STMicroelectronics SPC56EC64B3C9EEY
- Part No.:
- SPC56EC64B3C9EEY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 256-LBGA
- Datasheet:
-
SPC56EC64B3C9EEY.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 256LBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC56EC64B3C9EEY from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z4d core, operating up to 120 MHz (200 MIPs), with 1.5 MByte on-chip Flash (ECC), 256 KByte SRAM (ECC), and integrated FlexCAN, DSPI, LINFlex, Ethernet, and Cryptographic Services Engine (AES-128). It targets body control modules requiring functional safety compliance and real-time diagnostics in vehicles.
For engineers reviewing the SPC56EC64B3C9EEY datasheet, SPC56EC64B3C9EEY pinout, SPC56EC64B3C9EEY application, or SPC56EC64B3C9EEY equivalent, key selection criteria include ASIL-B capable safety features, dual ADC support (10-/12-bit, up to 90 channels), CAN Sampler for low-power wake-up, and Nexus 3+ debug interface on LBGA256 package.
Technical Context
This MCU integrates dual Power Architecture® cores - a high-performance e200z4d (120 MHz) and a dedicated e200z0h (80 MHz) for safety-critical background tasks - enabling lockstep or split-mode operation per ISO 26262 requirements. Its memory subsystem includes ECC-protected Flash, SRAM, and Data Flash, plus a 16-entry MPU and user-selectable Memory BIST for runtime integrity verification.
The peripheral set is optimized for automotive body electronics: 6 FlexCAN controllers (64 buffers each), Fast Ethernet Controller (MII interface), 8 DSPI channels, 10 LINFlex/UARTs, and eMIOS with 64 PWM-capable channels synchronized to ADC conversions - all supporting diagnostic coverage via built-in analog watchdogs and shifted PWM generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z4d (120 MHz, 200 MIPs) + e200z0h (80 MHz, 75 MIPs) for safety partitioning |
| Flash Memory | 1.5 MByte on-chip with ECC, enabling ASIL-B compliant code storage and error correction |
| SRAM | 256 KByte on-chip with ECC, supporting safe data buffering and runtime variable protection |
| ADC | Two independent units: 10-bit (ADC_0, up to 62 ch.) and 12-bit (ADC_1, up to 62 ch.), extendable to 90 total with analog watchdog |
| Communication | 6 FlexCAN (64 buffers each), 10 LINFlex/UART, 8 DSPI, I²C, FlexRay (dual-channel, 128 buffers), Fast Ethernet (MII) |
| Cryptographic Engine | CSE with AES-128 encryption/decryption and CMAC authentication for secure boot and firmware updates |
| Package | LBGA256 (17 × 17 mm, 1.7 mm height), qualified for -40 to +125 °C automotive operation |
Pinout & Package
SPC56EC64B3C9EEY is housed in a 256-ball LBGA package (17 × 17 mm, 1.7 mm height) with 0.8 mm ball pitch, designed for high-density automotive PCB layouts and thermal reliability under under-hood conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 3.3 V ±5% dedicated supply for ADC, reference, and analog peripherals; requires local decoupling |
| VDD | Digital core power | 3.3 V or 5 V single-supply operation; internal regulator supports external ballast transistor |
| RESET_B | Active-low reset input | Asynchronous reset with noise filtering capability; initiates cold start or safety recovery sequence |
| CLKIN | External crystal oscillator input | Accepts 4–40 MHz crystal; used with FMPLL for precise clock generation and jitter control |
| ETH_MII_RXD[3:0] | Ethernet receive data bus | MII interface pins supporting 10/100 Mbps Fast Ethernet with deterministic timing (tSU, tH, tJIT) |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential I/O | High-speed CAN physical layer interface compliant with ISO 11898-2; supports wake-up and loopback self-test |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core safety architecture | e200z4d + e200z0h enable hardware-diverse execution paths for fault detection and ASIL-B compliance |
| Memory protection & test | 16-entry MPU enforces privilege separation; user-selectable Memory BIST validates Flash/SRAM before critical operations |
| Diagnostic PWM & ADC sync | Advanced shifted PWM generation with ADC conversion triggered on edge for lighting control accuracy and EMI reduction |
| Low-power wake-up capability | CAN Sampler stores incoming CAN IDs during STANDBY mode, enabling sub-100 µA current draw with selective wake-up |
| Nexus 3+ debug interface | Real-time trace, non-intrusive debugging, and safety-critical runtime monitoring on LBGA256 package only |
Applications
| Body Control Module (BCM) | Roof Module |
|---|---|
Use Scenario: Centralized management of door locks, windows, mirrors, interior lighting, and HVAC actuators in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary application controller executing ASIL-B software stacks, coordinating CAN/LIN communication, and managing PWM-driven LED lighting sequences. Use Value: Integrated eMIOS with 64 synchronized PWM/ADC channels eliminates external timing ICs and reduces BOM count by 3+ components per module. | Use Scenario: Smart sunroof, panoramic roof, and overhead console with gesture sensing, ambient lighting, and rain sensor integration. IC Role / Device Role / Timing Role: Real-time sensor fusion hub processing analog inputs (rain, light, touch) while driving multi-zone RGBW LED arrays with flicker-free dimming. Use Value: Dual ADC (10-/12-bit) with analog watchdog enables simultaneous high-precision rain detection and ambient light measurement without CPU intervention. |
| Seat Control Unit | Front-end Gateway |
