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NXP Semiconductors SPC5745BBK1ACMH2

Part No.:
SPC5745BBK1ACMH2
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LFBGA
Datasheet:
AetrixSPC5745BBK1ACMH2.pdf
Description:
IC MCU 32BIT 2MB FLASH 100MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,141

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Product details

Overview

SPC5745BBK1ACMH2 from NXP Semiconductors is a dual-core Power Architecture® automotive microcontroller featuring an e200z4 CPU (160 MHz) and e200z2 CPU (80 MHz), 2 MB on-chip flash memory, 256 KB SRAM, and end-to-end ECC protection across buses and memories. It integrates eight FlexCAN3 modules with CAN FD support, four DSPI, four I²C, 16 LINFlexD, dual-channel FlexRay, and 10/100 Ethernet with AVB and IEEE 1588 support - deployed in engine control units and chassis domain controllers requiring ASIL-B functional safety compliance.

For engineers reviewing the SPC5745BBK1ACMH2 datasheet, SPC5745BBK1ACMH2 pinout, SPC5745BBK1ACMH2 application, or SPC5745BBK1ACMH2 equivalent, this page delivers verified technical context, validated pin assignments for the 256-pin MAPBGA package, real-world use cases in powertrain and vehicle networking, and two confirmed alternative parts with documented functional and packaging differences.

Technical Context

The SPC5745BBK1ACMH2 implements a crossbar switch architecture enabling concurrent access to flash, SRAM, and peripherals by multiple bus masters including dual e200 cores and eDMA. Its memory subsystem includes 2 MB flash with triple-port controller and RWW capability, plus 256 KB SRAM distributed across three ports with SMPU-enforced region-based protection (32 descriptors, 16-byte granularity).

Timing and safety infrastructure comprises FMPLL with frequency modulation, RTC, CMU clock monitoring, FCCU fault collection, HSMv2 security module, and ISO 26262 ASIL-B-certifiable subsystems including SWT, PIT, STM, and eMIOS - all operating under dual-voltage domains (1.2–1.32 V core / 3.3–5.5 V I/O) with integrated voltage regulation and LVD/HVD supervision.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores e200z4 @ 160 MHz + e200z2 @ 80 MHz; dual-issue and single-issue respectively, both supporting VLE for code density optimization
Flash Memory 2 MB on-chip flash with triple-port controller, RWW partitioning, and ECC-protected read/write/erase cycles
SRAM 256 KB distributed across three RAM ports with ECC and SMPU-controlled access granularity
Functional Safety ISO 26262 ASIL-B compliant; includes FCCU, SWT, PIT-RTI, STM, and hardware memory protection
Communication Peripherals 8 × FlexCAN3 (CAN FD capable), 4 × DSPI, 4 × I²C, 16 × LINFlexD, dual-channel FlexRay, ENET (MII/RMII + AVB + IEEE 1588)
Analog Subsystem 10-bit ADC (36 ch), 12-bit ADC (15 ch), 3 analog comparators, and Cross Trigger Unit for synchronized conversions
Package & Pin Count 256-pin MAPBGA (MJ package code); 178 GPIOs with configurable I/O domains for CAN, LIN, Ethernet, and general-purpose use

Pinout & Package

SPC5745BBK1ACMH2 is housed in a 256-ball MAPBGA (package code MJ), 15 mm × 15 mm, 0.8 mm pitch, RoHS-compliant, with thermal pad and standard JEDEC moisture sensitivity level (MSL3).

Pin/Terminal Circuit Role Design Meaning
VDD_HV_A / VDD_HV_B / VDD_HV_C High-voltage I/O supply inputs Independent 3.3 V or 5.0 V supplies for I/O banks; enable mixed-voltage operation across peripheral groups
VDD_LV Core logic supply input 1.2–1.32 V regulated supply for e200z4/z2 cores and internal logic; monitored by LVD/HVD circuits
FXOSC_IN / FXOSC_OUT Main crystal oscillator interface Supports 8–40 MHz external crystal; feeds FMPLL for system clock generation and jitter-sensitive timing
SXOSC_IN / SXOSC_OUT 32 kHz real-time clock crystal interface Drives RTC/API and low-power wake-up sources; operates during stop modes with minimal current draw
FMPLL_REFCLK FMPLL reference clock input Accepts external clock source (e.g., from FXOSC or FIRC) to configure PLL output frequencies up to 160 MHz
BOOT_CFG[2:0] Boot configuration selection Determines boot source (flash, SCI, CAN, etc.) at reset; latched during POR and used by Boot Assist Flash (BAF)
RESET_B Active-low reset input Asynchronous reset assertion; initiates full device reset sequence including BAF execution and core initialization
WKPU_IN[0:7] Wake-up input channels Eight dedicated pins for low-power mode wake-up via edge-triggered events; routed through WKPU controller

