STMicroelectronics SPC56EL60L5BBFQY
- Part No.:
- SPC56EL60L5BBFQY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC56EL60L5BBFQY.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,692
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC56EL60L5BBFQY from STMicroelectronics is a 32-bit Power Architecture® automotive MCU featuring dual e200z4d cores, 1 MB Flash with ECC, 128 KB SRAM with ECC, and SIL3/ASILD-certified safety architecture for chassis and safety-critical systems. It integrates FlexCAN 2.0B, FlexRay v2.1 (10 Mbit/s), LINFlexD, DSPI, dual 12-bit ADCs, and Nexus Class 3+ debug interface.
For engineers reviewing the SPC56EL60L5BBFQY datasheet, SPC56EL60L5BBFQY pinout, SPC56EL60L5BBFQY application, or SPC56EL60L5BBFQY equivalent, key selection criteria include LockStep vs. Decoupled Parallel core mode, FCCU/RCCU fault handling, RWW EEPROM emulation capability, and junction temperature rating up to 150 °C in LFBGA257 package.
Technical Context
The device implements a dual-core e200z4d CPU with Variable Length Encoding (VLE), dual-issue five-stage pipeline, and integrated Signal Processing Engine (SPE). Core frequency reaches 120 MHz, supported by 4 KB instruction cache with error detection code and Memory Management Unit (MMU).
Safety is enforced via Sphere of Replication (SoR) covering CPU, eDMA, and crossbar switch; Fault Collection and Control Unit (FCCU); Redundancy Control and Checker Unit (RCCU); and hardware-triggered MBIST/LBIST at boot. Clock monitoring (CMU), power management (PMU), and 16-region MPU further enforce functional safety compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z4d dual core, Power Architecture®, VLE support, 120 MHz max frequency |
| Memory | 1 MB Flash with ECC + RWW EEPROM emulation; 128 KB SRAM with ECC |
| Safety Certification | SIL3/ASILD compliant with LockStep mode, FCCU, RCCU, and boot-time MBIST/LBIST |
| ADC | Dual 12-bit ADCs, 16 input channels, cross-triggering with eTimer/FlexPWM |
| Communication | 2× FlexCAN 2.0B (32 msg objects), 2× FlexRay v2.1 (2 ch, 64 buffers, 10 Mbit/s), 2× LINFlexD, 3× DSPI |
| Timers & PWM | Three 6-channel eTimer units; two FlexPWM modules (4×16-bit channels each) |
| Package | LFBGA257 (14 × 14 mm), rated for −40 °C to +150 °C junction temperature |
Pinout & Package
LFBGA257 (14 × 14 mm, 0.8 mm pitch) with 257 I/O terminals. Pin functions include dedicated supply (VDD, VSS), system (RESET, CLK, NMI), safety (FCCU_ERR, RCCU_OUT), communication (CAN_H/L, FRAY_TX/RX), analog (ADC_IN0–15), and configurable GPIOs supporting multiple peripheral muxing options.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply rails | Separate analog/digital domains; require decoupling per Table 11 (100 nF + 10 µF) |
| RESET | Asynchronous reset input | Active-low, supports destructive/functional reset sequences with BIST enable/disable control |
| FCCU_ERR | Fault reporting output | Open-drain signal indicating detected SoR mismatch or internal fault condition |
| RCCU_OUT | Redundancy checker output | Drives FCCU with comparison result from replicated SoR outputs |
| CAN0_TX / CAN0_RX | FlexCAN differential interface | Compliant with ISO 11898-2; supports 1 Mbit/s data rate and 32 message object filtering |
| FRAY_CH0_TX / FRAY_CH0_RX | FlexRay channel 0 transceiver | Supports static/dynamic segment configuration, 10 Mbit/s symbol rate, 64-message buffer RAM |
Key Features
| Feature | Design Value |
|---|---|
| LockStep Safety Mode | Hardware-enforced dual-core synchronization with real-time output comparison and fault escalation via FCCU |
| RWW EEPROM Emulation | Enables background flash writes during code execution-critical for runtime parameter storage in safety systems |
| Nexus Class 3+ Debug | Full real-time trace, non-intrusive debugging, and secure access control for ASIL-D development workflows |
| Replicated Junction Sensor | Dual on-die temperature sensors with independent readout paths-required for thermal fault detection in SIL3 systems |
| CTU Synchronization | Programmable cross-triggering unit aligns ADC sampling precisely with eTimer capture or FlexPWM edge events |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire (BBW) |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase control under dynamic load and fault conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D motor control algorithms with LockStep core validation and FlexRay-based actuator coordination. Use Value: Dual-core redundancy ensures fail-operational behavior during single-point faults; 120 MHz core speed enables sub-100 µs control loop closure. | Use Scenario: Distributed brake pressure modulation across four wheels using redundant sensor fusion and fail-safe valve actuation. IC Role / Device Role / Timing Role: Central chassis domain controller managing FlexCAN/FlexRay gateway, ADC-based pedal travel sensing, and eTimer-driven PWM valve drivers. Use Value: Integrated FCCU and RCCU provide deterministic fault response within <50 µs; 150 °C junction rating supports under-hood placement. |
| Airbag Control Unit (ACU) | Advanced Driver Assistance Systems (ADAS) Domain Controller |
