STMicroelectronics SPC56AP60L3CEFBR
- Part No.:
- SPC56AP60L3CEFBR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC56AP60L3CEFBR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,491
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC56AP60L3CEFBR from STMicroelectronics is a 32-bit Power Architecture® e200z0h-based automotive MCU with 1088 KB Flash (1024 KB code + 64 KB EEPROM emulation), 80 KB ECC-protected SRAM, and AEC-Q100 qualification for chassis/safety systems. It integrates dual FlexCAN 2.0B interfaces, FlexRay V2.1 (dual-channel, up to 10 Mbit/s), 2 LINFlex, 5 DSPI, 2 eTimer units, and a 10-bit ADC with 27 channels and <1 µs conversion time - deployed in electronic braking control units (EBCU) and steering angle sensor modules.
For engineers reviewing the SPC56AP60L3CEFBR datasheet, SPC56AP60L3CEFBR pinout, SPC56AP60L3CEFBR application, or SPC56AP60L3CEFBR equivalent, key selection criteria include functional safety compliance (FCCU, safety port, SWT pseudo-random servicing), dual-core fail-safe architecture, FlexRay+CAN coexistence capability, and LQFP100 package thermal performance at −40 to 125 °C ambient.
Technical Context
This MCU implements a single-issue e200z0h core running at 64 MHz with Variable Length Encoding (VLE), coupled with a crossbar switch (XBAR) for concurrent peripheral access. Memory subsystem includes ECC-protected Flash and SRAM, supported by Fault Collection and Control Unit (FCCU) and Safety Port - a dedicated FlexCAN instance repurposed for ASIL-D–capable communication paths.
The timing architecture combines FMPLL with main oscillator and 16 MHz RC oscillator, enabling robust clock domain management. Peripheral integration centers on deterministic real-time I/O: 2 eTimer units (6 timers total, quadrature decode, double-buffered capture/compare), 16-channel eDMA, and CTU-triggered ADC sampling - all synchronized under Nexus® L2+ debug visibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h @ 64 MHz, Power Architecture® embedded category, VLE support for code density optimization |
| Flash Memory | 1024 KB code Flash + 64 KB data Flash (EEPROM emulation), with ECC and integrated erase/program controller |
| SRAM | 80 KB on-chip SRAM with ECC, supporting fault-tolerant data storage for safety-critical variables |
| ADC | 10-bit resolution, 27 input channels, <1 µs full-precision conversion time including sampling |
| FlexRay | V2.1 compliant, dual or single channel, 64 message buffers, up to 10 Mbit/s data rate for time-triggered networking |
| Operating Temperature | −40 °C to 125 °C ambient, qualified per AEC-Q100 Grade 0 for under-hood chassis applications |
| Safety Features | FCCU, safety port (FlexCAN-based), SWT with pseudo-random servicing sequence, non-maskable interrupt, register protection |
Pinout & Package
LQFP100 package (14 × 14 mm, 0.5 mm pitch), RoHS-compliant ECOPACK®, rated for −40 to 125 °C operation. Pin count: 100 leads with 49 GPIO + 16 GPI, power/ground segmentation per supply domain (VDD/VSS, VDDA/VSSA, VDDIO/VSSIO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Main core power/ground | 1.2 V nominal core supply; supports low-power modes with voltage regulator (VREG) and brown-out detection |
| VDDA, VSSA | Analog ADC reference supply/ground | Independent 3.3 V or 5 V supply path for ADC accuracy; decoupling required per datasheet Figure 6 |
| VDDIO, VSSIO | I/O bank supply/ground | Configurable 3.3 V or 5 V I/O voltage (via NVUSRO[PAD3V5V]); enables mixed-voltage system interfacing |
| RESET | Asynchronous reset input | Active-low, Schmitt-triggered, with internal pull-up; meets 83 ns minimum pulse width per AC spec Table 37 |
| CLKIN | External crystal/oscillator input | Supports 4–20 MHz crystal; feeds FMPLL for system clock generation with frequency modulation capability |
| NEXUS_TDI/TDO/TCK/TMS | Nexus® L2+ debug interface | Enables real-time trace, hardware breakpoints, and safety-critical firmware validation per ISO 26262 tool qualification |
Key Features
| Feature | Design Value |
|---|---|
| Safety Port | Dedicated FlexCAN instance configurable as third CAN or ASIL-D–compliant safety channel, isolated via FCCU-controlled gating |
| Fail-Safe Protection | ECC on Flash/SRAM, SWT with pseudo-random servicing, non-maskable interrupt, register lock bits, and safe SoC mode entry |
| eTimer Quadrature Decode | Hardware rotation direction flag + index pulse detection per timer; eliminates CPU overhead in motor position sensing |
| CTU-Triggered ADC Sampling | Programmable cross-trigger unit synchronizes ADC start-of-conversion with eTimer compare events or PWM edges |
| FlexRay Dual-Channel Operation | Simultaneous transmission/reception on two independent FlexRay channels, supporting redundancy or bandwidth aggregation |
Applications
| Electronic Braking Control Unit (EBCU) | Electric Power Steering (EPS) ECU |
|---|---|
|
Use Scenario: Real-time pressure modulation and wheel-speed fusion in ABS/ESC systems with ISO 26262 ASIL D decomposition. IC Role / Device Role / Timing Role: Primary safety controller executing brake actuation logic, monitoring dual CAN buses (main + safety port), and managing FlexRay-synchronized sensor clusters. Use Value: FCCU-managed fault containment and ECC-protected memory ensure deterministic response within 5 ms worst-case latency under fault conditions. |
Use Scenario: Torque overlay control and motor phase current regulation in column-assist EPS systems operating at 125 °C under hood. IC Role / Device Role / Timing Role: Main compute engine handling motor commutation (via eTimer PWM), torque calculation (ADC + CTU), and vehicle bus coordination (2 CAN + LIN). Use Value: 10-bit ADC with <1 µs conversion and eTimer quadrature decode enable sub-degree steering angle resolution at 10 kHz sampling. |
