout, SPC5675KFF0VMS2R application, or SPC5675KFF0VMS2R equivalent, key selection criteria include dual-core fault containment, 4 FlexCAN 2.0B interfaces with 32 message buffers each, 3 FlexPWM modules (4×3 channels), 4×12-bit ADCs with CTU-triggered synchronous sampling, and MAPBGA-257 (14 mm × 14 mm) packaging qualified for −40 °C to +150 °C junction temperature.

Technical Context

The SPC5675KFF0VMS2R implements two e200z7d cores with Harvard architecture, 16 KB instruction and 16 KB data caches per core (with EDC/parity), MMU with 64 TLB entries, and SPE2 auxiliary processing unit. It uses Variable Length Encoding (VLE) for reduced code footprint and supports both LockStep mode for functional safety and Decoupled Parallel mode for peak performance.

Its clocking system includes two FMPLLs - one for system timing and one auxiliary PLL dedicated to FlexRay and motor control peripherals - enabling independent, jitter-free PWM/timer operation at precisely controlled frequencies. Safety infrastructure includes FCCU, replicated SWT, CRC units, sphere-of-replication (SoR) with redundancy checkers on PBRIDGE, Flash, SRAM, and DMA outputs, plus boot-time MBIST/LBIST/ADC/Flash BIST.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual e200z7d Power Architecture® cores with VLE, SPE2, and MMU - enables deterministic real-time execution and ASIL D decomposition via hardware replication.
Max Core Frequency 180 MHz (+2% FM) - delivers up to 4× performance vs. MPC5561 while maintaining Power Architecture compatibility.
Memory 2 MB ECC code flash + 64 KB ECC data flash + 512 KB ECC SRAM - provides robust storage for safety-critical firmware, calibration data, and runtime variables with single-bit correction/double-bit detection.
Safety Features LockStep mode, FCCU, replicated SWT, SoR with redundancy checkers, CMU, PMU, and boot-time MBIST/LBIST - certified for ISO 26262 ASIL D and IEC 61508 SIL3 applications.
Peripherals 4 FlexCAN (2.0B), 3 FlexPWM (4×3 channels), 4×12-bit ADCs (22 ch), 3 DSPI, 4 LINFlex, 3 I2C, FEC, FlexRay v2.1, PDI - supports full sensor fusion (RADAR/LIDAR/ultrasonic), multi-motor control, and vehicle network integration.
Package & Temp MAPBGA-257 (14 mm × 14 mm), −40 °C to +150 °C junction temperature - qualified for under-hood automotive and high-temp industrial environments.

Pinout & Package

SPC5675KFF0VMS2R is housed in a 257-pin MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. The package supports thermal dissipation requirements for sustained operation at 150 °C junction temperature and is compatible with standard PCB assembly processes for automotive-grade production.

Pin/Terminal Circuit Role Design Meaning
VDD_MAIN Main power supply (3.3 V) Supplies CPU cores, caches, and most digital logic; requires low-noise regulation and local decoupling for stable 180 MHz operation.
VDD_IO I/O power supply (3.3 V) Drives all GPIOs, peripheral I/Os, and communication interfaces; independent from VDD_MAIN to support mixed-voltage signaling.
VDD_ADC ADC analog supply (3.3 V or 5 V) Provides clean reference for four 12-bit ADCs; selectable voltage allows direct interfacing with 5 V sensors without external level shifters.
XOSC_IN / XOSC_OUT External crystal oscillator interface Supports 4–40 MHz crystal input for primary clock source; enables precise frequency stability required for CAN/FlexRay timing compliance.
FMPLL_REF Auxiliary FMPLL reference input Accepts dedicated clock source for auxiliary FMPLL - isolates FlexRay and motor control timing from system clock jitter.
PDI_DATA[15:0] Parallel Data Interface data bus 16-bit bidirectional bus for high-speed image sensor or external ADC streaming; supports pixel clock synchronization and FIFO-based capture.
FLEXCAN0_TX / FLEXCAN0_RX Channel 0 CAN transceiver interface Differential pair for CAN 2.0B communication at up to 1 Mbit/s; integrated termination and filtering reduce board-level component count.
RESET_IN Asynchronous reset input Active-low signal initiating full hardware reset sequence including memory initialization, safety checker validation, and boot assist module entry.

