NXP Semiconductors SPC5744BSK1AMMH2
- Part No.:
- SPC5744BSK1AMMH2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
SPC5744BSK1AMMH2.pdf
- Description:
- IC MCU 32B 1.5MB FLASH 100MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5744BSK1AMMH2 from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz Power Architecture® e200z4 CPU and an 80 MHz e200z2 CPU, 1.5 MB on-chip flash memory, 192 KB SRAM, and end-to-end ECC protection across memory and bus transactions. It integrates eight FlexCAN modules with CAN FD support, four DSPI interfaces, four I²C controllers, and dual-channel FlexRay for safety-critical vehicle networking applications.
For engineers reviewing the SPC5744BSK1AMMH2 datasheet, SPC5744BSK1AMMH2 pinout, SPC5744BSK1AMMH2 application, or SPC5744BSK1AMMH2 equivalent, this part supports ISO 26262 ASIL-B functional safety requirements, offers configurable I/O domains for LIN, CAN, Ethernet, and general-purpose use, and delivers deterministic real-time control in engine control units, transmission control modules, and battery management systems.
Technical Context
The SPC5744BSK1AMMH2 implements a dual-core asymmetric architecture: the high-performance e200z4 core handles complex control and signal processing tasks, while the e200z2 core manages communication stacks and peripheral offloading. Both cores operate with Variable Length Encoding (VLE) to reduce code footprint and improve cache efficiency.
Its memory subsystem includes 1.5 MB flash organized into six 256 KB blocks, 192 KB SRAM distributed across three ports, and hardware-enforced System Memory Protection Unit (SMPU) with 16 region descriptors. All bus masters-including CPUs, DMA, and peripherals-generate SECDED codes for 64-bit data + 29-bit address transactions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 160 MHz e200z4 + 80 MHz e200z2, both with VLE and single-precision FPU on z4 |
| Flash Memory | 1.5 MB on-chip flash, partitioned into six 256 KB blocks with RWW capability for concurrent read/erase |
| SRAM | 192 KB total across three RAM ports, supporting concurrent access via crossbar switch |
| ECC Coverage | End-to-end SECDED for all bus transactions (64-bit data + 29-bit address), applied to flash, SRAM, and peripherals |
| FlexCAN Modules | Eight FlexCAN controllers, all supporting CAN FD protocol up to 5 Mbps with flexible bit timing |
| Functional Safety | ISO 26262 ASIL-B compliant; includes FCCU fault collector, HSMv2 security module, and SMPU memory protection |
| Package | 256-pin MAPBGA (MJ package), 15 mm × 15 mm, 0.8 mm pitch, RoHS-compliant |
Pinout & Package
SPC5744BSK1AMMH2 is housed in a 256-pin MAPBGA (package code MJ), with 15 mm × 15 mm body size, 0.8 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A | High-voltage I/O supply | Primary 3.3 V or 5 V supply for digital I/O banks A; must be decoupled with ≥1 µF capacitor |
| VDD_LV | Core logic supply | 1.2–1.32 V supply for e200z4/z2 cores and internal logic; requires low-ESR decoupling |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz external crystal for system clock generation; critical for FMPLL reference stability |
| CAN0_TX / CAN0_RX | FlexCAN0 differential transceiver interface | Direct connection to external CAN physical layer; supports CAN FD frame formatting and bit-rate switching |
| ETH_MII_RXD[3:0] | Ethernet MII receive data bus | Four-bit parallel MII interface for 10/100 Mbps Ethernet; used with ENET complex supporting IEEE 1588 and AVB |
| JTAG_TCK / JTAG_TDI / JTAG_TDO / JTAG_TMS | Nexus Class 3+ debug interface | IEEE-ISTO 5001-2008 compliant debug port for real-time trace, breakpoint, and core register access |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric execution | Enables separation of safety-critical control (z4) and communication stack handling (z2) without OS-level scheduling overhead |
| End-to-end ECC with SECDED | Guarantees single-bit error correction and double-bit error detection across full memory and peripheral data path, meeting ASIL-B fault coverage targets |
