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STMicroelectronics SPC570S50E3CEFAR

Part No.:
SPC570S50E3CEFAR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-TQFP Exposed Pad
Datasheet:
AetrixSPC570S50E3CEFAR.pdf
Description:
IC MCU 32BIT 512KB FLSH 100ETQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,222

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Product details

Overview

SPC570S50E3CEFAR from STMicroelectronics is a 32-bit Power Architecture® automotive microcontroller with dual e200z0h lockstep CPU cores operating at up to 80 MHz, 512 KB on-chip flash memory, 48 KB SRAM, and ASIL-D safety certification per ISO 26262. It integrates dual FlexCAN interfaces (32 message buffers each), 3 DSPI modules, 2 LINFlexD units, and two 12-bit SAR ADCs with 1.5 µs conversion time - deployed in chassis control units for real-time brake-by-wire actuation.

For engineers reviewing the SPC570S50E3CEFAR datasheet, SPC570S50E3CEFAR pinout, SPC570S50E3CEFAR application, or SPC570S50E3CEFAR equivalent, key selection criteria include ASIL-D fault coverage metrics, lockstep eDMA channel pairing, EEPROM-emulation-capable flash partitioning, and Nexus Class 3 debug trace support for AUTOSAR-compliant safety software validation.

Technical Context

The device implements a delayed lockstep safety architecture: primary and checker e200z0h cores execute identical instructions with intentional timing skew to detect transient faults; Flash and SRAM employ ECC protection, while data paths use End-to-End EDC (E2E EDC) for integrity checking across bus masters and peripherals. The Fault Collection and Control Unit (FCCU) aggregates failure notifications from MEMU, STCU2, and peripheral supervisors.

Dual PLLs provide independent clock domains: one stable domain for peripherals (LIN, DSPI, GPIO), another FM-modulated domain for computational shell execution; the Crossbar Switch enables concurrent access to memory and peripherals by multiple bus masters with end-to-end ECC enforcement on all transactions.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture e200z0h dual-core lockstep (VLE-enabled Power Architecture)
Max Core Frequency 80 MHz - enables deterministic real-time response for ASIL-D chassis control loops
Flash Memory 512 KB code + 32 KB data flash - supports read-while-write and EEPROM emulation via multi-block partitioning
SRAM 48 KB general-purpose SRAM - includes ECC protection and SMPU-based task isolation
ADC Resolution & Speed Two 12-bit SAR ADCs, 1.5 µs conversion at 12 MHz - supports synchronized sampling of brake pressure and temperature sensors
Safety Certification AEC-Q100 Grade 1, ISO 26262 ASIL-D compliant - validated fault coverage includes MBIST/LBIST, FCCU, MEMU, and replicated peripheral bridges
Communication Interfaces 2× FlexCAN (32 MB each), 3× DSPI, 2× LINFlexD - meets CAN FD readiness and legacy LIN/UART bootstrap requirements
Operating Temperature −40 °C to 150 °C junction - qualified for under-hood chassis ECU deployment without derating

Pinout & Package

eTQFP100 package (14 × 14 × 1.0 mm), thermally enhanced for automotive under-hood operation; 100-pin configuration with dedicated safety monitoring pins (FCCU_ERR, MEMU_ERR), dual VDD/VSS power domains, and isolated analog/digital supply rails.

Pin/Terminal Circuit Role Design Meaning
VDDA / VSSA Analog power supply / ground Isolated 3.3 V or 5 V rail for ADC reference stability; mandatory decoupling per datasheet Figure 7
AD0–AD15 Analog input channels Shared 16-channel physical inputs between two SAR ADC units; CTU enables hardware-triggered cross-conversion
CAN0_TX / CAN0_RX FlexCAN0 differential transceiver interface Direct connection to external CAN PHY; supports ISO 11898-2 compliant signaling at up to 1 Mbps
NEXUS_TDI / TDO / TCK / TMS Nexus Class 3 debug port 4-pin trace-capable JTAG interface supporting instruction/data trace, crossbar master tracing, and real-time debug halt
FCCU_ERR Fault Collection and Control Unit output Open-drain active-low signal indicating aggregated safety violation requiring system-level fail-safe transition
BOOT_CFG[1:0] Boot mode configuration pins Strap pins selecting UART/CAN serial boot mode or internal flash boot; sampled at reset release

Key Features

Feature Design Value
Dual e200z0h lockstep core with delayed execution Hardware-enforced temporal diversity detects single-event transients without software overhead
Memory Error Management Unit (MEMU) Real-time logging and classification of ECC-correctable/uncorrectable errors in flash/SRAM for ASIL-D diagnostics
Boot Assist Flash (BAF) 8 KB dedicated flash sector enabling factory programming via UART/CAN without full flash erase
Programmable Cross Triggering Unit (CTU) Hardware synchronization of ADC conversions, PWM updates, and timer captures without CPU intervention
8-region System Memory Protection Unit (SMPU) Hardware-enforced memory access isolation per AUTOSAR OS task ID, preventing unintended memory corruption
Enhanced SW watchdog with windowed timeout Configurable 32-bit counter with early-warning interrupt and hard reset on timeout - supports safe state entry

Applications

Brake-by-Wire Control Unit Electric Power Steering (EPS) ECU

Use Scenario: Real-time closed-loop control of hydraulic brake actuators using pressure, position, and temperature feedback.

IC Role / Device Role / Timing Role: Primary ASIL-D host controller executing AUTOSAR-compliant safety kernel, managing dual CAN buses for redundancy and LIN for diagnostic communication.

