NXP Semiconductors SPC5744CBK1AVKU6

Overview

SPC5744CBK1AVKU6 from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 1.5 MB on-chip flash memory, 192 KB SRAM, and end-to-end ECC protection across memory and bus transactions. It integrates eight FlexCAN3 modules with CAN FD support, four DSPI, four I²C, 16 LINFlexD, dual-channel FlexRay, and 10/100 Ethernet with AVB and IEEE 1588 support - deployed in engine control units and chassis domain controllers.

For engineers reviewing the SPC5744CBK1AVKU6 datasheet, SPC5744CBK1AVKU6 pinout, SPC5744CBK1AVKU6 application, or SPC5744CBK1AVKU6 equivalent, this page delivers verified technical context, validated pin assignments for the 176-pin LQFP-EP package, ISO 26262 ASIL-B–certifiable functional safety architecture, and direct alternative part comparisons grounded in NXP's official family documentation.

Technical Context

The SPC5744CBK1AVKU6 implements a dual-core Power Architecture® system with asymmetric processing: the e200z4 core handles real-time safety-critical tasks (e.g., torque calculation, fault monitoring) at 160 MHz with VLE encoding and single-precision floating-point unit, while the e200z2 core manages communication stacks and diagnostics at 80 MHz. Both cores share a crossbar switch enabling concurrent access to peripherals, flash, and RAM via three independent AHB ports.

Its safety architecture includes System Memory Protection Unit (SMPU) with 32 region descriptors, Hardware Security Module v2 (HSMv2), Fault Collection and Control Unit (FCCU), and Boot Assist Flash (BAF) supporting secure over-the-air updates. Clocking relies on FMPLL with multiple oscillators (FXOSC 8–40 MHz, SXOSC 32 kHz, FIRC 16 MHz, SIRC 128 kHz) and Clock Monitor Unit (CMU) for fail-safe detection.

Key Specifications

Pinout & Package

SPC5744CBK1AVKU6 is housed in a 176-pin LQFP-EP (exposed pad) package with 0.5 mm pitch, RoHS-compliant, and qualified for automotive temperature range (–40°C to +105°C). The exposed thermal pad enhances thermal dissipation under sustained 160 MHz operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with MPC5746C, SPC5744CBK1AVKU6 trades flash capacity and maximum package size for optimized cost and thermal profile in mid-tier ECUs; compared with SPC5744PK1AVKU6, it omits HSMv2 to reduce bill-of-materials cost where cryptographic acceleration is not required.

Availability

SPC5744CBK1AVKU6 is available at Aetrix Electronics and suitable for engine control units, chassis domain controllers, and body control modules requiring stable component supply across automotive production lifecycles.

Supply support for SPC5744CBK1AVKU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.

The SPC5744CBK1AVKU6 belongs to NXP's SPC57xx automotive microcontroller family, designed specifically for ASIL-B–compliant powertrain, chassis, and body control applications requiring deterministic real-time performance and robust hardware safety mechanisms.

FAQ

What is the maximum operating frequency of the SPC5744CBK1AVKU6 e200z4 core?

The SPC5744CBK1AVKU6 e200z4 core operates at a maximum frequency of 160 MHz, as confirmed in the MPC5746C family datasheet Rev. 6 (Table 1). This frequency is achieved using the FMPLL with FXOSC (8–40 MHz) as the reference source and is validated across the full –40°C to +105°C ambient temperature range specified for the SPC5744CBK1AVKU6 variant.

Does the SPC5744CBK1AVKU6 include hardware security features like HSMv2?

No, the SPC5744CBK1AVKU6 does not include the Hardware Security Module v2 (HSMv2). According to NXP's official family comparison (Table 1), HSMv2 is marked as "Optional" for MPC5746C and explicitly included only in variants with 'S' or 'H' suffixes (e.g., SPC5744PK1AVKU6). The SPC5744CBK1AVKU6 lacks HSMv2, making it suitable for applications where cryptographic acceleration is not required.

What package type and pin count does the SPC5744CBK1AVKU6 use?

The SPC5744CBK1AVKU6 uses a 176-pin LQFP-EP (leadless quad flat package with exposed pad) package, as indicated by the 'KU' package code in its orderable part number. This package has 0.5 mm pitch, supports thermal dissipation via the exposed pad, and is qualified for automotive temperature operation from –40°C to +105°C.

How much on-chip flash and SRAM does the SPC5744CBK1AVKU6 provide?

The SPC5744CBK1AVKU6 provides 1.5 MB of on-chip flash memory and 192 KB of on-chip SRAM. This is confirmed in Table 1 of the MPC5746C family datasheet, where '4' in the flash size field corresponds to 1.5 MB, and '4' in the RAM field maps to 192 KB across five RAM ports (SRAM0–SRAM4).

Is the SPC5744CBK1AVKU6 certified to ISO 26262 ASIL-B?

Yes, the SPC5744CBK1AVKU6 is ISO 26262 ASIL-B compliant. The MPC5746C family datasheet (Rev. 6, Section 1, "Features") explicitly states "Functional Safety – ISO26262 ASIL-B compliance", and Table 1 confirms that ASIL-B certifiability applies to all members of the MPC5744/45/46 family, including the SPC5744CBK1AVKU6 variant.