Key Features

Feature Design Value
End-to-End ECC SECDED (single error correction, double error detection) applied to all bus transactions - covering 64-bit data + 29-bit address - ensuring integrity across flash, SRAM, and peripheral interfaces
Dual-Core Asymmetric Architecture e200z4 handles high-performance tasks (e.g., real-time control loops), while e200z2 manages background services (e.g., diagnostics, communication stacks), reducing software complexity and improving determinism
Hardware Security Module v2 (HSMv2) Offloads cryptographic operations (AES-128/256, SHA-256, RSA-2048) and supports secure boot, key provisioning, and life-cycle management per PASS framework
Configurable I/O Domains Per-pin voltage domain assignment enables simultaneous 3.3 V CAN FD, 5 V LIN, and 1.8 V Ethernet PHY interfacing without level shifters
Multi-Queue Ethernet Complex ENET supports AVB traffic shaping, IEEE 1588 timestamping accuracy ±50 ns, and MII/RMII physical layer compatibility - critical for time-sensitive vehicle networking

Applications

Engine Control Unit (ECU) Chassis Domain Controller

Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel powertrains under transient load conditions.

IC Role / Device Role / Timing Role: Primary compute engine executing ASIL-B safety-critical control algorithms with deterministic interrupt latency ≤ 1 µs via INTC routing to e200z4 core.

Use Value: Dual-core separation isolates safety-critical control (z4) from non-safety diagnostics (z2), while 8 FlexCAN FD channels enable high-bandwidth sensor/actuator communication at 5 Mbps.

Use Scenario: Integrated brake-by-wire, steering assist, and suspension control coordinating multiple ECUs over high-speed CAN FD and FlexRay networks.

IC Role / Device Role / Timing Role: Central domain controller synchronizing actuator commands using STM timers and Cross Trigger Unit for sub-microsecond ADC/timer alignment.

Use Value: Dual-channel FlexRay (10 Mbps) provides deterministic, fault-tolerant communication for safety-critical chassis functions, backed by FCCU fault reporting and HSMv2 secure firmware updates.

Vehicle Gateway Module Advanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Protocol translation and firewalling between CAN FD, LIN, Ethernet, and FlexRay networks in zonal architectures.

IC Role / Device Role / Timing Role: Network bridge managing multi-protocol routing, message filtering, and secure OTA update distribution via ENET with AVB QoS and IEEE 1588 time synchronization.

Use Value: Integrated 10/100 Ethernet with multi-queue support enables concurrent diagnostic streaming, firmware download, and time-synced sensor fusion - eliminating external switch ICs.

Use Scenario: Aggregating radar, camera, and ultrasonic sensor data with preprocessing before forwarding to central ADAS ECU.

IC Role / Device Role / Timing Role: Sensor interface hub performing time-aligned sampling (via CTU), CRC validation, and CAN FD packetization of raw sensor streams.

Use Value: 12-bit ADC with 15 precision channels and programmable gain amplifiers enable direct connection to analog radar receivers, reducing BOM cost versus external signal conditioners.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5746C 3 MB flash, 384 KB SRAM, 8 FlexCAN FD, 324-BGA option; adds one eMIOS cluster and optional 512 KB RAM variant Targeted at higher-complexity domain controllers requiring larger code footprint and additional timer I/O resources Select MPC5746C when >2 MB flash or >256 KB SRAM is required; note 324-BGA package requires PCB redesign vs. SPC5745BBK1ACMH2's 256-BGA
SPC5744BK0MLU2 1.5 MB flash, 192 KB SRAM, 6 FlexCAN FD, 176-LQFP-EP package; lacks FlexRay and Ethernet Suitable for cost-sensitive body control modules or simpler powertrain nodes without high-speed networking Choose SPC5744BK0MLU2 for non-networked or LIN-only applications where BGA assembly is undesirable; no FlexRay/Ethernet support limits gateway use

Compared with SPC5745BBK1ACMH2, MPC5746C offers expanded memory and peripheral count for scalable domain control, while SPC5744BK0MLU2 reduces cost and complexity for entry-level automotive nodes - neither is pin-compatible, requiring layout changes and firmware adaptation.

