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NXP Semiconductors SPC5744PGK1AMMM9
- Part No.:
- SPC5744PGK1AMMM9
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5744PGK1AMMM9.pdf
- Description:
- IC MCU 32B 2.5MB FLASH 257MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:467
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Product details
Overview
SPC5744PGK1AMMM9 from NXP Semiconductors is a 32-bit Power Architecture® microcontroller designed for automotive chassis and safety-critical systems compliant with ISO 26262 ASIL-D. It integrates dual e200z4 cores in delayed lock-step, 2.5 MB ECC flash, 384 KB ECC SRAM, and hardware safety modules including FCCU and EIM. It targets electric power steering, brake control, and airbag deployment systems.
For engineers reviewing the SPC5744PGK1AMMM9 datasheet, SPC5744PGK1AMMM9 pinout, SPC5744PGK1AMMM9 application, or SPC5744PGK1AMMM9 equivalent, key selection criteria include ASIL-D certification evidence, dual-core lock-step validation status, junction temperature rating (150°C/165°C option), FlexRay + triple FlexCAN interface support, and BGA-257 package thermal performance under automotive transient conditions.
Technical Context
The SPC5744PGK1AMMM9 implements a Harvard architecture with 8 KB instruction cache (EDC) and 4 KB data cache (EDC), coupled with 64 KB data local memory (ECC). Its clocking system includes one PLL and one FMPLL, supporting external crystals from 8–40 MHz and an internal 16 MHz RC oscillator.
Safety execution relies on hardware-enforced delayed lock-step between two e200z4 cores, monitored by FCCU and cross-triggered via CTU. Peripheral redundancy includes dual-channel FlexRay (64-message buffers), three FlexCAN modules (64-message buffers each), and error-injectable memory subsystems with end-to-end ECC on AHB bus and flash/SRAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual e200z4 cores in hardware-implemented delayed lock-step for ASIL-D fault containment |
| Flash Memory | 2.5 MB code/data flash with ECC, Read-While-Write (RWW) capability for live firmware updates |
| SRAM | 384 KB on-chip SRAM with ECC, supporting safe data storage and runtime stack isolation |
| Operating Junction Temp | Rated for −40°C to +150°C; optional +165°C junction version confirmed in datasheet Rev. 6.1 |
| Communication Interfaces | 1× FlexRay (dual channel, 64 msg buf), 3× FlexCAN (64 msg buf each), 2× LINFlexD, 4× SPI, Ethernet switch |
| Safety Features | FCCU, EIM, CTU, MPU (24 core + 16 system regions), Nexus Level 3+ debug with Aurora trace |
| Analog Peripherals | 4× 12-bit ADC modules (16 ch each, 25 external inputs total), SGEN (32-point sine-wave generator) |
Pinout & Package
SPC5744PGK1AMMM9 uses a 257-ball MAPBGA package (0.8 mm pitch, 14 mm × 14 mm outline), optimized for automotive thermal and EMI performance. Pin assignments follow NXP's standardized ballmap for MPC5744P series, with dedicated high-voltage I/O supply domains (VDD_HV_IO, VDD_HV_ADV), isolated PLL and LFAST power rails, and Aurora/Nexus LVDS trace lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IO (A9, B2, …) | High-voltage I/O supply | Separate 3.3 V domain for robust GPIO, CAN/LIN transceiver I/O, and ADC reference stability |
| VSS_HV_IO (A1, A2, …) | High-voltage I/O ground | Isolated return path minimizing noise coupling into analog/safety logic domains |
| VDD_LV_PLL (P4) | PLL low-voltage supply | Dedicated 1.25 V LDO-supplied rail ensuring jitter-free clock synthesis for safety timing |
| FCCU_F[0] (R2), FCCU_F[1] (C4) | Fault collection unit flags | Hardwired outputs indicating detected faults-non-muxable, asserted during lock-step mismatch or memory ECC error |
| G[12]/G[13]/G[14]/G[15]/H[0]/H[1] | Aurora LVDS trace interface | High-speed Nexus trace lanes (TX0P/N, TX1P/N, CLKP/N) enabling real-time ASIL-D software verification |
| M14/M15/M16/N15 | SIPI/LFAST LVDS interface | LVDS transmit/receive pairs for deterministic inter-ECU communication with sub-μs latency |
Key Features
| Feature | Design Value |
|---|---|
| Dual e200z4 lock-step cores | Hardware-synchronized execution with automatic fault detection and fail-safe state capture |