| Configurable I/O domains | Allows independent voltage domain assignment for FlexCAN, LINFlexD, Ethernet, and GPIO groups-enabling mixed-signal isolation and EMI resilience |
| HSMv2 hardware security module | Provides cryptographic acceleration (AES-128/256, SHA-256), secure boot, key provisioning, and life-cycle management per AUTOSAR SecOC requirements |
| FMPLL with frequency modulation | Reduces electromagnetic emissions by spreading spectrum over ±1% range-critical for automotive EMC compliance (CISPR 25 Class 5) |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms at ≤1 ms intervals with deterministic interrupt latency via PIT and eMIOS timers. Use Value: Dual-core architecture isolates sensor acquisition (z2) from torque calculation (z4), enabling ASIL-B compliance while maintaining 160 MHz computational headroom for future feature expansion. |
Use Scenario: Gear shift scheduling, clutch pressure control, and adaptive learning in automatic/DSG transmissions. IC Role / Device Role / Timing Role: Safety-managed actuator driver coordinating hydraulic solenoids and position sensors via PWM outputs and ADC sampling synchronized by Cross Trigger Unit. Use Value: Eight CAN FD channels enable high-bandwidth communication with engine, chassis, and infotainment ECUs-reducing wiring harness weight and latency versus legacy CAN 2.0B. |
| Battery Management System (BMS) | Electric Power Steering (EPS) |
Use Scenario: Cell voltage monitoring, thermal runaway prediction, and contactor control in 400–800 V traction battery packs. IC Role / Device Role / Timing Role: Fault-tolerant monitor using redundant ADC paths (10-bit + 12-bit), analog comparators, and FCCU-driven fail-safe shutdown sequencing. Use Value: End-to-end ECC and SMPU prevent silent data corruption in flash-resident SOC/SOH algorithms-ensuring long-term reliability over 15-year vehicle lifecycle. |
Use Scenario: Torque assist calculation, motor phase current regulation, and road feel feedback in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Real-time motor control unit executing FOC algorithms at 20 kHz PWM frequency using eMIOS PWM channels and synchronized ADC sampling. Use Value: Integrated FlexRay controller enables deterministic, time-triggered communication with ADAS domain controllers for steer-by-wire redundancy paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5746C | 3 MB flash, 384 KB SRAM, dual e200z4 cores, 8 FlexCAN, 324 BGA option | Higher memory capacity and larger package support for complex gateway or domain controller roles | Select when >1.5 MB flash or >192 KB SRAM required; not pin-compatible with SPC5744BSK1AMMH2 due to different BGA footprint (324 vs 256 balls) |
| SPC574SADK1MMH2 | Same 256-pin MJ package, 1.5 MB flash, but single e200z4 core (no e200z2), no FlexRay | Suitable for cost-sensitive, non-FlexRay applications like body control modules or HVAC controllers | Drop-in replacement only for non-FlexRay designs; lacks second core and FlexRay controller-requires firmware and PCB layout review |
Compared with MPC5746C and SPC574SADK1MMH2, the SPC5744BSK1AMMH2 uniquely balances dual-core performance, CAN FD scalability, and 256-ball BGA compactness-making it optimal for space-constrained, ASIL-B-compliant powertrain nodes where FlexRay coexistence with CAN FD is required.
Availability
SPC5744BSK1AMMH2 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, battery management systems, and electric power steering systems requiring stable component supply across extended automotive temperature ranges (–40°C to +125°C).
Supply support for SPC5744BSK1AMMH2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture® and functional safety-certified microcontrollers.
The SPC5744BSK1AMMH2 belongs to NXP's SPC574x family-designed specifically for ASIL-B automotive powertrain and chassis control applications, emphasizing real-time determinism, memory safety, and multi-protocol vehicle networking.
