STMicroelectronics SPC56EC70L7C9E0X
- Part No.:
- SPC56EC70L7C9E0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
SPC56EC70L7C9E0X.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,405
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC56EC70L7C9E0X from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z4d core, operating up to 120 MHz (200 MIPs), with 3 MByte on-chip Flash (ECC), 256 KByte SRAM (ECC), and integrated FlexCAN, DSPI, LINFlex, Ethernet, and Cryptographic Services Engine (AES-128) - deployed in body control modules requiring ASIL-B compliance and real-time diagnostics.
For engineers reviewing the SPC56EC70L7C9E0X datasheet, SPC56EC70L7C9E0X pinout, SPC56EC70L7C9E0X application, or SPC56EC70L7C9E0X equivalent, key selection criteria include dual ADC support (10-/12-bit, up to 90 channels), safety features (SWT, MPU, Memory BIST), CAN Sampler in STANDBY mode, and Nexus 3+ debug interface on LBGA256 packages.
Technical Context
This MCU integrates dual Power Architecture® cores: a high-performance e200z4d (120 MHz) for main application tasks and an e200z0h (80 MHz) for safety-critical or background functions. It supports lockstep operation and hardware memory protection via a 16-entry MPU.
The device implements comprehensive automotive timing and communication infrastructure: 6 FlexCAN controllers (64 buffers each), Fast Ethernet Controller (MII interface), 8 DSPI channels, 10 LINFlex/UARTs, and dual ADC subsystems with synchronized PWM triggering - enabling precise closed-loop lighting and actuator control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z4d + e200z0h dual-core Power Architecture®, enabling functional safety partitioning and ASIL-B capable execution |
| Max Clock Frequency | 120 MHz (e200z4d), delivering 200 MIPs for real-time body electronics control loops |
| On-chip Flash | 3 MByte with ECC and user-selectable Memory BIST - supports secure OTA updates and robust code storage |
| SRAM | 256 KByte with ECC - ensures data integrity for critical runtime variables and stack operations |
| ADC System | Dual independent units: 10-bit ADC_0 (up to 62 ch.) and 12-bit ADC_1 (up to 62 ch.), extendable to 90 total channels with analog watchdog |
| Communication Peripherals | 6 FlexCAN (64 buffers each), 10 LINFlex/UART, 8 DSPI, I²C, FlexRay (dual-channel, 128 buffers), Fast Ethernet (MII) |
| Safety Features | Safety System Watchdog Timer (SWT), 16-entry MPU, Clock Monitoring Unit (CMU), secured boot via CSE |
Pinout & Package
LQFP176 package (24 × 24 × 1.4 mm), RoHS-compliant, ECOPACK® certified, rated for -40 °C to +125 °C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 3.3 V or 5 V supply for ADC, reference, and analog peripherals - requires dedicated filtering per datasheet layout guidelines |
| VSSA | Analog ground | Isolated analog return path to minimize noise coupling into precision ADC conversions |
| RTC_XTAL | 32 kHz crystal input | Connects to external 32.768 kHz crystal for RTC operation during ultra-low-power STANDBY mode |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential I/O | Direct connection to CAN transceiver; supports ISO 11898-2 compliant signaling at up to 1 Mbps |
| ETH_MII_RXD[3:0] | Ethernet MII receive data bus | 4-bit parallel input for 10/100 Mbps Ethernet frames - requires controlled impedance routing and length matching |
| ETH_MII_TXD[3:0] | Ethernet MII transmit data bus | 4-bit parallel output synchronized to TX_CLK; drives external PHY with setup/hold timing compliance per IEEE 802.3 |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated lighting diagnostics | Advanced shifted PWM generation + ADC conversion synchronized to PWM edges - enables real-time LED current monitoring without software overhead |
| Cryptographic Services Engine (CSE) | AES-128 encryption/decryption and CMAC authentication - secures firmware images and enables verified boot in production gateways |
| CAN Sampler in STANDBY | Hardware stores incoming CAN IDs and data during ultra-low-power STANDBY - allows wake-up on specific message content without CPU intervention |
| Nexus 3+ debug interface | Available on LBGA256 variant only - provides real-time trace, instruction-level debugging, and safety-critical runtime analysis per ASAM MCD-2 MC standard |
| Memory Protection Unit (MPU) | 16-entry configurable MPU enforces privilege levels and memory access permissions - essential for ISO 26262 ASIL-B software partitioning |
Applications
| Body Control Module (BCM) | Roof Module / Sunroof Controller |
|---|---|
Use Scenario: Centralized management of door locks, window lifts, interior lighting, and mirror controls in modern vehicles. IC Role / Device Role / Timing Role: Primary application controller executing real-time state machines, PWM-driven lighting dimming, and CAN message routing between domains. Use Value: Dual ADCs enable simultaneous battery voltage monitoring and motor current sensing; FlexCAN redundancy ensures fail-operational communication under fault conditions. |
Use Scenario: Precision control of sunroof glass position, anti-pinch detection, and ambient light-responsive shading. IC Role / Device Role / Timing Role: Safety-aware motion controller using synchronized ADC sampling and PWM generation to detect obstruction forces within 5 ms response window. Use Value: Hardware-accelerated PWM shift and ADC sync eliminate CPU polling latency; STANDBY CAN Sampler maintains network presence while consuming <10 µA. |
| Smart Lighting ECU | Gateway Node (Body Domain) |
Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, thermal derating, and diagnostic reporting. IC Role / Device Role / Timing Role: Real-time lighting manager coordinating multiple LED strings, temperature sensors, and LIN-connected actuators. Use Value: Dedicated lighting features (shifted PWM, ADC-PWM sync) reduce firmware complexity by 40% vs. generic MCUs; CSE enables secure firmware updates over CAN. |
Use Scenario: Aggregation and translation of signals between CAN, LIN, and Ethernet networks in zonal architectures. IC Role / Device Role / Timing Role: High-throughput gateway processor handling concurrent FlexCAN, LINFlex, and Fast Ethernet traffic with deterministic latency. Use Value: 6 FlexCAN interfaces + Fast Ethernet allow seamless bridging between legacy body networks and next-gen vehicle Ethernet backbones (e.g., AUTOSAR SOME/IP). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC56EC74L7C9E0X | Same LQFP176 package, but with 3 MByte Flash + 64 KByte Data Flash (vs. 64 KByte only in SPC56EC70L7); identical core/peripheral set | Preferred for designs requiring larger non-volatile parameter storage (e.g., calibration tables, OTA update staging area) | Select when extended Data Flash endurance (>100k cycles) and capacity are required for field-updatable configuration data |
| SPC564B70L7C9E0X | Same footprint and pinout, but uses e200z4 core only (no e200z0h companion core); 2 MByte Flash, no CSE or FlexRay | Suitable for cost-sensitive body nodes where ASIL-B partitioning and cryptographic services are not mandated | Choose for non-safety-critical applications needing reduced BOM cost and simpler software certification scope |
Compared with SPC56EC70L7C9E0X, the SPC56EC74L7 offers expanded Data Flash for robust OTA staging, while the SPC564B70L7 reduces safety and security features to lower cost - making the EC70 the optimal balance of ASIL-B readiness, cryptographic capability, and peripheral richness for mid-tier body ECUs.
Availability
SPC56EC70L7C9E0X is available at Aetrix Electronics and suitable for automotive body control modules, smart lighting systems, and zonal gateway nodes requiring stable component supply across extended vehicle lifecycles.
Supply support for SPC56EC70L7C9E0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power technologies with broad IP portfolio and AEC-Q100 qualified manufacturing.
The SPC56ECxx family targets ASIL-B compliant automotive body electronics, emphasizing functional safety, real-time performance, and integration of CAN, LIN, Ethernet, and lighting-specific peripherals in a single die.
FAQ
What is the maximum junction temperature rating for SPC56EC70L7C9E0X?
The device is qualified for operation up to 150 °C junction temperature, with guaranteed functionality across -40 °C to +125 °C ambient per AEC-Q100 Grade 1 requirements. Thermal derating curves and PCB copper pour recommendations are provided in Section 3.5 of the datasheet (DocID17478 Rev 9).
Does SPC56EC70L7C9E0X support JTAG boundary scan?
Yes - it implements IEEE 1149.1-compliant JTAG boundary scan with TDI, TDO, TMS, TCK, and TRST pins. Full scan chain description, timing (Table 52), and test access port behavior are documented in Section 3.19.4 of the datasheet.
Can the internal 16 MHz RC oscillator be used as the main system clock source?
Yes - the fast internal RC oscillator (FIRC) is factory-trimmed to ±1% accuracy and can serve as the primary clock source. It supports automatic fallback to external crystal if FIRC drift exceeds threshold, managed by the Clock Monitoring Unit (CMU) per Section 3.15.
Is the Fast Ethernet Controller compatible with IEEE 802.3u (100BASE-TX)?
Yes - the MII interface supports full-duplex 10/100 Mbps operation with precise timing alignment (RX/TX setup/hold per Tables 45–48). External PHY selection (e.g., LAN8720A) and PCB layout adherence to IEEE 802.3u signal integrity rules are required for conformance.
SPC56EC70L7C9E0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 176-LQFP
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h, e200z4d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 80MHz/120MHz
- Connectivity:
- CANbus, Ethernet, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 147
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 27x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC56EC70L7C9E0X FAQ
1.How can I place an order for SPC56EC70L7C9E0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC56EC70L7C9E0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC56EC70L7C9E0X reliable?
The price and inventory of SPC56EC70L7C9E0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC56EC70L7C9E0X is usually 5 days.
3.What payment methods are accepted for SPC56EC70L7C9E0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC56EC70L7C9E0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC56EC70L7C9E0X?
SPC56EC70L7C9E0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC56EC70L7C9E0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC56EC70L7C9E0X?
For technical support, including SPC56EC70L7C9E0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC56EC70L7C9E0X requirements.
6.How does Aetrix verify that SPC56EC70L7C9E0X is sourced from the original manufacturer or authorized distributors?
All SPC56EC70L7C9E0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC56EC70L7C9E0X meets industry standards.
7.What is the process for return or replacement of SPC56EC70L7C9E0X?
All SPC56EC70L7C9E0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC56EC70L7C9E0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC56EC70L7C9E0X part is unused and in its original packaging.
Return procedure for SPC56EC70L7C9E0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC56EC70L7C9E0X Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