| FCCU + EIM integration | Enables configurable fault response (reset, interrupt, or safe state entry) and controlled fault injection for SIL/ASIL validation |
| End-to-end ECC on AHB bus | Protects all core-to-peripheral data transfers against bit flips, required for ASIL-D data integrity |
| Flexible peripheral muxing (SIUL2) | Runtime-configurable pin functions via MSCR/IMCR registers-supports dynamic reassignment without reset |
| Triple FlexCAN + dual-channel FlexRay | Redundant high-integrity networking for chassis domain controllers requiring concurrent CAN FD and time-triggered protocols |
| Nexus Level 3+ with Aurora | Non-intrusive, high-bandwidth trace capability for runtime verification of safety-critical task scheduling and memory access patterns |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire Control |
|---|---|
Use Scenario: Real-time torque assist calculation and motor phase control under dynamic road load and fault conditions. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-D EPS algorithms with lock-step core monitoring and FCCU-managed fail-safe transitions. Use Value: Enables certified torque overlay functionality with <100 μs fault reaction time and zero-latency sensor fusion via integrated ADCs and eTimer modules. | Use Scenario: Coordinating hydraulic pressure modulation across multiple wheel circuits while maintaining functional redundancy. IC Role / Device Role / Timing Role: Central chassis domain controller managing FlexRay backbone communication, CAN-based actuator commands, and real-time pressure feedback loops. Use Value: Supports dual-channel FlexRay messaging (64 msg buf per channel) and triple FlexCAN for independent brake circuit supervision-meeting ISO 26262 Part 10 requirements. |
| Airbag Deployment System | Advanced Driver Assistance Systems (ADAS) Sensor Fusion Hub |
Use Scenario: Processing crash sensor signals, verifying collision severity, and triggering pyrotechnic actuators within strict timing windows. IC Role / Device Role / Timing Role: Safety-critical decision engine with hardware-protected memory, ECC-secured flash boot image, and deterministic interrupt latency (<2 μs). Use Value: Achieves ASIL-D compliance via dual-core lock-step, EIM-enabled test coverage, and FCCU-driven safe state activation upon memory or timing violation. | Use Scenario: Aggregating radar, camera, and ultrasonic inputs for object tracking and path prediction in L2+ systems. IC Role / Device Role / Timing Role: High-throughput sensor interface hub using 4× 12-bit ADCs (25 external channels), SPI peripherals, and Ethernet switching for multi-sensor data routing. Use Value: Delivers synchronized timestamping across sensors via STM and CTU, with 384 KB ECC SRAM buffering raw data streams before AI inference offload. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC574S24K1MMLQ | Single e200z4 core, 2 MB flash, 256 KB SRAM, LQFP-144 package, no FlexRay | Targeted at ASIL-B/C body control modules-not certified for ASIL-D chassis functions | Select only for non-chassis applications where lock-step redundancy and FlexRay are unnecessary |
| TC397XP-128F300S-DC | TriCore™ architecture, 300 MHz, 4 MB flash, 12 MB SRAM, 176-pin TQFP, supports HSM but no native FlexRay | Higher compute throughput for complex ADAS perception stacks; requires external FlexRay PHY | Prefer when migrating toward AUTOSAR Adaptive or integrating HSM-based secure boot-requires PCB redesign |
Compared with SPC5744PGK1AMMM9, the SPC574S24K1MMLQ lacks dual-core lock-step and FlexRay-making it unsuitable for ASIL-D chassis control-while the TC397XP offers greater processing headroom but introduces architectural divergence and external interface dependencies that increase validation scope.
Availability
SPC5744PGK1AMMM9 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, and airbag deployment systems requiring stable component supply, long-term automotive lifecycle support, and ASIL-D-certified silicon.
Supply support for SPC5744PGK1AMMM9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded processing.
