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NXP Semiconductors SPC5676RDK3MVU1R
- Part No.:
- SPC5676RDK3MVU1R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5676RDK3MVU1R.pdf
- Description:
- IC MCU 32BIT 6MB FLASH 416PBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5676RDK3MVU1R from NXP Semiconductors (formerly Freescale) is a dual-core Power Architecture microcontroller designed for high-reliability automotive powertrain and chassis control. It integrates two e200z7 CPU cores (180 MHz each), 6 MB on-chip flash, 384 KB SRAM (including 48 KB standby RAM), dual FlexRay controllers, four FlexCAN modules, three eTPU2 units (96 channels total), and dual eQADC modules supporting up to 176 analog inputs. It targets engine control units (ECUs) requiring deterministic real-time response and functional safety compliance.
For engineers reviewing the SPC5676RDK3MVU1R datasheet, SPC5676RDK3MVU1R pinout, SPC5676RDK3MVU1R application, or SPC5676RDK3MVU1R equivalent, key selection criteria include dual-core lockstep capability, ASIL-D-ready peripheral redundancy (e.g., dual eQADC, dual FlexRay), FMPLL with frequency modulation for EMI reduction, Nexus 5001-2003 debug support, and TEPBGA-416 packaging optimized for automotive thermal and vibration environments.
Technical Context
The SPC5676RDK3MVU1R implements a crossbar switch architecture enabling concurrent access to flash, SRAM, and peripherals by multiple bus masters-including dual eDMA controllers (64 channels each) and two e200z7 cores with hardware cache coherency. Its FMPLL supports ±2% frequency modulation to spread spectral energy and reduce peak EMI emissions during automotive ECU operation.
Peripherals are partitioned across system integration units (SIUA/SIUB) with error correction status monitoring (ECSM), and boot is managed via Boot Assist Module (BAM) supporting serial loading over CAN or SCI. The device includes dedicated protected port output (PPO) pins and self-test capability aligned with ISO 26262 diagnostic requirements for ASIL B/D systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Two e200z7 cores, dual-issue 32-bit Power Architecture v2.03, VLE/SPE/FPU enabled - enables deterministic dual-core execution with code density optimization and DSP acceleration for motor control algorithms. |
| Flash Memory | 6 MB on-chip C90 flash with read-while-program/erase and EEPROM emulation - supports robust firmware updates and parameter storage without external non-volatile memory. |
| SRAM | 384 KB general-purpose SRAM, including 48 KB standby RAM - retains critical state during low-power sleep modes while supporting large real-time buffers. |
| eTPU2 Channels | 96 total enhanced time processing unit channels (32 per eTPU2 × 3 units) - delivers precise, autonomous timing for ignition, injection, and valve control with sub-microsecond resolution. |
| eQADC Inputs | 64 dedicated analog input pins, expandable to 176 with off-chip multiplexers - enables comprehensive sensor acquisition (e.g., crankshaft, camshaft, knock, pressure) in multi-cylinder engine ECUs. |
| Communication Interfaces | Four FlexCAN 2.0B modules, dual-channel FlexRay v2.1 controller, five DSPI, three eSCI - meets automotive network requirements for high-speed deterministic communication and legacy protocol support. |
| Package | TEPBGA-416, 27 mm × 27 mm, lead-free - provides high I/O count and thermal performance suitable for under-hood automotive applications with JEDEC MSL3 handling. |
Pinout & Package
SPC5676RDK3MVU1R is housed in a 416-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm, optimized for automotive thermal dissipation and mechanical reliability. Pin assignments follow the MPC5676R 416-ball TEPBGA ball map (Document Number MPC5676R, Rev. 4, Section 3.1), with dedicated power domains (VDD, VDDE2, VDDEHx, VDDA_A/B, VSSA_A/B), analog reference pins (VRH_A/B, VRL_A/B), and function-multiplexed I/O grouped by peripheral subsystem (eTPU2, eMIOS, eQADC, FlexCAN, FlexRay).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD / VSS | Core power supply / ground | 1.2 V ±10% core logic supply; requires tight decoupling for stable dual-core operation at 180 MHz. |
| VDDA_A0 / VDDA_B0 | Analog domain power | Independent 5 V-tolerant analog supplies for ADC reference domains-enables noise-isolated sensor signal conditioning. |
| VRH_A / VRL_A | Analog reference high/low | Differential reference inputs for eQADC A-side; support ratiometric measurements with external sensors. |
| ETPUB0–ETPUB31 | eTPU2 channel I/O | 32 dedicated pins for second-generation time processor unit B - drive high-precision PWM, capture, or waveform generation without CPU intervention. |
