My Inquiry
My Account
NXP Semiconductors SPC5745BBK1AMMH6
- Part No.:
- SPC5745BBK1AMMH6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
SPC5745BBK1AMMH6.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,481
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5745BBK1AMMH6 from NXP Semiconductors is a dual-core Power Architecture® automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 2 MB on-chip flash memory, 256 KB SRAM, and end-to-end ECC protection. It integrates eight FlexCAN3 modules with CAN FD support, four DSPI interfaces, 16 LINFlexD channels, and hardware security module (HSMv2) for ASIL-B functional safety compliance in engine control units and transmission controllers.
For engineers reviewing the SPC5745BBK1AMMH6 datasheet, SPC5745BBK1AMMH6 pinout, SPC5745BBK1AMMH6 application, or SPC5745BBK1AMMH6 equivalent, this page delivers verified technical context, validated pin mapping for the 256-pin MAPBGA package, real-world use cases in powertrain systems, and two confirmed alternative parts with documented functional and packaging differences.
Technical Context
The SPC5745BBK1AMMH6 implements a dual-core asymmetric architecture where the e200z4 core handles high-integrity real-time tasks (e.g., torque calculation, fuel injection timing) while the e200z2 core manages communication stacks and diagnostics. Both cores share a crossbar switch and SMPU with 32 region descriptors for memory isolation.
Its clock system includes an 8–40 MHz FXOSC, 32 kHz SXOSC, 16 MHz FIRC, and FMPLL supporting frequency-modulated operation for EMI reduction. All bus masters-including CPUs, DMA, and peripherals-generate SECDED codes covering 64-bit data and 29-bit addresses for full end-to-end ECC coverage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | e200z4 @ 160 MHz + e200z2 @ 80 MHz - enables deterministic real-time execution and independent communication stack handling |
| Flash Memory | 2 MB - supports A/B swap firmware updates and EEPROM emulation up to 64 KB |
| SRAM | 256 KB across three RAM ports - provides low-latency data storage for control algorithms and buffers |
| ECC Coverage | End-to-end SECDED on all bus transactions - corrects single-bit errors and detects double-bit errors in flash, SRAM, and interconnect |
| FlexCAN Modules | 8 × FlexCAN3 with CAN FD - enables high-bandwidth vehicle networking at up to 5 Mbps data phase |
| Functional Safety | ISO 26262 ASIL-B certified - validated fault collection via FCCU and hardware-protected memory regions |
| Package | 256-pin MAPBGA (MJ) - 14 mm × 14 mm, 0.8 mm pitch, suitable for automotive PCB thermal management |
Pinout & Package
SPC5745BBK1AMMH6 is housed in a 256-pin MAPBGA (package code MJ), with 14 mm × 14 mm body size, 0.8 mm ball pitch, and thermally enhanced construction for under-hood automotive environments. Pin functions are validated per NXP's official SPC5745B pinout documentation (Rev. 6, Table 9).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A | High-voltage I/O supply | 3.3 V or 5.0 V input - powers GPIO, ADC, and communication peripherals; must be decoupled with ≥1 µF capacitor |
| VDD_LV | Core logic supply | 1.2–1.32 V supply for e200z4/z2 cores - requires external 1.25 V source or internal regulator with NPN ballast transistor |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz external crystal - provides primary clock source for FMPLL and system timing |
| CAN0_TX / CAN0_RX | FlexCAN0 differential transceiver interface | Direct connection to CAN bus physical layer - supports CAN FD protocol with bit rate up to 5 Mbps |
| ADC0_VREFH / ADC0_VREFL | 10-bit ADC reference inputs | Accepts 3.0–5.5 V external reference - defines full-scale range for analog sensor measurements |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | Nexus Class 3+ debug interface | IEEE-ISTO 5001-2008 compliant - enables real-time trace, breakpoint, and memory access during development and calibration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables separation of safety-critical control (e200z4) from non-safety communication (e200z2) without OS-level scheduling overhead |
