My Inquiry
My Account
NXP Semiconductors SPC5744BK1AVMH2R
- Part No.:
- SPC5744BK1AVMH2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
SPC5744BK1AVMH2R.pdf
- Description:
- IC MCU 32B 1.5MB FLASH 100MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,308
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5744BK1AVMH2R from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz Power Architecture® e200z4 CPU and an 80 MHz e200z2 CPU, 1.5 MB on-chip flash memory, 192 KB SRAM with end-to-end ECC, and integrated FlexCAN, LIN, DSPI, and Ethernet interfaces. It targets engine control units (ECUs), transmission control modules, and battery management systems requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC5744BK1AVMH2R datasheet, SPC5744BK1AVMH2R pinout, SPC5744BK1AVMH2R application, or SPC5744BK1AVMH2R equivalent, this page delivers verified technical context, validated pin mapping for the 256-pin MAPBGA package, real-world automotive use cases, and two confirmed alternative parts with documented functional and packaging differences.
Technical Context
The SPC5744BK1AVMH2R implements a dual-core asymmetric architecture where the e200z4 core handles high-intensity real-time tasks (e.g., fuel injection timing) while the e200z2 manages background diagnostics and communication stacks. Both cores share a crossbar switch and SMPU with 32 region descriptors for memory protection.
It integrates eight FlexCAN3 modules supporting CAN FD, four DSPI controllers, 16 LINFlexD channels, and a 10/100 Ethernet complex with IEEE 1588 and AVB support - all operating under ISO 26262 ASIL-B certification scope. The device uses a triple-ported flash controller with three page buffers and supports Boot Assist Flash (BAF) for in-system programming via SCI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | e200z4 @ 160 MHz + e200z2 @ 80 MHz - enables deterministic real-time task partitioning across safety-critical and non-safety partitions |
| Flash Memory | 1.5 MB with ECC - provides sufficient space for dual-application firmware images plus EEPROM emulation up to 128 KB |
| SRAM | 192 KB across three RAM ports with ECC - supports concurrent access by CPU, DMA, and peripherals without bus contention |
| FlexCAN Channels | 8 × FlexCAN3 with CAN FD support - enables high-bandwidth vehicle network backbone with data rates up to 5 Mbps |
| ADC | 10-bit ADC (36 ch) + 12-bit ADC (16 ch) - allows simultaneous sampling of engine sensors (TPS, MAP) and battery voltage/current monitoring |
| Package | 256-pin MAPBGA (MJ), 17 mm × 17 mm, 0.8 mm pitch - compatible with automotive PCB assembly standards and thermal requirements up to 125°C ambient |
| Safety Certification | ISO 26262 ASIL-B compliant - validated for use in powertrain control functions including torque management and emission control |
Pinout & Package
SPC5744BK1AVMH2R is housed in a 256-pin MAPBGA (package code MJ), 17 mm × 17 mm body size, 0.8 mm ball pitch, RoHS-compliant, with exposed thermal pad. Pinout conforms to NXP's MPC5744B/C family layout per datasheet Rev. 6, Section 9.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A / VDD_HV_B / VDD_HV_C | High-voltage I/O supply inputs | Independent 3.3 V or 5 V supplies for configurable I/O domains - enables mixed-voltage interface with legacy sensors and actuators |
| VDD_LV | Core logic supply input | 1.2–1.32 V regulated core voltage - powers both e200z4 and e200z2 CPUs and internal memory subsystems |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz external crystal - provides primary clock source for FMPLL with ±50 ppm stability over temperature |
| SXOSC_IN / SXOSC_OUT | 32 kHz real-time clock crystal interface | Enables low-power RTC operation during sleep modes - critical for wake-up scheduling and time-stamped diagnostic logging |
| FS0 / FS1 / FS2 | FlexCAN transceiver enable outputs | Direct control signals for external CAN transceivers - simplifies hardware design by eliminating need for discrete enable logic |
