NXP Semiconductors SPC5744PK1AMMM8
- Part No.:
- SPC5744PK1AMMM8
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
SPC5744PK1AMMM8.pdf
- Description:
- IC MCU 32B 2.5MB FLASH 257MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,876
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5744PK1AMMM8 from NXP Semiconductors is a 32-bit Power Architecture® MCU with dual e200z4 cores in delayed lock-step, certified for ISO 26262 ASIL-D chassis and safety-critical automotive applications. It integrates 2.5 MB ECC flash, 384 KB ECC SRAM, triple FlexCAN, dual FlexRay, Ethernet switching, and hardware fault collection (FCCU) - deployed in electric power steering, brake-by-wire, and ADAS domain controllers.
For engineers reviewing the SPC5744PK1AMMM8 datasheet, SPC5744PK1AMMM8 pinout, SPC5744PK1AMMM8 application, or SPC5744PK1AMMM8 equivalent, key selection criteria include ASIL-D compliance evidence, 150°C/165°C junction temperature rating, dual-core lock-step execution integrity, FCCU fault reporting latency, and 257-ball MAPBGA package thermal performance under automotive transient load conditions.
Technical Context
The SPC5744PK1AMMM8 implements a Harvard architecture with 8 KB instruction cache (EDC-protected) and 4 KB data cache (EDC-protected), supporting VLE instruction set and embedded FPU. Its clocking subsystem includes one PLL + one coupled FMPLL, 16 MHz internal RC oscillator, and external crystal support from 8–40 MHz.
Memory subsystem features RWW (Read-While-Write) capability across 2.5 MB code/data flash and supports overlay access from Flash Memory Controller to SRAM. Safety mechanisms include eDMA in delayed lock-step, System MPU (16 regions), Core MPU (24 regions), Error Injection Module (EIM), and Nexus Level 3+ debug with Aurora high-speed trace.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual e200z4 cores in delayed lock-step for ASIL-D fault containment |
| Flash Memory | 2.5 MB with ECC and RWW - enables safe firmware updates without halting real-time control |
| SRAM | 384 KB with ECC - protects critical runtime variables and stack against bit flips |
| Junction Temp | Rated for 150°C standard; optional 165°C variant confirmed in datasheet Rev. 6.1 |
| Automotive Safety | ISO 26262 ASIL-D compliant; includes FCCU, EIM, and lock-step eDMA for fault detection |
| Connectivity | 3× FlexCAN (64 msg buf each), 1× FlexRay (64 msg buf), Ethernet switch, 4× SPI, 2× SENT |
| ADC | 4× 12-bit ADC modules, 25 external channels total - supports multi-sensor redundancy |
Pinout & Package
SPC5744PK1AMMM8 uses a 257-ball MAPBGA package (0.8 mm pitch, 14 mm × 14 mm outline) optimized for automotive thermal and EMI performance. Pin functions are defined per SIUL2 MSCR/IMCR register configuration, with dedicated safety-critical pins including FCCU_F[0]/F[1], EXT_POR_B, RESET_B, and Nexus Aurora LVDS lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET_B | Functional Reset Input | Active-low asynchronous reset with weak pull-down; initiates full system reset sequence |
| EXT_POR_B | External Power-On Reset | Monitors external supply rail; triggers POR when HV_VDD_IO crosses threshold |
| FCCU_F[0], FCCU_F[1] | Fault Collection Unit Outputs | Dedicated pins reporting classified fault events (e.g., core lock-step mismatch, memory ECC error) |
| TX0P/TX0N, TX1P/TX1N | Nexus Aurora Trace Lanes | LVDS differential pairs for real-time, non-intrusive trace capture at >100 MHz |
| CLKP/CLKN | Aurora Clock Reference | Differential clock input for synchronizing high-speed trace data acquisition |
| VDD_HV_IO / VSS_HV_IO | I/O Power/Ground | High-voltage domain (3.3 V) for robust GPIO, CAN, LIN, and ADC digital interface operation |
Key Features
| Feature | Design Value |
|---|---|
| Delayed Lock-Step Dual Core | Hardware-enforced instruction-level comparison between two e200z4 cores eliminates undetected control-flow errors |
| Fault Control & Collection Unit (FCCU) | Real-time classification and reporting of faults (core, memory, peripheral, clock) with configurable response actions |