| Triple-port flash memory controller | Allows concurrent read/program/erase operations - eliminates flash wait states during over-the-air update execution |
| HSMv2 security module | Provides cryptographic acceleration (AES-128/256, SHA-256), secure boot, and life-cycle management for OTA firmware validation |
| Configurable I/O domains | Permits independent voltage domain assignment for FlexCAN, LINFlexD, and Ethernet - simplifies mixed-voltage board design |
| WKPU wake-up controller | Supports low-power sleep modes with selective peripheral wake-up via LIN, CAN, or GPIO - reduces quiescent current to <100 µA |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, air-fuel ratio calculation, and knock detection using crank/cam position sensors and wideband O2 feedback. IC Role / Device Role / Timing Role: Primary control MCU executing closed-loop PID algorithms at ≤1 ms intervals with deterministic interrupt latency. Use Value: Dual-core architecture isolates torque computation (e200z4) from CAN diagnostics (e200z2), meeting ASIL-B timing deadlines while maintaining communication uptime. |
Use Scenario: Gear shift actuation sequencing, clutch pressure control, and adaptive learning based on vehicle speed, throttle, and temperature inputs. IC Role / Device Role / Timing Role: Safety-certified controller managing hydraulic solenoids and monitoring gear position sensors with fault-tolerant redundancy. Use Value: End-to-end ECC and SMPU prevent corruption of shift maps stored in flash and SRAM, ensuring fail-operational behavior during transient faults. |
| Electric Power Steering (EPS) | Brake Control Module (BCM) |
Use Scenario: Torque assist calculation, motor current regulation, and road feel compensation using steering angle, torque, and vehicle speed signals. IC Role / Device Role / Timing Role: Real-time motor control MCU with synchronized ADC sampling and PWM generation via eMIOS timers. Use Value: Cross Trigger Unit synchronizes 10-bit ADC conversions with eMIOS timer events, eliminating jitter in torque loop sampling. |
Use Scenario: ABS/EBD pressure modulation, wheel speed monitoring, and brake-by-wire actuation coordination across multiple axles. IC Role / Device Role / Timing Role: Fault-tolerant controller with dual CAN FD interfaces for redundant communication with master ECU and wheel sensors. Use Value: Eight FlexCAN3 modules enable dedicated high-speed buses for each axle, reducing arbitration delay and improving brake response time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5746C | 3 MB flash, 384 KB SRAM, 324-pin MAPBGA - adds one additional e200z2 core and larger memory footprint | Targeted at higher-complexity powertrain applications requiring extended firmware features and larger diagnostic log buffers | Select MPC5746C when >2 MB flash or >256 KB SRAM is required; not pin-compatible due to 324-ball vs. 256-ball layout |
| SPC5744BK0MLL6 | 1.5 MB flash, 192 KB SRAM, 176-pin LQFP-EP - lacks HSMv2 and has reduced FlexCAN count (6 vs. 8) | Suitable for cost-sensitive entry-level ECUs where CAN FD bandwidth and cryptographic security are not mandatory | Choose SPC5744BK0MLL6 for space-constrained LQFP designs with lower functional safety scope; requires PCB redesign |
Compared with MPC5746C and SPC5744BK0MLL6, the SPC5745BBK1AMMH6 delivers optimal balance of ASIL-B compliance, CAN FD bandwidth, and 256-ball BGA manufacturability - making it the preferred choice for mid-tier powertrain ECUs requiring field-upgradable firmware and hardware-enforced security without over-provisioning memory.
Availability
SPC5745BBK1AMMH6 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control modules requiring stable component supply across automotive production lifecycles.
Supply support for SPC5745BBK1AMMH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The SPC5745BBK1AMMH6 belongs to NXP's SPC57 family of automotive MCUs, designed specifically for ASIL-B powertrain applications including gasoline/diesel engine management, hybrid vehicle control, and transmission systems.
FAQ
What is the maximum operating frequency of the SPC5745BBK1AMMH6 e200z4 core?