| Active Suspension Controller | Chassis Domain Controller |
|
Use Scenario: Closed-loop damping control using accelerometer feedback and solenoid valve drive in adaptive air suspension systems. IC Role / Device Role / Timing Role: Real-time signal acquisition (27-channel ADC), high-frequency PWM generation (eTimer), and FlexRay backbone communication for multi-node synchronization. Use Value: Dual-channel FlexRay (10 Mbit/s) ensures 100 µs cycle time across 8-node network while maintaining ASIL B integrity. |
Use Scenario: Centralized chassis arbitration coordinating brake, steering, and suspension ECUs via time-triggered and event-triggered messaging. IC Role / Device Role / Timing Role: Domain master managing FlexRay schedule, CAN gatewaying, and safety state distribution via safety port and FCCU status registers. Use Value: Safety port + FCCU enables seamless fail-operational handover to redundant controller without external watchdog intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive chassis microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144 | ARM Cortex-M4F core, 1 MB Flash, 128 KB RAM, no FlexRay, single CAN FD | Targeted at ASIL-B body electronics; lacks FlexRay and dual-CAN 2.0B + safety port architecture | Select when migrating to ARM ecosystem and FlexRay is not required; verify FCCU-equivalent diagnostics coverage. |
| Renesas RH850/F1L | 32-bit RXv2 core, 2 MB Flash, 384 KB RAM, 3 CAN FD, no FlexRay, JTAG-only debug | Optimized for high-integration powertrain; lacks Nexus L2+ trace and safety port abstraction layer | Prefer for cost-sensitive ASIL-C applications where FlexRay independence is unnecessary and higher Flash/RAM is needed. |
Compared with SPC56AP60L3CEFBR, S32K144 offers ARM toolchain familiarity but omits FlexRay and safety port functionality critical for ASIL-D chassis networks, while RH850/F1L provides greater memory headroom but sacrifices Nexus trace and integrated safety communication primitives.
Availability
SPC56AP60L3CEFBR is available at Aetrix Electronics and suitable for electronic braking control units (EBCU), electric power steering (EPS) ECUs, and active suspension controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC56AP60L3CEFBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade ASSPs since 1987.
The SPC56xP series targets ASIL-D–compliant automotive chassis and safety systems, emphasizing hardware-enforced fault containment, time-triggered networking (FlexRay), and certified debug infrastructure (Nexus L2+) for ISO 26262 development.
FAQ
What is the maximum junction temperature specification for SPC56AP60L3CEFBR?
The device is rated for operation up to 150 °C junction temperature, validated under AEC-Q100 stress testing. Thermal derating begins above 125 °C ambient, with thermal resistance θJA = 32 °C/W for LQFP100 per datasheet Table 13. PCB layout must include ≥4 thermal vias under exposed pad and 2 oz copper pour for sustained 125 °C ambient operation.
Does SPC56AP60L3CEFBR support CAN FD?
No. The device integrates two FlexCAN 2.0B Active interfaces and one safety-port FlexCAN instance - all compliant with ISO 11898-1:2015 (Classical CAN only). CAN FD frame support is absent; migration to CAN FD requires architectural redesign using newer SPC58 or ST's Stellar platform.
How is the safety port configured and validated?
The safety port is a dedicated FlexCAN module configured via FCCU registers and SIUL pin muxing. Validation requires executing ST's SPC56 Safety Manual test suite, confirming message buffer isolation, CRC error injection response, and safe-mode entry within 100 µs of fault detection - documented in UM1823 Annex B.
What boot mechanisms does SPC56AP60L3CEFBR support?
It supports on-chip CAN/UART bootstrap loader with Boot Assist Module (BAM), enabling field firmware updates via CAN or UART without external programmer. Secure boot is not integrated; cryptographic verification requires external secure element or software-implemented HMAC-SHA256 with keys stored in protected Flash sectors.
SPC56AP60L3CEFBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 16x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC56AP60L3CEFBR FAQ
1.How can I place an order for SPC56AP60L3CEFBR through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC56AP60L3CEFBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC56AP60L3CEFBR reliable?
The price and inventory of SPC56AP60L3CEFBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC56AP60L3CEFBR is usually 5 days.
3.What payment methods are accepted for SPC56AP60L3CEFBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC56AP60L3CEFBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC56AP60L3CEFBR?
SPC56AP60L3CEFBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC56AP60L3CEFBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC56AP60L3CEFBR?
For technical support, including SPC56AP60L3CEFBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC56AP60L3CEFBR requirements.
6.How does Aetrix verify that SPC56AP60L3CEFBR is sourced from the original manufacturer or authorized distributors?
All SPC56AP60L3CEFBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC56AP60L3CEFBR meets industry standards.
7.What is the process for return or replacement of SPC56AP60L3CEFBR?
All SPC56AP60L3CEFBR units undergo pre-shipment inspection (PSI). If there is an issue with SPC56AP60L3CEFBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC56AP60L3CEFBR part is unused and in its original packaging.
Return procedure for SPC56AP60L3CEFBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC56AP60L3CEFBR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

