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STMicroelectronics SPC56EL60L5CBFSY

Part No.:
SPC56EL60L5CBFSY
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixSPC56EL60L5CBFSY.pdf
Description:
IC MCU 32BIT 1MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,388

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Product details

Overview

SPC56EL60L5CBFSY from STMicroelectronics is a 32-bit Power Architecture® automotive MCU with dual e200z4d cores, 1 MHz flash memory (ECC), 128 KB SRAM (ECC), and SIL3/ASILD safety certification for chassis and safety-critical systems. It integrates FlexRay (10 Mbit/s), dual FlexCAN 2.0B, LINFlexD, DSPI, eTimer, FlexPWM, dual 12-bit ADCs with CTU synchronization, and Nexus Class 3+ debug interface.

For engineers reviewing the SPC56EL60L5CBFSY datasheet, SPC56EL60L5CBFSY pinout, SPC56EL60L5CBFSY application, or SPC56EL60L5CBFSY equivalent, key selection criteria include LockStep vs. Decoupled Parallel core operation, FCCU/RCCU fault handling architecture, RWW EEPROM emulation capability, and LFBGA257 package thermal performance at 150 °C junction temperature.

Technical Context

The device implements a dual-core e200z4d CPU with Variable Length Encoding (VLE), dual-issue five-stage pipeline, and Memory Management Unit (MMU), operating up to 120 MHz. Core redundancy is enforced via Sphere of Replication (SoR) covering CPU, eDMA, and crossbar switch, with hardware-triggered MBIST/LBIST and software-triggered ADC/flash BIST.

Safety integrity is achieved through replicated interrupt controllers, eDMA channels, and clock monitoring units (CMU), coupled with Fault Collection and Control Unit (FCCU) and Redundancy Control and Checker Unit (RCCU). The on-chip sine wave generator (SWG) provides analog output with integrated low-pass filtering, and programmable cross-triggering unit (CTU) synchronizes ADC sampling with PWM and timer events.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecturee200z4d dual core, Power Architecture®, VLE support, 120 MHz max frequency
Memory1 MB flash with ECC and RWW EEPROM emulation; 128 KB SRAM with ECC
Safety CertificationISO 26262 ASIL D (SIL3) compliant with LockStep mode, FCCU, RCCU, and SoR
ADCDual 12-bit converters, 16 input channels, CTU-enabled synchronized sampling
Communication2× FlexCAN 2.0B (32 msg objects), 2× LINFlexD, 3× DSPI, 2× FlexRay v2.1 (10 Mbit/s)
Timers & PWMThree 6-channel eTimer units; two FlexPWM modules (4×16-bit channels each)
Operating Range−40 °C to 125 °C ambient; −40 °C to 150 °C junction; single 3.0–3.6 V supply

Pinout & Package

LFBGA257 package (14 mm × 14 mm, 0.8 mm pitch), thermally enhanced for automotive under-hood deployment with 257 I/O terminals.

Pin/TerminalCircuit RoleDesign Meaning
VDDA, VDDIO, VDDAnalog/digital power supplySeparate 3.3 V domains enable noise isolation for ADC and digital logic
RESET_BActive-low reset inputAsynchronous, glitch-filtered reset with configurable external watchdog window
CLKIN, EXTAL, XTALExternal clock inputsSupports crystal (4–40 MHz) or external clock source for FMPLL reference
NEXUS_TDI, TDO, TCK, TMSNexus Class 3+ debug interfaceReal-time trace, non-intrusive debugging, and safety-critical runtime monitoring
FLEXRAY_CH0_TX/RX, CH1_TX/RXFlexRay physical layer I/ODifferential signaling per channel; supports 10 Mbit/s data rate with built-in protocol engine
CAN0_TX/RX, CAN1_TX/RXFlexCAN transceiver interfacesCompliant with ISO 11898-1; supports bus-off recovery and message object prioritization

Key Features

FeatureDesign Value
LockStep + Decoupled Parallel modesRuntime-selectable: LockStep for ASIL D fault detection; Decoupled for high-performance dual-core execution
On-chip SWG with LPFGenerates precise sine waves without external components; used for sensor excitation or diagnostics
Replicated junction temperature sensorTwo independent sensors enable cross-checking for thermal safety monitoring in real time
Boot-time MBIST/LBISTHardware-triggered self-test of flash and logic before application code execution; meets ASIL D startup requirements
16-region MPUEnforces memory access permissions per software task, preventing unintended code/data corruption

Applications

Electric Power Steering (EPS)Brake-by-Wire Control Unit

Use Scenario: Real-time torque assist calculation and motor phase control under dynamic load and temperature variation.

IC Role / Device Role / Timing Role: Primary safety controller executing ASIL D algorithms with LockStep core validation and FlexRay/CAN communication to steering column and vehicle network.

Use Value: Dual-core redundancy ensures fail-operational behavior during transient faults; RWW flash enables seamless firmware updates without interrupting EPS actuation.

Use Scenario: Coordinating hydraulic pressure modulation across four wheel brakes using distributed sensor feedback and vehicle dynamics models.

IC Role / Device Role / Timing Role: Central chassis domain controller managing FlexRay backbone communication, dual ADC sampling of pressure/position sensors, and PWM-driven solenoid drivers.