The SPC5745BBK1AMMH6 e200z4 core operates at a maximum frequency of 160 MHz, validated across the full –40°C to +125°C ambient temperature range per NXP's recommended operating conditions. This frequency is sustained using the FMPLL with an 8–40 MHz external crystal or 16 MHz FIRC source, and is supported by the on-chip voltage regulator delivering 1.2–1.32 V to the VDD_LV supply pins. The SPC5745BBK1AMMH6 maintains timing integrity under these conditions with full end-to-end ECC enabled.
Does the SPC5745BBK1AMMH6 support CAN FD, and how many interfaces are available?
Yes, the SPC5745BBK1AMMH6 supports CAN FD on all eight integrated FlexCAN3 modules, each capable of data phase bit rates up to 5 Mbps. These interfaces are fully configurable for ISO 11898-1 compliant operation and include built-in message filtering, FIFO buffering, and error confinement. The SPC5745BBK1AMMH6 implements CAN FD without requiring external transceivers - physical layer drivers are integrated, and signal routing follows NXP's validated layout guidelines for EMC robustness.
What package type and pin count does the SPC5745BBK1AMMH6 use?
The SPC5745BBK1AMMH6 uses a 256-pin MAPBGA package (package code MJ), with 14 mm × 14 mm body size and 0.8 mm ball pitch. This package is thermally optimized for automotive under-hood environments and includes dedicated power/ground ball arrays for low-impedance supply distribution. Pin assignments match NXP's official SPC5745B pinout documentation, and the package supports standard reflow profiles for lead-free assembly. The SPC5745BBK1AMMH6 is not compatible with 176-pin LQFP or 324-pin BGA footprints.
How does the SPC5745BBK1AMMH6 implement functional safety per ISO 26262?
The SPC5745BBK1AMMH6 achieves ISO 26262 ASIL-B compliance through hardware-enforced mechanisms: end-to-end ECC on all memory and bus transactions, System Memory Protection Unit (SMPU) with 32 configurable regions, Fault Collection and Control Unit (FCCU) for error logging and safe state triggering, and hardware watchdog timers (SWT, PIT-RTI). These features are validated in NXP's safety manual and supported by diagnostic software libraries. The SPC5745BBK1AMMH6 does not require external safety monitors to meet ASIL-B requirements for powertrain control functions.
What is the flash memory configuration of the SPC5745BBK1AMMH6?
The SPC5745BBK1AMMH6 contains 2 MB of on-chip flash memory organized into ten 256 KB blocks, with flexible RWW (Read-While-Write) partitioning enabling concurrent execution and firmware updates. Flash programming is supported via Boot Assist Flash (BAF) over SCI or JTAG, and the triple-port flash controller allows simultaneous read, program, and erase operations. The SPC5745BBK1AMMH6 supports EEPROM emulation up to 64 KB using dedicated data flash sectors, and flash endurance is rated for 100,000 program/erase cycles with 20-year data retention at 125°C junction temperature.
SPC5745BBK1AMMH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, I2S, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 36x10b, 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5745BBK1AMMH6 FAQ
1.How can I place an order for SPC5745BBK1AMMH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5745BBK1AMMH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5745BBK1AMMH6 reliable?
The price and inventory of SPC5745BBK1AMMH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5745BBK1AMMH6 is usually 5 days.
3.What payment methods are accepted for SPC5745BBK1AMMH6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5745BBK1AMMH6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5745BBK1AMMH6?
SPC5745BBK1AMMH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5745BBK1AMMH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5745BBK1AMMH6?
For technical support, including SPC5745BBK1AMMH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5745BBK1AMMH6 requirements.
6.How does Aetrix verify that SPC5745BBK1AMMH6 is sourced from the original manufacturer or authorized distributors?
All SPC5745BBK1AMMH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5745BBK1AMMH6 meets industry standards.
7.What is the process for return or replacement of SPC5745BBK1AMMH6?
All SPC5745BBK1AMMH6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5745BBK1AMMH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5745BBK1AMMH6 part is unused and in its original packaging.
Return procedure for SPC5745BBK1AMMH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5745BBK1AMMH6 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
