STMicroelectronics SPC570S50E1CEFAY
- Part No.:
- SPC570S50E1CEFAY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-TQFP Exposed Pad
- Datasheet:
-
SPC570S50E1CEFAY.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64ETQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,173
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC570S50E1CEFAY from STMicroelectronics is a 32-bit Power Architecture® automotive microcontroller with dual e200z0h lockstep CPU cores operating at up to 80 MHz, 512 KB on-chip flash memory, 48 KB SRAM, and ASIL-D safety certification per ISO 26262 for chassis and safety-critical vehicle control systems.
For engineers reviewing the SPC570S50E1CEFAY datasheet, SPC570S50E1CEFAY pinout, SPC570S50E1CEFAY application, or SPC570S50E1CEFAY equivalent, key selection criteria include dual-core lockstep execution, integrated FlexCAN v2.0 interfaces (2×), DSPI (3×), LINFlexD (2×), 12-bit SAR ADC with supervisor capability, and eTQFP64 package compatibility with automotive-grade thermal range (−40 °C to 150 °C).
Technical Context
The device implements a delayed lockstep safety architecture across CPU, INTC, and eDMA subsystems, with ECC protection for flash and SRAM, End-to-End EDC for data paths, and dedicated fault collection via FCCU and MEMU. Boot-time MBIST/LBIST validates latent logic and memory faults.
Its dual PLL architecture separates stable peripheral clock domains from FM-modulated computational shell domains; the Nexus Class 3 debug interface supports instruction/data trace on core and eDMA masters, with 4-pin MDO trace port.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z0h dual-core lockstep (VLE-enabled Power Architecture) |
| Max Core Frequency | 80 MHz - enables real-time deterministic execution for ASIL-D control loops |
| Flash Memory | 512 KB code + 32 KB data flash - supports EEPROM emulation and read-while-write operation |
| SRAM | 48 KB general-purpose SRAM - sufficient for AUTOSAR OS stacks and safety-critical task buffers |
| ADC Resolution & Speed | 12-bit SAR with 1.5 µs conversion time at 12 MHz - meets fast-sampling requirements for motor current sensing |
| Safety Certification | AEC-Q100 Grade 1, ISO 26262 ASIL-D compliant - validated for steering, braking, and airbag control systems |
| Operating Temperature | −40 °C to 150 °C junction - qualified for under-hood automotive environments without derating |
| Communication Interfaces | 2× FlexCAN v2.0 (32 MBs each), 3× DSPI, 2× LINFlexD - supports multi-bus vehicle network redundancy |
Pinout & Package
eTQFP64 package (10 × 10 × 1.0 mm, lead-free, RoHS-compliant) with exposed thermal pad; designed for high-reliability automotive PCB assembly and thermal management in constrained chassis modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Isolated analog domain powering ADC and temperature sensor; requires separate filtering from digital rails |
| VRH / VRL | ADC reference voltage inputs | Enable precise 12-bit conversion by defining full-scale range; support external or internal reference selection |
| CAN_H / CAN_L | FlexCAN differential bus terminals | Direct connection to ISO 11898-2 physical layer; integrated termination and slew-rate control for EMC robustness |
| ETM_D0–D3 | Nexus trace data outputs | 4-bit parallel trace stream for real-time instruction and data flow visibility during ASIL-D validation |
| RESET_B | Active-low reset input | Asynchronous, noise-filtered reset assertion; compatible with automotive watchdog ICs and power sequencers |
| CLKIN / XOSC | External crystal oscillator input | Supports 4–20 MHz crystals; enables high-accuracy clock source for safety-critical timing functions |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z0h lockstep core | Hardware-enforced functional equivalence with delayed comparison - detects transient and permanent core faults per ASIL-D requirements |
| Boot Assist Flash (BAF) | 8 KB dedicated flash for secure factory programming via UART/CAN serial bootload - eliminates need for JTAG during production |
| Programmable Cross Triggering Unit (CTU) | Hardware-synchronized event chaining between ADC, eTimer, and DSPI - enables jitter-free sensor sampling and actuator timing |
| 8-region SMPU with PID support | Enforces memory access isolation between AUTOSAR OS tasks and safety monitors - prevents unauthorized code/data corruption |
| Fault Collection and Control Unit (FCCU) | Centralized aggregation of error notifications from MEMU, PLL monitors, and BIST results - triggers configurable fail-safe responses |
| Enhanced SW Watchdog | Independent clock domain with windowed timeout and early-warning interrupt - supports safe state transition before hard reset |
Applications
| Electric Power Steering (EPS) | Electronic Brake Control Module (EBCM) |
|---|---|
|
Use Scenario: Real-time torque assist calculation and motor phase current regulation in column-assist EPS systems. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-managed motor control algorithms with lockstep core verification. Use Value: 80 MHz deterministic execution and 1.5 µs ADC sampling enable <100 µs current loop closure - critical for road feel fidelity and fault response latency. |
Use Scenario: Pressure modulation and wheel speed-based ABS/EBD control in hydraulic brake actuators. IC Role / Device Role / Timing Role: Safety-certified host processor managing dual CAN networks, solenoid drivers, and redundant pressure sensors. Use Value: Dual FlexCAN interfaces with 32 message buffers each ensure concurrent communication with master ECU and wheel-speed sensors without packet loss. |