Use Value: Lockstep CPU execution and FCCU-driven fail-safe transitions ensure <100 µs response to critical sensor faults, meeting ISO 26262 ASIL-D timing constraints.

Use Scenario: Torque assist calculation and motor phase control in column-assist EPS systems with torque sensor and motor current feedback.

IC Role / Device Role / Timing Role: Safety-critical computation engine interfacing with dual 12-bit ADCs for torque sensing and motor current sampling, synchronized via CTU.

Use Value: 1.5 µs ADC conversion time and hardware CTU triggering enable sub-50 µs current loop update cycles, reducing steering lag.

Active Suspension Controller Chassis Domain Controller

Use Scenario: High-frequency damper force modulation based on wheel acceleration, body motion, and road profile estimation.

IC Role / Device Role / Timing Role: Real-time signal processor running adaptive filtering algorithms, fed by 16-channel ADC inputs and communicating via FlexCAN to ADAS subsystems.

Use Value: 48 KB ECC-protected SRAM provides deterministic buffer space for 2 ms rolling window FFT processing without memory contention.

Use Scenario: Centralized coordination of brake, steering, and suspension functions in zonal E/E architectures with OTA update capability.

IC Role / Device Role / Timing Role: Domain master MCU hosting bootloader (BAF), secure firmware update stack, and inter-domain FlexCAN/FlexRay gateway logic.

Use Value: Dual PLL clock domains isolate computational shell (FM-modulated) from deterministic peripheral timing, enabling simultaneous OTA decryption and real-time control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive ASIL-D microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP S32K344 ARM Cortex-R52 dual-core lockstep, 320 MHz max, 4 MB flash, no VLE ISA Higher compute throughput but larger die size and higher static power; requires ARM toolchain migration Select when migrating from Power Architecture is acceptable and >200 MHz deterministic performance is required.
Renesas RH850/P1M 32-bit RXv3 core, 240 MHz, 2 MB flash, ASIL-D certified, no integrated CAN FD PHY support Larger flash capacity but lacks native FlexCAN message buffer scaling (max 16 MB vs. 32 MB); requires external CAN FD transceivers Select for high-flash-density applications where CAN FD PHY integration is handled externally and RX ecosystem alignment is preferred.

Compared with SPC570S50E3CEFAR, the S32K344 offers higher clock speed and larger memory but mandates ARM toolchain adoption and lacks VLE code density benefits; the RH850/P1M provides greater flash headroom but requires external CAN FD PHYs and delivers lower ADC conversion throughput (2.5 µs vs. 1.5 µs).

Availability

SPC570S50E3CEFAR is available at Aetrix Electronics and suitable for brake-by-wire systems, electric power steering ECUs, and active suspension controllers requiring stable component supply across extended automotive production lifecycles.

Supply support for SPC570S50E3CEFAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with over 40 years of automotive qualification expertise.

The SPC570Sx series belongs to ST's automotive microcontroller portfolio designed specifically for ASIL-D chassis and safety applications, emphasizing lockstep processing, memory safety, and integrated functional safety peripherals.

FAQ

What is the maximum junction temperature rating for SPC570S50E3CEFAR?

The device is rated for −40 °C to 150 °C junction temperature under continuous operation, with an optional 165 °C grade available per Technical Note TN1262. Thermal derating is not required within this range when PCB layout follows ST's recommended copper pour and thermal vias per datasheet Section 4.7.

Does SPC570S50E3CEFAR support CAN FD?

No - it supports Classical CAN only, with two FlexCAN modules each providing 32 message buffers and full ISO 11898-1 compliance up to 1 Mbps. CAN FD functionality requires external protocol converters or migration to ST's SPC58NGxx series, which integrate native CAN FD controllers.

How is EEPROM emulation implemented in the on-chip flash?

EEPROM emulation uses the 32 KB data flash partition with wear-leveling managed by ST's SPC5 Flash Driver Library. It divides the partition into logical sectors, rotates write operations across physical blocks, and leverages read-while-write capability to maintain real-time data access during background erases.

What debug interface does SPC570S50E3CEFAR provide for safety-critical development?

It features a Nexus Class 3 debug and trace interface with 4-pin TDI/TDO/TCK/TMS, supporting instruction and data trace for both CPU cores and eDMA, plus crossbar master tracing. This enables real-time visibility into lockstep divergence, memory access violations, and safety mechanism execution for ISO 26262 tool qualification.

SPC570S50E3CEFAR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-TQFP Exposed Pad
Series:
SPC57 S
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, LINbus, SPI, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
-
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

SPC570S50E3CEFAR FAQ

1.How can I place an order for SPC570S50E3CEFAR through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC570S50E3CEFAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC570S50E3CEFAR reliable?

The price and inventory of SPC570S50E3CEFAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC570S50E3CEFAR is usually 5 days.

3.What payment methods are accepted for SPC570S50E3CEFAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC570S50E3CEFAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC570S50E3CEFAR?

SPC570S50E3CEFAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC570S50E3CEFAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC570S50E3CEFAR?

For technical support, including SPC570S50E3CEFAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC570S50E3CEFAR requirements.

6.How does Aetrix verify that SPC570S50E3CEFAR is sourced from the original manufacturer or authorized distributors?

All SPC570S50E3CEFAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC570S50E3CEFAR meets industry standards.

7.What is the process for return or replacement of SPC570S50E3CEFAR?

All SPC570S50E3CEFAR units undergo pre-shipment inspection (PSI). If there is an issue with SPC570S50E3CEFAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC570S50E3CEFAR part is unused and in its original packaging.

Return procedure for SPC570S50E3CEFAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC570S50E3CEFAR Tags

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