| FR_A_TX / FR_A_RX | FlexRay Channel A differential pair | Terminated differential signaling interface compliant with FlexRay v2.1 physical layer - used for time-triggered chassis or ADAS backbone networks. |
| CNRXA / CNRXB | FlexCAN RX inputs | Multiple CAN receive pins mapped to independent FlexCAN modules - allows concurrent monitoring of multiple CAN buses (e.g., powertrain + body). |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z7 cores with hardware cache coherency | Enables lockstep or split-mode operation for ASIL-D fault containment while maintaining shared memory consistency without software overhead. |
| FMPLL with frequency modulation | Reduces electromagnetic interference peaks by spreading clock spectrum-critical for passing CISPR 25 Class 5 radiated emissions in engine compartments. |
| Three eTPU2 units (96 channels) | Offloads timing-critical engine functions (e.g., spark advance, fuel injection sequencing) from CPU, improving determinism and reducing jitter below 100 ns. |
| Dual eQADC with 12 decimation filters | Supports simultaneous oversampling and digital filtering of multiple sensor signals (e.g., knock detection), eliminating need for external sigma-delta converters. |
| Nexus 5001-2003 debug interface | Provides real-time trace, data watchpoints, and non-intrusive debugging essential for ISO 26262 tool qualification and safety verification. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time management of fuel injection timing, ignition spark advance, and air-fuel ratio in gasoline/diesel engines using feedback from crank/cam position, oxygen, and knock sensors. IC Role / Device Role / Timing Role: Primary compute and I/O hub executing closed-loop control algorithms with sub-millisecond latency; eTPU2 handles cylinder-specific timing events. Use Value: 96 eTPU2 channels enable independent per-cylinder control; dual eQADC with 176-input expansion supports full sensor suite without multiplexer bottlenecks. | Use Scenario: Closed-loop hydraulic pressure control, gear shift scheduling, and clutch engagement timing in automatic and dual-clutch transmissions. IC Role / Device Role / Timing Role: Safety-critical controller managing torque converter lockup, solenoid actuation, and CAN-based communication with engine ECU and vehicle network. Use Value: Four FlexCAN modules allow concurrent communication on powertrain, chassis, and diagnostic buses; PPO pins provide fail-safe output disabling under fault conditions. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
Use Scenario: Torque assist calculation, motor phase commutation, and road feel feedback in column- or rack-mounted EPS systems. IC Role / Device Role / Timing Role: High-integrity motor controller interfacing with resolver/sensor feedback, three-phase inverter gate drivers, and vehicle CAN network. Use Value: SPE extension accelerates motor FOC calculations; dual-core lockstep mode satisfies ASIL-D requirements for steering assist failure mitigation. | Use Scenario: Anti-lock braking (ABS), electronic stability control (ESC), and brake-by-wire actuation in integrated chassis control systems. IC Role / Device Role / Timing Role: Fault-tolerant controller coordinating wheel speed sensing, hydraulic valve actuation, and FlexRay-based coordination with other chassis ECUs. Use Value: Dual FlexRay channels provide redundant, time-triggered communication for safety-critical chassis coordination; ECSM monitors memory integrity for ASIL-B/D compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5676RDK2MVU1R | Same die, identical 416-ball TEPBGA package and 180 MHz core speed, but pre-qualification status (P-prefix) vs. fully qualified SPC5676RDK3MVU1R (S-prefix). | Intended for early development and validation; not approved for production automotive programs requiring full AEC-Q100 Grade 1 qualification. | Select SPC5676RDK3MVU1R for production releases requiring full automotive qualification and long-term supply assurance. |
| SPC574SxxE1MLU2 | Successor family with e200z4-based dual-core, 4 MB flash, 512 KB SRAM, and enhanced safety features (lockstep Cortex-M4F companion core), but no eTPU2 or FlexRay. | Targets next-gen powertrain with higher ASIL-D decomposition; lacks eTPU2 for legacy timing-critical engine functions and FlexRay for chassis backbone. | Choose only when migrating to newer architecture and abandoning eTPU2/FlexRay dependencies; not a drop-in replacement. |
Compared with MPC5676RDK2MVU1R, SPC5676RDK3MVU1R offers production-grade qualification and extended lifecycle support; compared with SPC574SxxE1MLU2, it retains mature eTPU2 and FlexRay for legacy engine/chassis integration but lacks newer safety co-processor features.