| Advanced Airbag Control Unit (ACU) | Occupant Detection System (ODS) |
|
Use Scenario: Multi-stage pyrotechnic deployment decision based on crash severity, seat position, and occupant classification. IC Role / Device Role / Timing Role: ASIL-D decision engine performing sensor fusion (accelerometers, pressure mats) and deterministic deployment timing. Use Value: 48 KB SRAM hosts multiple calibrated crash models and real-time FFT analysis buffers - enabling sub-5 ms impact classification. |
Use Scenario: Capacitive seat occupancy detection and weight estimation for front passenger airbag suppression logic. IC Role / Device Role / Timing Role: Dedicated SAR ADC supervisor channel with CTU-triggered sampling synchronizes with seat cushion excitation signals. Use Value: Integrated supervisor ADC and programmable CTU eliminate external signal conditioning - reducing BOM count and improving EMI immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive ASIL-D microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | ARM Cortex-M7 dual-core lockstep, 2 MB flash, 512 KB SRAM, no VLE support | Targets next-gen zonal E/E architectures with Ethernet AVB; lacks native LINFlexD and legacy CAN FD backward compatibility | Preferred for new designs requiring AUTOSAR Adaptive and OTA update infrastructure |
| Renesas RH850/P1M | 32-bit RXv3 core, 1.5 MB flash, 256 KB SRAM, single-core with hardware safety checker | Optimized for high-voltage battery management and inverter control; limited DSPI channels and no integrated BAF | Selected when high-resolution PWM and analog front-end integration outweigh lockstep core benefits |
Compared with SPC570S50E1CEFAY, the S32K344 offers greater memory headroom and Ethernet readiness but requires toolchain migration from Power Architecture; the RH850/P1M delivers higher analog integration but lacks dual-core lockstep assurance for highest-tier ASIL-D decomposition.
Availability
SPC570S50E1CEFAY is available at Aetrix Electronics and suitable for electric power steering, brake control modules, airbag control units, and occupant detection systems requiring stable component supply across automotive production lifecycles.
Supply support for SPC570S50E1CEFAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management solutions with over 40 years of automotive qualification expertise.
The SPC570Sx series belongs to ST's automotive microcontroller product line, engineered specifically for ASIL-D chassis and safety applications including steering, braking, and restraint systems - emphasizing functional safety, thermal resilience, and legacy protocol support.
FAQ
What is the maximum junction temperature rating for SPC570S50E1CEFAY?
The device is rated for −40 °C to 150 °C junction temperature under continuous operation, with an optional 165 °C grade available per Technical Note TN1262. Thermal derating is not required within this range when used with recommended PCB copper area and airflow per datasheet Section 4.7.
Does SPC570S50E1CEFAY support AUTOSAR-compliant software stacks?
Yes - ST provides certified AUTOSAR 4.x Basic Software (BSW) modules including MCAL drivers for FlexCAN, DSPI, ADC, and eTimer, along with configuration tools compliant with AUTOSAR Release 4.3 and later. The dual-core lockstep architecture satisfies ASIL-D partitioning requirements.
How is safety-critical memory protected on this MCU?
Flash and SRAM employ ECC (single-bit correction, double-bit detection); data paths use End-to-End EDC with CRC; MEMU monitors and reports memory errors; boot-time MBIST/LBIST validates RAM and logic integrity. All mechanisms are independently monitored by FCCU.
Can SPC570S50E1CEFAY be programmed in-system without JTAG?
Yes - the integrated Boot Assist Flash (BAF) enables UART or CAN-based serial bootloading using ST's standardized protocol. This allows field firmware updates and factory programming without physical debugger access, supporting secure production line flashing.
SPC570S50E1CEFAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-TQFP Exposed Pad
- Series:
- SPC57 S
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 48K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC570S50E1CEFAY FAQ
1.How can I place an order for SPC570S50E1CEFAY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC570S50E1CEFAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC570S50E1CEFAY reliable?
The price and inventory of SPC570S50E1CEFAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC570S50E1CEFAY is usually 5 days.
3.What payment methods are accepted for SPC570S50E1CEFAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC570S50E1CEFAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC570S50E1CEFAY?
SPC570S50E1CEFAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC570S50E1CEFAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC570S50E1CEFAY?
For technical support, including SPC570S50E1CEFAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC570S50E1CEFAY requirements.
6.How does Aetrix verify that SPC570S50E1CEFAY is sourced from the original manufacturer or authorized distributors?
All SPC570S50E1CEFAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC570S50E1CEFAY meets industry standards.
7.What is the process for return or replacement of SPC570S50E1CEFAY?
All SPC570S50E1CEFAY units undergo pre-shipment inspection (PSI). If there is an issue with SPC570S50E1CEFAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC570S50E1CEFAY part is unused and in its original packaging.
Return procedure for SPC570S50E1CEFAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC570S50E1CEFAY Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