Key Features

Feature Design Value
Dual e200z7d cores in LockStep or Decoupled mode Enables ASIL D decomposition via hardware redundancy or 360 MHz aggregate throughput for complex sensor fusion algorithms.
4×12-bit ADCs with CTU-triggered sampling Allows synchronized, jitter-free acquisition across multiple motors or sensors using hardware-generated triggers from FlexPWM or eTimer events.
3 FlexPWM modules (4×3 channels each) Supports simultaneous control of three independent 3-phase inverters with independent deadtime, polarity, and frequency configuration per bridge.
4 FlexCAN 2.0B interfaces (32 msg buffers each) Provides native connectivity to multiple vehicle domains (powertrain, chassis, ADAS) without gateway translation or bandwidth bottlenecks.
Parallel Data Interface (PDI) Enables direct connection to CMOS image sensors or high-speed ADCs at up to system bus frequency, eliminating FPGA or external buffer requirements.
On-chip DRAM controller (not present in 257-pin variant) Not applicable to SPC5675KFF0VMS2R - this MAPBGA-257 variant omits DRAMC; PDI and EBI are retained for sensor and legacy memory interfacing.

Applications

RADAR Signal Processing Unit LIDAR Motor Control Subsystem

Use Scenario: Real-time beamforming and echo processing in 77 GHz automotive RADAR modules with multiple TX/RX channels.

IC Role / Device Role / Timing Role: Primary host MCU executing DSP kernels, managing ADC data flow via CTU-synchronized sampling, and coordinating CAN/FlexRay communication with central ADAS domain controller.

Use Value: Dual-core LockStep ensures functional safety compliance while Decoupled mode accelerates FFT and CFAR algorithms; 2 MB ECC flash stores calibrated beam patterns and firmware updates.

Use Scenario: Precision galvo mirror and laser diode control in solid-state LIDAR scanners requiring sub-microsecond timing accuracy.

IC Role / Device Role / Timing Role: Timing-critical motor controller generating synchronized PWM waveforms for mirror positioning and laser pulse modulation using auxiliary FMPLL-derived clocks.

Use Value: Independent auxiliary FMPLL eliminates jitter on FlexPWM outputs; 3 FlexPWM modules drive mirror actuator, focus lens, and laser driver with programmable deadtime and edge control.

Hybrid Electric Vehicle Traction Inverter Industrial Multi-Axis Servo Drive

Use Scenario: High-reliability 3-phase inverter control in HEV powertrains operating continuously at 150 °C junction temperature.

IC Role / Device Role / Timing Role: Safety-certified MCU managing gate driver signals, current sensing, thermal monitoring, and fault response via FCCU and replicated SWT.

Use Value: SoR architecture validates critical control paths; 512 KB ECC SRAM buffers real-time torque/position data; 4×12-bit ADCs sample phase currents with <1 μs latency.

Use Scenario: Compact, fanless servo drive controlling up to three axes in robotics or CNC machinery with strict EMC and thermal constraints.

IC Role / Device Role / Timing Role: Central motion controller executing PID loops, generating synchronized PWM for IGBT/MOSFET drivers, and communicating via EtherCAT or CANopen.

Use Value: 3 eTimer modules provide encoder quadrature decoding and position capture; FlexCAN and LINFlex enable multi-protocol fieldbus support; 14 mm × 14 mm MAPBGA fits tight PCB layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5674KFF0VMS2R Same dual e200z7d core, but 384 KB ECC SRAM and 1.5 MB ECC flash; lacks DRAM controller and one DSPI module. Targeted at mid-tier ADAS ECUs where memory footprint and peripheral count are lower; not qualified for highest ASIL D decomposition depth. Select when cost-sensitive designs require proven safety architecture but do not need maximum memory or FlexRay support.
SPC574S54E3MLU3 Single-core SPC574S with e200z4, 2 MB flash, 384 KB RAM; supports ASIL D via software-based safety libraries rather than hardware SoR. Better suited for non-safety-critical body control or gateway applications; lacks LockStep, CTU, and PDI - no native image sensor interface. Select for cost-optimized, lower-compute automotive nodes where hardware redundancy is not mandated by functional safety goals.