Availability

SPC5745BBK1ACMH2 is available at Aetrix Electronics and suitable for engine control units, chassis domain controllers, vehicle gateway modules, and ADAS sensor hubs requiring stable component supply across automotive production lifecycles.

Supply support for SPC5745BBK1ACMH2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.

The SPC5745BBK1ACMH2 belongs to NXP's SPC57 family of Power Architecture® automotive MCUs, designed specifically for ASIL-B powertrain and chassis control applications demanding high reliability, real-time performance, and integrated safety mechanisms.

FAQ

What is the maximum operating frequency of the SPC5745BBK1ACMH2 e200z4 core?

The SPC5745BBK1ACMH2 e200z4 core operates at a maximum frequency of 160 MHz, as confirmed in the MPC5746C family datasheet Table 1 and supported by FMPLL configuration with FXOSC input. This frequency is achievable across the full –40°C to +125°C ambient temperature range under recommended operating conditions (VDD_LV = 1.2–1.32 V, VDD_HV = 3.3 V or 5 V). The SPC5745BBK1ACMH2 maintains timing closure and functional correctness at this rate with its 55 nm process node and optimized crossbar interconnect.

Does the SPC5745BBK1ACMH2 support CAN FD, and how many channels are available?

Yes, the SPC5745BBK1ACMH2 supports CAN FD on all eight FlexCAN3 modules, as explicitly stated in the "Communication" section of the MPC5746C datasheet and confirmed in Table 1 (Family Comparison) where MPC5745B/C variants list "8 with optional CAN FD support (FlexCAN[0:7])". Each channel operates up to 5 Mbps data phase and is independently configurable for protocol version, bit timing, and memory mapping - enabling concurrent high-bandwidth communication with multiple ECUs.

What package type and pin count does the SPC5745BBK1ACMH2 use?

The SPC5745BBK1ACMH2 uses a 256-ball MAPBGA package (package code MJ), measuring 15 mm × 15 mm with 0.8 mm ball pitch. This is verified in the "Family Comparison" section (Table 1) and "Ordering Information" (Section 3.2), where "MJ = 256 MAPBGA" is defined and assigned to MPC5745B/C variants. The package supports 178 GPIOs and includes thermal pad for enhanced power dissipation in automotive under-hood environments.

Is the SPC5745BBK1ACMH2 qualified for automotive applications, and what safety standard does it meet?

Yes, the SPC5745BBK1ACMH2 is automotive-qualified (S-grade) and meets ISO 26262 ASIL-B requirements for functional safety, as documented in the "Functional Safety" section of the MPC5746C datasheet and reinforced in Table 1 ("Safety level: Specific functions ASIL-B certifiable"). Its safety mechanisms include FCCU fault collection, hardware watchdog timers (SWT), memory protection (SMPU), and end-to-end ECC - all validated for use in engine control, transmission, and chassis systems.

What is the flash memory size and organization of the SPC5745BBK1ACMH2?

The SPC5745BBK1ACMH2 contains 2 MB of on-chip flash memory, organized into ten 256 KB blocks (Flash blocks 0–9), with blocks 0–3 always available and blocks 4–5 available per Table 2 (MPC5745B column). It features triple-port flash memory controller, RWW (Read-While-Write) capability, and ECC protection for program/erase cycles - enabling robust in-field firmware updates and EEPROM emulation up to 64 KB as specified in the family comparison tables.

SPC5745BBK1ACMH2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LFBGA
Series:
MPC57xx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals:
DMA, I2S, POR, WDT
Number of I/O:
-
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5745BBK1ACMH2 FAQ

1.How can I place an order for SPC5745BBK1ACMH2 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5745BBK1ACMH2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5745BBK1ACMH2 reliable?

The price and inventory of SPC5745BBK1ACMH2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5745BBK1ACMH2 is usually 5 days.

3.What payment methods are accepted for SPC5745BBK1ACMH2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5745BBK1ACMH2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5745BBK1ACMH2?

SPC5745BBK1ACMH2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5745BBK1ACMH2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5745BBK1ACMH2?

For technical support, including SPC5745BBK1ACMH2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5745BBK1ACMH2 requirements.

6.How does Aetrix verify that SPC5745BBK1ACMH2 is sourced from the original manufacturer or authorized distributors?

All SPC5745BBK1ACMH2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5745BBK1ACMH2 meets industry standards.

7.What is the process for return or replacement of SPC5745BBK1ACMH2?

All SPC5745BBK1ACMH2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5745BBK1ACMH2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5745BBK1ACMH2 part is unused and in its original packaging.

Return procedure for SPC5745BBK1ACMH2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5745BBK1ACMH2 Tags

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