Availability
SPC5676RDK3MVU1R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control units requiring stable component supply across extended automotive product lifecycles.
Supply support for SPC5676RDK3MVU1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture microcontrollers from its Freescale acquisition.
The SPC5676RDK3MVU1R belongs to the SPC56xR automotive MCU family, engineered specifically for high-performance, safety-critical powertrain and chassis control applications demanding ASIL-B/D compliance, real-time determinism, and robust EMI resilience.
FAQ
What is the operating temperature range for the SPC5676RDK3MVU1R?
The SPC5676RDK3MVU1R is rated for an ambient operating temperature range of –40 °C to +125 °C, meeting AEC-Q100 Grade 1 requirements for under-hood automotive applications. Its thermal design supports junction temperatures up to 150 °C, validated for use in engine control units and transmission control modules exposed to extreme thermal cycling.
Does the SPC5676RDK3MVU1R support lockstep dual-core operation?
Yes, the SPC5676RDK3MVU1R supports lockstep configuration of its two e200z7 cores for fault detection in safety-critical applications. This mode is integral to its ISO 26262 ASIL-D readiness, with hardware-assisted comparison logic and error signaling through the System Integration Unit (SIU) and Error Correction Status Module (ECSM).
What debug interface does the SPC5676RDK3MVU1R provide?
The SPC5676RDK3MVU1R implements the Nexus 5001-2003 standard debug interface (IEEE-ISTO 5001-2003) with partial support for the 2010 revision. It enables real-time instruction trace, data watchpoints, and non-intrusive debugging-essential for functional safety verification and tool qualification under ISO 26262.
How many analog-to-digital converter channels does the SPC5676RDK3MVU1R support?
The SPC5676RDK3MVU1R integrates two enhanced queued ADC (eQADC) modules supporting up to 64 dedicated analog input pins. With external analog multiplexers, this expands to 176 total inputs-sufficient for comprehensive sensor acquisition in multi-cylinder engine ECUs, including knock, pressure, temperature, and position sensors.
Is the SPC5676RDK3MVU1R pin-compatible with other MPC5676R variants?
Yes, the SPC5676RDK3MVU1R uses the 416-ball TEPBGA package (VU suffix) and shares identical pinout with other MPC5676R 416-pin variants like SPC5676RDK2MVU1R. However, differences in qualification status, internal fuse settings, and factory programming mean PCB layout reuse is possible but firmware and safety validation must be re-performed for production release.
SPC5676RDK3MVU1R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- e200z7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, EBI/EMI, SCI, SPI
- Peripherals:
- DMA, POR, PWM
- Number of I/O:
- -
- Program Memory Size:
- 6MB (6M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 1.32V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5676RDK3MVU1R FAQ
1.How can I place an order for SPC5676RDK3MVU1R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5676RDK3MVU1R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5676RDK3MVU1R reliable?
The price and inventory of SPC5676RDK3MVU1R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5676RDK3MVU1R is usually 5 days.
3.What payment methods are accepted for SPC5676RDK3MVU1R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5676RDK3MVU1R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5676RDK3MVU1R?
SPC5676RDK3MVU1R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5676RDK3MVU1R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5676RDK3MVU1R?
For technical support, including SPC5676RDK3MVU1R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5676RDK3MVU1R requirements.
6.How does Aetrix verify that SPC5676RDK3MVU1R is sourced from the original manufacturer or authorized distributors?
All SPC5676RDK3MVU1R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5676RDK3MVU1R meets industry standards.
7.What is the process for return or replacement of SPC5676RDK3MVU1R?
All SPC5676RDK3MVU1R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5676RDK3MVU1R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5676RDK3MVU1R part is unused and in its original packaging.
Return procedure for SPC5676RDK3MVU1R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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