Use Value: CTU-synchronized ADC sampling eliminates timing skew between brake pressure and wheel speed measurements; FCCU reports fault vectors to central gateway within <100 µs.

Advanced Driver Assistance Systems (ADAS) Domain ControllerAutomotive Gateway Module

Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for fusion processing and decision-making in Level 2+ ADAS functions.

IC Role / Device Role / Timing Role: High-integrity compute node running safety-managed middleware, interfacing via FlexCAN/FlexRay to sensors and actuators, with Nexus trace for functional safety validation.

Use Value: SPE acceleration improves signal processing throughput; 128 KB ECC SRAM guarantees data integrity during multi-threaded sensor fusion tasks.

Use Scenario: Translating messages between CAN FD, LIN, and Ethernet domains while enforcing firewall rules and diagnostic routing.

IC Role / Device Role / Timing Role: Protocol translation hub with dual FlexCAN, LINFlexD, and DSPI peripherals; uses eTimer for precise inter-frame spacing and SWG for LIN baud rate calibration.

Use Value: On-chip SWG replaces external oscillator for LIN timing accuracy; RWW flash allows secure OTA bootloader updates without compromising gateway uptime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC56EL60L5CBKAYLQFP144 package (20×20 mm); lower thermal dissipation capability; no exposed thermal padBetter suited for less thermally constrained ECU designs where board space permits larger footprintSelect when mechanical layout favors QFP over BGA and junction temperature remains ≤135 °C
SPC564L60L5CBFSYSame die, identical core/peripheral set, but qualified to AEC-Q100 Grade 1 (−40 °C to 125 °C ambient)Targeted at non-safety-critical body electronics where ASIL D is not requiredChoose for cost-sensitive applications needing same functionality without full SIL3/ASILD certification overhead

Compared with SPC56EL60L5CBFSY, the LQFP144 variant trades thermal robustness for assembly simplicity, while the SPC564L60L5CBFSY removes safety mechanisms and ambient temperature margin-neither is drop-in compatible for ASIL D chassis applications requiring 150 °C junction operation and LockStep validation.

Availability

SPC56EL60L5CBFSY is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, ADAS domain control, and automotive gateway modules requiring stable component supply across extended automotive lifecycles.

Supply support for SPC56EL60L5CBFSY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power solutions with broad IP portfolio and AEC-Q100-qualified manufacturing.

The SPC56ELx series targets ASIL D-certified chassis and safety applications, delivering deterministic dual-core execution, hardware safety monitors, and automotive-grade peripheral integration for next-generation vehicle control systems.

FAQ

What is the maximum junction temperature rating for SPC56EL60L5CBFSY?

The device is rated for −40 °C to +150 °C junction temperature, validated per AEC-Q100 Grade 0 and required for under-hood chassis applications. This rating is enabled by the LFBGA257 package's thermal pad and internal thermal sensor redundancy, and must be maintained using board-level copper pour and airflow per ST's AN4485 thermal design guidelines.

Does SPC56EL60L5CBFSY support boot-time flash programming via CAN or LIN?

Yes-it includes an on-chip CAN/UART bootstrap loader compliant with SAE J2411 and ISO 14229-1, enabling field firmware updates without external debug hardware. The bootloader resides in protected ROM, validates image CRC before execution, and supports segmented programming with rollback protection for ASIL D compliance.

How does the Cross Triggering Unit (CTU) improve ADC timing accuracy?

The CTU synchronizes ADC start-of-conversion triggers with eTimer compare events or FlexPWM edge signals, eliminating software-induced jitter. This achieves sub-microsecond deterministic sampling alignment-critical for motor current sensing in EPS or brake pressure acquisition where phase coherence directly impacts control loop stability.

Can the e200z4d cores operate independently outside LockStep mode?

Yes-in Decoupled Parallel mode, both cores execute distinct instruction streams with shared memory access via the crossbar switch, enabling true parallelism for non-safety partitions (e.g., diagnostics, communication stacks). Core isolation is enforced by the 16-region MPU, and inter-core messaging uses mailbox registers with hardware semaphore support.

SPC56EL60L5CBFSY Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
144-LQFP
Series:
SPC56xL
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4d
Core Size:
32-Bit Dual-Core
Speed:
120MHz
Connectivity:
CANbus, LINbus, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
96
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.63V
Data Converters:
A/D 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

SPC56EL60L5CBFSY FAQ

1.How can I place an order for SPC56EL60L5CBFSY through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC56EL60L5CBFSY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC56EL60L5CBFSY reliable?

The price and inventory of SPC56EL60L5CBFSY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC56EL60L5CBFSY is usually 5 days.

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SPC56EL60L5CBFSY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC56EL60L5CBFSY?

For technical support, including SPC56EL60L5CBFSY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC56EL60L5CBFSY requirements.

6.How does Aetrix verify that SPC56EL60L5CBFSY is sourced from the original manufacturer or authorized distributors?

All SPC56EL60L5CBFSY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC56EL60L5CBFSY meets industry standards.

7.What is the process for return or replacement of SPC56EL60L5CBFSY?

All SPC56EL60L5CBFSY units undergo pre-shipment inspection (PSI). If there is an issue with SPC56EL60L5CBFSY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC56EL60L5CBFSY part is unused and in its original packaging.

Return procedure for SPC56EL60L5CBFSY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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