Compared with MPC5674KFF0VMS2R and SPC574S54E3MLU3, the SPC5675KFF0VMS2R delivers the highest on-chip memory capacity, full FlexRay v2.1 support, and hardware-enforced sphere-of-replication - making it the only option among the three qualified for full ASIL D radar/LIDAR sensor fusion and traction inverter control without external safety monitors.

Availability

SPC5675KFF0VMS2R is available at Aetrix Electronics and suitable for automotive ADAS sensor modules, hybrid electric vehicle traction inverters, and high-temperature industrial servo drives requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.

Supply support for SPC5675KFF0VMS2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.

The SPC5675KFF0VMS2R belongs to NXP's SafeAssure portfolio of ASIL D–certified MCUs, engineered specifically for advanced driver assistance systems and high-reliability motor control where hardware-based fault containment and deterministic real-time performance are mandatory.

FAQ

What is the package type and pin count of the SPC5675KFF0VMS2R?

The SPC5675KFF0VMS2R uses a 257-ball MAPBGA package with 14 mm × 14 mm body size and 0.8 mm ball pitch. This variant does not include the DRAM controller found in the 473-pin version, but retains PDI, EBI, and full peripheral complement for sensor and motor control applications.

Does the SPC5675KFF0VMS2R support LockStep operation for functional safety?

Yes, the SPC5675KFF0VMS2R supports hardware LockStep mode between its dual e200z7d cores, with sphere-of-replication (SoR) covering key modules including PBRIDGE, Flash Controller, SRAM, and DMA. Redundancy checkers feed into the FCCU for ASIL D–compliant fault detection and response.

What is the maximum operating temperature specification for the SPC5675KFF0VMS2R?

The SPC5675KFF0VMS2R is rated for a junction temperature range of −40 °C to +150 °C and is qualified to AEC-Q100 Grade 1 standards. This enables deployment in under-hood automotive locations and high-temperature industrial enclosures without forced cooling.

How many FlexCAN interfaces does the SPC5675KFF0VMS2R include, and what protocol versions are supported?

The SPC5675KFF0VMS2R integrates four FlexCAN modules, each compliant with CAN 2.0B Active specification and supporting up to 32 message buffers. All modules support programmable acceptance filters, listen-only mode, and autonomous Rx filtering - essential for multi-domain vehicle networking.

Is the SPC5675KFF0VMS2R pin-compatible with other members of the MPC567xK family?

No, the SPC5675KFF0VMS2R is not pin-compatible with MPC5673K or MPC5674K variants due to differences in ball mapping and peripheral routing. While all share the same MAPBGA-257 mechanical outline, signal assignments - especially for PDI, EBI, and FlexRay - differ significantly between family members.

What development tools are officially supported for the SPC5675KFF0VMS2R?

NXP officially supports SPC5675KFF0VMS2R with S32 Design Studio for Power Architecture, CodeWarrior Development Studio, and the MPC5675K Evaluation Board (MPC5675K-EVB). Debugging uses Nexus Class 3+ interface with support for cores, SRAM ports, and real-time trace via third-party probes like Lauterbach TRACE32.

SPC5675KFF0VMS2R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
473-LFBGA
Series:
MPC56xx Qorivva
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
e200z7d
Core Size:
32-Bit Dual-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
-
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 5.5V
Data Converters:
A/D 34x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5675KFF0VMS2R FAQ

1.How can I place an order for SPC5675KFF0VMS2R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5675KFF0VMS2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5675KFF0VMS2R reliable?

The price and inventory of SPC5675KFF0VMS2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5675KFF0VMS2R is usually 5 days.

3.What payment methods are accepted for SPC5675KFF0VMS2R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5675KFF0VMS2R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5675KFF0VMS2R?

SPC5675KFF0VMS2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5675KFF0VMS2R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5675KFF0VMS2R?

For technical support, including SPC5675KFF0VMS2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5675KFF0VMS2R requirements.

6.How does Aetrix verify that SPC5675KFF0VMS2R is sourced from the original manufacturer or authorized distributors?

All SPC5675KFF0VMS2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5675KFF0VMS2R meets industry standards.

7.What is the process for return or replacement of SPC5675KFF0VMS2R?

All SPC5675KFF0VMS2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5675KFF0VMS2R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5675KFF0VMS2R part is unused and in its original packaging.

Return procedure for SPC5675KFF0VMS2R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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