| RWW Flash with ECC | Enables concurrent execution and firmware update in safety-critical systems without interrupting control loops |
| Nexus Level 3+ with Aurora | Supports non-intrusive, time-stamped trace of program flow, data access, and exceptions for ASIL-D validation |
| Triple FlexCAN + Dual FlexRay | Redundant high-speed vehicle network interfaces meeting AUTOSAR-compliant chassis communication requirements |
| Integrated SGEN & SENT | 32-point sine-wave generator and 2× SENT receivers enable direct sensor excitation and analog signal digitization |
Applications
| Electric Power Steering (EPS) | Brake-by-Wire (BBW) |
|---|---|
Use Scenario: Real-time torque assist calculation, motor phase control, and fail-operational redundancy management in column-assist and rack-assist EPS systems. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-managed motor control algorithms with sub-100 µs loop timing. Use Value: Dual-core lock-step execution and FCCU fault reporting ensure <10−9 FIT failure rate required for EPS functional safety certification. |
Use Scenario: Closed-loop hydraulic pressure control, valve actuation sequencing, and cross-channel diagnostics in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety-critical actuator controller with deterministic FlexRay communication and hardware watchdog supervision. Use Value: Integrated FlexRay (dual channel, 64 msg buf) and 165°C junction rating support sustained operation under under-hood thermal stress. |
| ADAS Domain Controller | Vehicle Dynamics Control |
Use Scenario: Sensor fusion preprocessing, path planning coordination, and gateway routing between radar, camera, and ultrasonic subsystems. IC Role / Device Role / Timing Role: High-integrity domain manager interfacing via Ethernet switch and multiple CAN FD/FlexRay buses. Use Value: On-chip Ethernet switching and 3× FlexCAN reduce external PHY count while maintaining ASIL-D separation between domains. |
Use Scenario: Real-time yaw rate, lateral acceleration, and wheel speed correlation for stability control (ESC) and torque vectoring. IC Role / Device Role / Timing Role: Deterministic sensor acquisition hub with 4× 12-bit ADCs and synchronized eTimer capture for wheel speed measurement. Use Value: 25 external ADC channels with shared inputs allow redundant sensor sampling without additional external muxing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5746C | Higher flash (4 MB), added HSE crypto engine, same 257MAPBGA footprint but no 165°C option | Targeted at secure gateway and telematics; lacks SGEN and some SENT channels | Choose MPC5746C when cryptographic acceleration and larger code space outweigh need for analog waveform generation |
| SPC58EC80E5 | Tri-core (2× e200z7 + 1× e200z4), 8 MB flash, supports AUTOSAR OS 4.3+, different pinout (324LFBGA) | Designed for zonal architecture and central compute; not pin-compatible or drop-in | Choose SPC58EC80E5 for next-gen domain/zonal controllers requiring higher compute density and AUTOSAR 4.3+ |
Compared with MPC5746C and SPC58EC80E5, the SPC5744PK1AMMM8 delivers optimal balance of ASIL-D-certified dual-core lock-step integrity, integrated analog peripherals (SGEN/SENT/ADC), and thermal resilience (165°C option), making it uniquely suited for chassis-actuated safety systems where analog sensor excitation and deterministic timing dominate over raw compute throughput.
Availability
SPC5744PK1AMMM8 is available at Aetrix Electronics and suitable for electric power steering, brake-by-wire, and ADAS domain controllers requiring stable component supply across extended automotive product lifecycles.
Supply support for SPC5744PK1AMMM8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in functional safety and secure processing.
The SPC5744PK1AMMM8 belongs to NXP's SafeAssure portfolio of ASIL-D-certified MCUs, engineered specifically for chassis and safety-critical automotive systems demanding highest levels of hardware fault coverage and diagnostic completeness.