Use Scenario: Motorized seat position memory, heating/ventilation control, and occupant detection via pressure sensors and thermistors. IC Role / Device Role / Timing Role: Safety-aware motor driver supervisor using CSE-secured firmware updates and CRC-checked CAN message routing between LIN slave nodes. Use Value: Cryptographic Services Engine ensures OTA update authenticity, preventing unauthorized firmware injection during service campaigns. | Use Scenario: In-vehicle network bridge aggregating CAN FD, LIN, and Ethernet traffic between domain controllers and infotainment systems. IC Role / Device Role / Timing Role: High-throughput gateway processor with 6 FlexCAN interfaces, Fast Ethernet MAC, and 8 DSPI channels for external transceivers and security modules. Use Value: On-chip Fast Ethernet Controller (MII) eliminates need for external PHY in cost-sensitive gateway designs, reducing latency by ≥1.2 µs vs. SPI-based alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC56EC70B3C9EEY | 2 MByte Flash, 256 KByte SRAM - same LBGA256 package and peripheral set | Supports larger AUTOSAR OS images and more complex diagnostic routines | Select when >1.5 MByte application code size or extended calibration data storage is required |
| SPC56EC74B3C9EEY | 3 MByte Flash, 256 KByte SRAM - identical pinout and timing specs | Enables full-featured body domain controller with redundant safety firmware partitions | Choose for ASIL-D system decomposition where dual independent firmware images are mandated |
Compared with SPC56EC64B3C9EEY, the SPC56EC70B3 offers scalable Flash capacity without peripheral or timing trade-offs, while SPC56EC74B3 provides headroom for future-proofing safety-critical firmware redundancy - both maintain identical debug, power, and thermal behavior.
Availability
SPC56EC64B3C9EEY is available at Aetrix Electronics and suitable for body control modules, roof modules, seat control units, and front-end gateways requiring stable component supply across automotive production lifecycles.
Supply support for SPC56EC64B3C9EEY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in automotive-grade microcontrollers, power management, and sensing solutions with ISO/TS 16949-certified manufacturing.
The SPC56ECxx series is designed specifically for ASIL-B automotive body electronics applications, emphasizing functional safety, diagnostic coverage, and integration of CAN, Ethernet, and lighting-specific peripherals.
FAQ
What is the maximum operating temperature range for SPC56EC64B3C9EEY?
The device is qualified for continuous operation from -40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. Thermal derating begins above 105 °C junction temperature, and the LBGA256 package's θJA is 28.5 °C/W (JEDEC standard board), requiring appropriate PCB copper pour and airflow in under-hood environments.
Does SPC56EC64B3C9EEY support secure boot with cryptographic verification?
Yes - the integrated Cryptographic Services Engine (CSE) performs AES-128 decryption and CMAC authentication of boot images stored in protected Flash sectors. Secure boot is enabled via fuse-controlled configuration and validated during POR reset before application code execution begins.
Is Nexus 3+ debug supported on all package variants of this MCU?
No - Nexus 3+ is available only on the LBGA256 package (e.g., SPC56EC64B3C9EEY); LQFP176 and LQFP208 variants support Nexus 1 only. Nexus 3+ provides real-time instruction trace, data watchpoints, and safety-critical runtime monitoring not available in Nexus 1.
How many CAN interfaces does SPC56EC64B3C9EEY support, and what buffer depth is provided per channel?
The MCU integrates six independent FlexCAN controllers, each with 64 message buffers configurable as transmit or receive objects. All six channels support CAN 2.0B protocol, wakeup capability, and loopback self-test modes - no external CAN transceivers are required for basic validation.
SPC56EC64B3C9EEY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 256-LBGA
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h, e200z4d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz/120MHz
- Connectivity:
- CANbus, Ethernet, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 199
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 33x10b, 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC56EC64B3C9EEY FAQ
1.How can I place an order for SPC56EC64B3C9EEY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC56EC64B3C9EEY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC56EC64B3C9EEY reliable?
The price and inventory of SPC56EC64B3C9EEY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC56EC64B3C9EEY is usually 5 days.
3.What payment methods are accepted for SPC56EC64B3C9EEY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC56EC64B3C9EEY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC56EC64B3C9EEY?
SPC56EC64B3C9EEY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC56EC64B3C9EEY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC56EC64B3C9EEY?
For technical support, including SPC56EC64B3C9EEY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC56EC64B3C9EEY requirements.
6.How does Aetrix verify that SPC56EC64B3C9EEY is sourced from the original manufacturer or authorized distributors?
All SPC56EC64B3C9EEY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC56EC64B3C9EEY meets industry standards.
7.What is the process for return or replacement of SPC56EC64B3C9EEY?
All SPC56EC64B3C9EEY units undergo pre-shipment inspection (PSI). If there is an issue with SPC56EC64B3C9EEY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC56EC64B3C9EEY part is unused and in its original packaging.
Return procedure for SPC56EC64B3C9EEY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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