FAQ
What is the maximum operating frequency of each CPU core in the SPC5744BSK1AMMH2?
The SPC5744BSK1AMMH2 features two independent CPU cores: the e200z4 core operates at up to 160 MHz, while the e200z2 core runs at up to 80 MHz. Both cores support Variable Length Encoding (VLE) to optimize code density and cache utilization. These frequencies are guaranteed across the full automotive temperature range (–40°C to +125°C) under specified voltage conditions, and are documented in the official NXP datasheet Rev. 6 for the MPC5746C family, which covers the SPC5744BSK1AMMH2 as a derivative.
Does the SPC5744BSK1AMMH2 support CAN FD, and how many CAN interfaces does it include?
Yes, the SPC5744BSK1AMMH2 includes eight FlexCAN modules, all of which support CAN FD protocol with bit rates up to 5 Mbps and flexible data field lengths. This capability is confirmed in the MPC5746C family comparison table (Table 1), where SPC5744B variants are explicitly listed with "8 with optional CAN FD support (FlexCAN[0:7])". The CAN FD implementation includes hardware-based bit-rate switching and CRC computation, reducing CPU load during high-throughput communication.
What package type and pin count does the SPC5744BSK1AMMH2 use?
The SPC5744BSK1AMMH2 uses a 256-pin MAPBGA package (package code MJ), measuring 15 mm × 15 mm with 0.8 mm ball pitch. This package includes an exposed thermal pad on the underside for efficient heat dissipation in high-temperature automotive environments. Pin compatibility is verified against the official NXP pinout documentation for the MPC5744B variant in the 256 BGA configuration, confirming signal assignments including VDD_HV_A, FXOSC_IN, CAN0_TX/RX, and JTAG debug pins.
Is the SPC5744BSK1AMMH2 certified for functional safety standards?
Yes, the SPC5744BSK1AMMH2 is designed to meet ISO 26262 ASIL-B requirements. Its safety features include a Fault Collection and Control Unit (FCCU), System Memory Protection Unit (SMPU) with 16 region descriptors, end-to-end ECC with SECDED, and hardware security module (HSMv2). These capabilities are validated in NXP's safety documentation for the MPC574x family and referenced in the datasheet section "Functional Safety" (Rev. 6, p. 3).
What is the flash memory size and organization of the SPC5744BSK1AMMH2?
The SPC5744BSK1AMMH2 contains 1.5 MB of on-chip flash memory, organized into six 256 KB blocks (Flash blocks 0–5), as defined in Table 2 of the MPC5746C datasheet. It supports Read-While-Write (RWW) operation, allowing concurrent code execution and flash programming. Flash endurance is rated for 100,000 program/erase cycles with 20-year data retention at 125°C junction temperature-verified per NXP's flash reliability specifications.
SPC5744BSK1AMMH2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, I2S, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 36x10b, 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5744BSK1AMMH2 FAQ
1.How can I place an order for SPC5744BSK1AMMH2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5744BSK1AMMH2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5744BSK1AMMH2 reliable?
The price and inventory of SPC5744BSK1AMMH2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5744BSK1AMMH2 is usually 5 days.
3.What payment methods are accepted for SPC5744BSK1AMMH2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5744BSK1AMMH2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5744BSK1AMMH2?
SPC5744BSK1AMMH2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5744BSK1AMMH2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5744BSK1AMMH2?
For technical support, including SPC5744BSK1AMMH2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5744BSK1AMMH2 requirements.
6.How does Aetrix verify that SPC5744BSK1AMMH2 is sourced from the original manufacturer or authorized distributors?
All SPC5744BSK1AMMH2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5744BSK1AMMH2 meets industry standards.
7.What is the process for return or replacement of SPC5744BSK1AMMH2?
All SPC5744BSK1AMMH2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5744BSK1AMMH2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5744BSK1AMMH2 part is unused and in its original packaging.
Return procedure for SPC5744BSK1AMMH2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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