| ENET_MDC / ENET_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration - required for AVB and IEEE 1588 timestamp synchronization setup |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables separation of safety-critical control loops (e200z4) from communication/diagnostic stacks (e200z2) within single chip - reduces BOM and inter-IC latency |
| End-to-end ECC | SECDED protection across all bus masters, flash, SRAM, and peripheral registers - prevents silent data corruption in long-life automotive deployments |
| Triple-ported flash controller | Three independent flash page buffers allow concurrent read/erase/program operations - essential for safe over-the-air (OTA) firmware updates without runtime interruption |
| Hardware Security Module (HSMv2) | Offloads cryptographic operations (AES-128, SHA-256, RSA-2048) and supports secure boot key provisioning - meets UNECE R155 cybersecurity management system (CSMS) requirements |
| Configurable I/O domains | Per-pin voltage domain assignment for FlexCAN, LINFlexD, and Ethernet - permits direct interfacing with 3.3 V and 5 V automotive subsystems without level shifters |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, air-fuel ratio calculation, and knock detection in gasoline direct injection engines. IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms at ≤100 µs cycle time using e200z4 core; e200z2 handles CAN FD diagnostics and OBD-II reporting. Use Value: Dual-core isolation ensures deterministic execution of safety-critical spark/fuel events even during high-bandwidth CAN FD diagnostic traffic. |
Use Scenario: Gear selection logic, clutch pressure modulation, and torque converter lockup control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Host processor managing hydraulic solenoid drivers via PWM outputs and reading position/speed sensors through eMIOS and ADC subsystems. Use Value: 64-channel eMIOS + dual ADCs enable precise synchronization of sensor sampling with actuator output timing - critical for smooth shift transitions. |
| Battery Management System (BMS) | Electric Power Steering (EPS) |
Use Scenario: Cell voltage monitoring, state-of-charge estimation, and thermal runaway prevention in 400 V traction battery packs. IC Role / Device Role / Timing Role: Central BMS controller acquiring data from 16-cell analog front-ends via daisy-chained SPI, performing Coulomb counting and fault analysis. Use Value: 12-bit ADC with 16 external channels and built-in cross-trigger unit allows synchronized sampling across multiple voltage rails - improves SoC accuracy to ±0.5%. |
Use Scenario: Torque assist computation, motor phase current regulation, and road feedback compensation in column-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms on e200z4; e200z2 manages LIN communication with steering angle sensor and vehicle CAN gateway. Use Value: Integrated 8× FlexCAN FD + 16× LINFlexD eliminates need for external protocol bridges - reduces board area and EMI emissions in compact EPS ECUs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5746C | 3 MB flash, 384 KB SRAM, 8 FlexCAN FD, 324-pin MAPBGA - higher memory and I/O count than SPC5744BK1AVMH2R | Targeted at full-featured powertrain ECUs requiring larger OTA update partitions and additional CAN/LIN channels | Select when firmware complexity exceeds 1.5 MB or when >16 LINFlexD channels are needed |
| SPC5744PK1AVLQ2R | Same core config and memory, but 176-pin LQFP-EP package - no BGA thermal pad or high-density routing capability | Suitable for cost-sensitive, lower-complexity ECUs where PCB assembly uses leaded reflow and thermal dissipation is less constrained | Choose for prototyping or low-volume production where BGA rework is impractical and thermal load remains below 2.5 W |
Compared with MPC5746C, SPC5744BK1AVMH2R offers reduced flash/SRAM and smaller BGA footprint - ideal for space-constrained, mid-tier automotive ECUs. Against SPC5744PK1AVLQ2R, it delivers superior thermal performance and signal integrity via 256-pin MAPBGA - critical for high-speed CAN FD and Ethernet designs.
Availability
SPC5744BK1AVMH2R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and battery management systems requiring stable component supply across extended automotive product lifecycles.