Use Scenario: Multi-sensor crash event detection, pyro fuse triggering, and occupant classification using analog front-end inputs. IC Role / Device Role / Timing Role: Safety-critical decision engine performing SIL3-compliant sensor diagnostics, algorithmic crash discrimination, and NMI-triggered deployment sequencing. Use Value: Boot-time MBIST/LBIST validates memory and logic before deployment; replicated ADCs enable cross-checked sensor acquisition. | Use Scenario: Sensor fusion hub aggregating radar, camera, and ultrasonic inputs for path planning and emergency intervention. IC Role / Device Role / Timing Role: High-integrity compute node running ASIL-B software on Decoupled Parallel cores while monitoring safety-critical subsystems via LockStep monitor core. Use Value: SPE acceleration offloads FFT and filtering tasks; dual 12-bit ADCs with CTU support synchronized multi-sensor sampling at 1 MSPS aggregate rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC56EL70L7BAAQY | Higher Flash (2 MB), higher SRAM (256 KB), same e200z4d dual core and safety architecture | Better suited for complex ADAS middleware stacks requiring larger code/data footprint | Select when >1 MB Flash or >128 KB SRAM is required without changing safety architecture or pin compatibility |
| TC297TP128F200NAC | TriCore™ architecture, 200 MHz, 4 MB Flash, AURIX™ safety concept (HSM + CCU), different toolchain and peripheral set | Targets higher ASIL-D decomposition requirements with hardware security module (HSM) and separate safety island | Choose for new designs needing HSM-based secure boot or where TriCore ecosystem alignment outweighs Power Architecture continuity |
Compared with SPC56EL70L7BAAQY, this part offers lower memory density but identical safety mechanisms and pinout in LFBGA257; versus TC297TP128F200NAC, it provides Power Architecture toolchain continuity and simpler integration for legacy chassis platforms, though without HSM or TriCore-specific safety partitioning.
Availability
SPC56EL60L5BBFQY is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, airbag control, and ADAS domain controller applications requiring stable component supply and long-term automotive lifecycle support.
Supply support for SPC56EL60L5BBFQY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power solutions with broad IP portfolio and AEC-Q100 qualified manufacturing.
This device belongs to the SPC56ELx automotive MCU family, designed specifically for SIL3/ASILD chassis control applications demanding high computational integrity, functional safety certification, and robust real-time I/O for vehicle dynamics systems.
FAQ
What is the maximum ambient operating temperature for SPC56EL60L5BBFQY?
The device is rated for ambient operation from −40 °C to +125 °C, with a maximum junction temperature of +150 °C. Thermal design must ensure junction temperature remains within limit under worst-case power dissipation, verified using θJA = 22.5 °C/W (LFBGA257, 4-layer board) per Table 14.
Does SPC56EL60L5BBFQY support over-the-air (OTA) firmware updates?
Yes-it supports RWW (Read-While-Write) flash operation enabling background firmware updates without halting application execution. The platform flash controller allows sector-level erase/write while executing from other sectors, essential for ASIL-D-compliant OTA architectures.
How is FlexRay clocking implemented on this MCU?
The FlexRay module uses a dedicated FMPLL output configured to generate the precise 20 MHz reference clock required by FlexRay v2.1 PHY. Clock routing is hardened within the SoR, and CMU monitors FlexRay clock stability with programmable fault thresholds and NMI escalation.
Can the e200z4d cores operate independently outside LockStep mode?
Yes-Decoupled Parallel mode allows both cores to execute distinct threads with shared memory access, coordinated via the crossbar switch and eDMA. This mode is used for high-performance non-safety tasks (e.g., sensor preprocessing), while LockStep remains reserved for ASIL-D critical functions.
SPC56EL60L5BBFQY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 144-LQFP
- Series:
- SPC56xL
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4d
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 96
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.63V
- Data Converters:
- A/D 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC56EL60L5BBFQY FAQ
1.How can I place an order for SPC56EL60L5BBFQY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC56EL60L5BBFQY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC56EL60L5BBFQY reliable?
The price and inventory of SPC56EL60L5BBFQY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC56EL60L5BBFQY is usually 5 days.
3.What payment methods are accepted for SPC56EL60L5BBFQY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC56EL60L5BBFQY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC56EL60L5BBFQY?
SPC56EL60L5BBFQY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC56EL60L5BBFQY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC56EL60L5BBFQY?
For technical support, including SPC56EL60L5BBFQY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC56EL60L5BBFQY requirements.
6.How does Aetrix verify that SPC56EL60L5BBFQY is sourced from the original manufacturer or authorized distributors?
All SPC56EL60L5BBFQY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC56EL60L5BBFQY meets industry standards.
7.What is the process for return or replacement of SPC56EL60L5BBFQY?
All SPC56EL60L5BBFQY units undergo pre-shipment inspection (PSI). If there is an issue with SPC56EL60L5BBFQY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC56EL60L5BBFQY part is unused and in its original packaging.
Return procedure for SPC56EL60L5BBFQY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC56EL60L5BBFQY Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