The SPC5744PGK1AMMM9 belongs to NXP's SafeAssure portfolio of ASIL-D-certified MCUs, engineered specifically for chassis and safety-critical vehicle subsystems demanding hardware-level fault containment and ISO 26262 tool qualification evidence.
FAQ
What is the maximum junction temperature rating for the SPC5744PGK1AMMM9?
The SPC5744PGK1AMMM9 is rated for a maximum junction temperature of 150°C as standard, with an optional 165°C variant explicitly documented in the MPC5744P Data Sheet Rev. 6.1. This higher rating enables operation in under-hood environments with elevated ambient thermal loads, such as near engine compartments or high-power inverters. The SPC5744PGK1AMMM9 datasheet specifies derating curves and thermal resistance values (θJA, θJC) to validate thermal design margins.
Does the SPC5744PGK1AMMM9 support ISO 26262 ASIL-D certification out of the box?
Yes-the SPC5744PGK1AMMM9 is part of NXP's SafeAssure solution suite and provides hardware features required for ASIL-D compliance, including dual e200z4 cores in delayed lock-step, FCCU, EIM, and end-to-end ECC. However, full ASIL-D certification depends on system-level implementation, safety manual adherence, and tool qualification. The SPC5744PGK1AMMM9 itself is qualified to support ASIL-D development per ISO 26262-5 and -8, with documentation provided in NXP's safety manual.
What package type and pin count does the SPC5744PGK1AMMM9 use?
The SPC5744PGK1AMMM9 uses a 257-ball MAPBGA package with 0.8 mm pitch and a 14 mm × 14 mm body size. This package is distinct from the LQFP-144 variant and includes dedicated LVDS lanes for Aurora trace and SIPI/LFAST, along with isolated power domains for analog, PLL, and I/O sections. Pin assignments match the MPC5744P family ballmap defined in Section 2.1 of the official datasheet.
How many FlexCAN modules does the SPC5744PGK1AMMM9 integrate, and what is their message buffer capacity?
The SPC5744PGK1AMMM9 integrates three independent FlexCAN modules, each supporting up to 64 message buffers. These modules operate concurrently and support CAN FD protocol extensions, enabling high-bandwidth communication across distributed chassis ECUs. Each module has dedicated message RAM, acceptance filtering, and loopback/self-test modes-critical for ASIL-D diagnostics. This configuration is confirmed in Table 1 of the MPC5744P Data Sheet Rev. 6.1.
Is the SPC5744PGK1AMMM9 pin-compatible with other MPC574xP series devices like the MPC5743P or MPC5742P?
No-while the SPC5744PGK1AMMM9 shares the same 257-MAPBGA footprint and core architecture with other MPC574xP variants, it is not fully pin-compatible due to differences in peripheral allocation and power domain routing. For example, the SPC5744PGK1AMMM9 enables Aurora LVDS and SIPI/LFAST interfaces on specific balls (e.g., G12–G15, H0–H1, M14–N15), which are reserved or unused in lower-memory variants like the MPC5743P. Pin compatibility must be verified per signal-level schematic review using the respective device-specific ballmaps.
SPC5744PGK1AMMM9 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5744PGK1AMMM9 FAQ
1.How can I place an order for SPC5744PGK1AMMM9 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5744PGK1AMMM9 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5744PGK1AMMM9 reliable?
The price and inventory of SPC5744PGK1AMMM9 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5744PGK1AMMM9 is usually 5 days.
3.What payment methods are accepted for SPC5744PGK1AMMM9?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5744PGK1AMMM9 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5744PGK1AMMM9?
SPC5744PGK1AMMM9 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5744PGK1AMMM9 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5744PGK1AMMM9?
For technical support, including SPC5744PGK1AMMM9 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5744PGK1AMMM9 requirements.
6.How does Aetrix verify that SPC5744PGK1AMMM9 is sourced from the original manufacturer or authorized distributors?
All SPC5744PGK1AMMM9 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5744PGK1AMMM9 meets industry standards.
7.What is the process for return or replacement of SPC5744PGK1AMMM9?
All SPC5744PGK1AMMM9 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5744PGK1AMMM9, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5744PGK1AMMM9 part is unused and in its original packaging.
Return procedure for SPC5744PGK1AMMM9:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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