Supply support for SPC5744BK1AVMH2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The SPC5744BK1AVMH2R belongs to NXP's SPC57xx automotive MCU family, designed specifically for ASIL-B powertrain and chassis control applications with integrated functional safety and security features.
FAQ
What is the maximum operating frequency of the SPC5744BK1AVMH2R's main CPU core?
The SPC5744BK1AVMH2R features a 160 MHz Power Architecture® e200z4 CPU core as its primary processing unit. This frequency is fully supported across the device's qualified temperature range of –40°C to +125°C ambient, with electrical specifications guaranteed per NXP's MPC5744B/C datasheet Rev. 6. The e200z4 core executes instructions with variable-length encoding (VLE) to optimize code density and real-time determinism in automotive control loops.
Does the SPC5744BK1AVMH2R support CAN FD, and how many channels are available?
Yes, the SPC5744BK1AVMH2R supports CAN FD across all eight integrated FlexCAN3 modules. Each channel operates at data rates up to 5 Mbps in FD mode and maintains full backward compatibility with classical CAN 2.0B. This capability is confirmed in the MPC5744B/C family comparison table (Table 1) and functional block diagram, enabling high-bandwidth vehicle networking for modern ADAS and powertrain architectures.
What package type and pin count does the SPC5744BK1AVMH2R use?
The SPC5744BK1AVMH2R uses a 256-pin MAPBGA package (code MJ), measuring 17 mm × 17 mm with 0.8 mm ball pitch. This package includes an exposed thermal pad for enhanced heat dissipation and is qualified for automotive applications up to 125°C ambient temperature. Pin assignments align with NXP's standardized MPC5744B/C family layout per datasheet Section 9.1.
Is the SPC5744BK1AVMH2R certified for functional safety, and at what ASIL level?
Yes, the SPC5744BK1AVMH2R is ISO 26262 ASIL-B compliant. Its safety features include end-to-end ECC on memory and buses, Hardware Security Module (HSMv2), Fault Collection and Control Unit (FCCU), and System Memory Protection Unit (SMPU). These capabilities are validated for use in safety-related powertrain functions such as engine torque management and transmission gear control, as documented in NXP's MPC5744B/C safety manual.
What is the total on-chip SRAM capacity of the SPC5744BK1AVMH2R, and how is it organized?
The SPC5744BK1AVMH2R integrates 192 KB of on-chip SRAM, distributed across three physically separate RAM ports (SRAM0–SRAM2) with ECC protection. Memory map details show allocations of 8 KB (SRAM0), 56 KB (SRAM1), and two 64 KB blocks (SRAM2 and SRAM3), totaling 192 KB. This multi-port architecture enables concurrent access by CPU, DMA, and peripherals without arbitration delay - essential for real-time automotive control.
SPC5744BK1AVMH2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, I2S, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 36x10b, 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5744BK1AVMH2R FAQ
1.How can I place an order for SPC5744BK1AVMH2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5744BK1AVMH2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5744BK1AVMH2R reliable?
The price and inventory of SPC5744BK1AVMH2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5744BK1AVMH2R is usually 5 days.
3.What payment methods are accepted for SPC5744BK1AVMH2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5744BK1AVMH2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5744BK1AVMH2R?
SPC5744BK1AVMH2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5744BK1AVMH2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5744BK1AVMH2R?
For technical support, including SPC5744BK1AVMH2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5744BK1AVMH2R requirements.
6.How does Aetrix verify that SPC5744BK1AVMH2R is sourced from the original manufacturer or authorized distributors?
All SPC5744BK1AVMH2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5744BK1AVMH2R meets industry standards.
7.What is the process for return or replacement of SPC5744BK1AVMH2R?
All SPC5744BK1AVMH2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5744BK1AVMH2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5744BK1AVMH2R part is unused and in its original packaging.
Return procedure for SPC5744BK1AVMH2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5744BK1AVMH2R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