FAQ
What is the maximum junction temperature rating for SPC5744PK1AMMM8?
The SPC5744PK1AMMM8 is rated for a maximum junction temperature of 150°C as standard, with an optional 165°C variant explicitly documented in the MPC5744P Data Sheet Rev. 6.1. This higher rating enables deployment in under-hood locations with elevated ambient thermal loads, such as near electric power steering motors or brake calipers. The SPC5744PK1AMMM8 datasheet specifies derating curves and thermal impedance values to validate thermal design margins.
Does SPC5744PK1AMMM8 support ISO 26262 ASIL-D certification out of the box?
Yes, the SPC5744PK1AMMM8 is part of NXP's SafeAssure solution and provides hardware features required for ASIL-D compliance-including dual-core delayed lock-step execution, FCCU fault reporting, ECC on flash/SRAM, and Nexus Level 3+ debug. However, full ASIL-D certification requires integration into a validated safety framework, including software safety mechanisms and tool qualification. The SPC5744PK1AMMM8 itself meets the hardware-level requirements per ISO 26262 Part 5 Annex D.
What package type and ball count does SPC5744PK1AMMM8 use?
The SPC5744PK1AMMM8 uses a 257-ball MAPBGA package with 0.8 mm pitch and a 14 mm × 14 mm body outline. This package is thermally optimized for automotive under-hood environments and supports high I/O density for FlexRay, CAN, Ethernet, and analog interfaces. Pin assignments-including dedicated FCCU_F[0]/F[1], Nexus Aurora LVDS lanes, and safety-critical reset signals-are fully documented in the MPC5744P datasheet Figures 3 and Table 5.
How many FlexCAN modules does SPC5744PK1AMMM8 integrate, and what is their buffer capacity?
The SPC5744PK1AMMM8 integrates three independent FlexCAN modules, each supporting up to 64 message buffers. This enables simultaneous handling of multiple CAN FD networks-such as powertrain, chassis, and body domains-with hardware-based message filtering, prioritization, and timestamping. Each module supports programmable bit rates up to 5 Mbps and includes built-in loopback and self-test modes essential for ASIL-D diagnostics. All three modules are accessible and functional in the SPC5744PK1AMMM8.
Is SPC5744PK1AMMM8 pin-compatible with other MPC574xP variants like MPC5743P or MPC5742P?
No, the SPC5744PK1AMMM8 is not pin-compatible with MPC5743P or MPC5742P despite sharing the same 257MAPBGA package. Differences in peripheral enablement, pin multiplexing, and safety feature mapping mean that PCB layout cannot be reused across these variants. For example, FCCU_F[0] and FCCU_F[1] are assigned to specific balls (R2 and C4) only in the SPC5744PK1AMMM8, and Nexus Aurora LVDS functionality is disabled in lower-tier variants. Always verify pinout against the exact SPC5744PK1AMMM8 datasheet revision.
SPC5744PK1AMMM8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 180MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2.5MB (2.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 64x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5744PK1AMMM8 FAQ
1.How can I place an order for SPC5744PK1AMMM8 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5744PK1AMMM8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5744PK1AMMM8 reliable?
The price and inventory of SPC5744PK1AMMM8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5744PK1AMMM8 is usually 5 days.
3.What payment methods are accepted for SPC5744PK1AMMM8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5744PK1AMMM8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5744PK1AMMM8?
SPC5744PK1AMMM8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5744PK1AMMM8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5744PK1AMMM8?
For technical support, including SPC5744PK1AMMM8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5744PK1AMMM8 requirements.
6.How does Aetrix verify that SPC5744PK1AMMM8 is sourced from the original manufacturer or authorized distributors?
All SPC5744PK1AMMM8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5744PK1AMMM8 meets industry standards.
7.What is the process for return or replacement of SPC5744PK1AMMM8?
All SPC5744PK1AMMM8 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5744PK1AMMM8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5744PK1AMMM8 part is unused and in its original packaging.
Return procedure for SPC5744PK1AMMM8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5744PK1AMMM8 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

