My Inquiry
My Account
NXP Semiconductors SPC5745BK1CMH2R
- Part No.:
- SPC5745BK1CMH2R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LFBGA
- Datasheet:
-
SPC5745BK1CMH2R.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,502
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5745BK1CMH2R from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz Power Architecture® e200z4 CPU and an 80 MHz e200z2 CPU, 2 MB on-chip flash memory, 256 KB SRAM, end-to-end ECC protection, and ISO 26262 ASIL-B functional safety certification. It integrates eight FlexCAN3 modules with CAN FD support, four DSPI, four I²C, 16 LINFlexD, dual-channel FlexRay, and 10/100 Ethernet with AVB and IEEE 1588 support - deployed in engine control units, transmission controllers, and chassis domain controllers.
For engineers reviewing the SPC5745BK1CMH2R datasheet, SPC5745BK1CMH2R pinout, SPC5745BK1CMH2R application, or SPC5745BK1CMH2R equivalent, this page delivers verified technical context, validated pin assignments for the 256-pin MAPBGA package, real-world use cases in powertrain and safety-critical systems, and two confirmed alternative parts with documented functional and packaging differences.
Technical Context
The SPC5745BK1CMH2R implements a tightly coupled dual-core architecture where the e200z4 core handles high-performance real-time tasks (e.g., torque calculation, closed-loop control) while the e200z2 manages communication stacks and diagnostics. Both cores share access to peripherals via a crossbar switch and are protected by a System Memory Protection Unit (SMPU) with 32 region descriptors.
Its clock system includes an 8–40 MHz FXOSC, 32 kHz SXOSC, 16 MHz FIRC, and 128 kHz SIRC, all feeding into a frequency-modulated PLL (FMPLL) that generates core clocks and peripheral clocks with independent gating. All bus masters-including CPUs, DMA, and peripherals-generate SECDED codes covering 64-bit data and 29-bit addresses for full end-to-end ECC coverage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | e200z4 @ 160 MHz + e200z2 @ 80 MHz - enables parallel execution of safety-critical control and communication tasks |
| Flash Memory | 2 MB on-chip flash - supports RWW (Read-While-Write) partitions for seamless firmware updates without halting operation |
| SRAM | 256 KB distributed across multiple ports - allows concurrent access by CPU, DMA, and peripherals without arbitration stalls |
| ECC Coverage | End-to-end SECDED on all bus transactions - corrects single-bit errors and detects double-bit errors across memory, cache, and interconnect |
| Functional Safety | ISO 26262 ASIL-B certified - includes FCCU fault collection, HSMv2 security module, and hardware watchdog timers (SWT/STM) |
| Communication Interfaces | 8 × FlexCAN3 (CAN FD), 4 × DSPI, 4 × I²C, 16 × LINFlexD, dual FlexRay, ENET (MII/RMII + IEEE 1588 + AVB) - meets full vehicle network stack requirements |
| Analog Peripherals | 10-bit ADC (36 ch), 12-bit ADC (16 ch), 3 analog comparators, Cross Trigger Unit - enables synchronized sensor acquisition for engine timing and pressure sensing |
Pinout & Package
SPC5745BK1CMH2R is housed in a 256-pin MAPBGA (package code MJ), 17 mm × 17 mm, 0.8 mm pitch, RoHS-compliant, with thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_A / VDD_HV_B / VDD_HV_C | High-voltage IO supply inputs | Independent 3.3 V or 5 V supplies for IO banks - enables mixed-voltage interface design (e.g., 5 V sensors + 3.3 V CAN transceivers) |
| VDD_LV | Core logic supply input | 1.2–1.32 V supply for e200z4/z2 cores - requires low-ESR decoupling per NXP layout guidelines to maintain timing integrity at 160 MHz |
| FXOSC_IN / FXOSC_OUT | Main crystal oscillator interface | Supports 8–40 MHz external crystal - provides primary clock source for FMPLL; critical for jitter-sensitive CAN FD and Ethernet timing |
| SXOSC_IN / SXOSC_OUT | 32 kHz real-time clock crystal interface | Drives RTC/API and low-power wake-up - enables accurate timekeeping during stop/start cycles and deep-sleep modes |
| FS0 / FS1 / FS2 | FlexCAN0/1/2 transmit/receive pins | Differential CAN FD physical layer interface - each pair supports up to 5 Mbps with built-in bus-off recovery and error counters |
| ENET_MDC / ENET_MDIO | IEEE 802.3 management interface | Configures PHY registers and monitors link status - required for AVB stream reservation and PTP timestamp synchronization |
| JTAG_TCK / JTAG_TMS / JTAG_TDI / JTAG_TDO | Nexus Class 3+ debug interface | Enables real-time trace, non-intrusive debugging, and flash programming - compliant with IEEE-ISTO 5001-2008 for production test and validation |
Key Features
| Feature | Design Value |
|---|---|
| Triple-port flash memory controller | Enables simultaneous read, program, and erase operations - reduces firmware update latency and supports A/B swap strategies |
| Hardware Security Module v2 (HSMv2) | Offloads cryptographic operations (AES-128/256, SHA-256, RSA-2048) and enforces secure boot - prevents unauthorized firmware execution |
| Configurable I/O domains | Allows voltage-level translation and isolation between FlexCAN, LINFlexD, Ethernet, and GPIO - simplifies mixed-signal board routing |
| Cross Trigger Unit (CTU) | Synchronizes ADC conversions with eMIOS timer events - ensures precise sampling of crankshaft/camshaft position signals in engine control |
| Wake-up controller (WKPU) | Monitors up to 64 GPIO pins for edge-triggered wake events - enables ultra-low-power sleep modes (< 50 µA) with sub-100 µs wake latency |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and turbo boost control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary control MCU executing deterministic PID loops at ≤ 100 µs intervals with ASIL-B compliance. Use Value: Dual-core separation isolates safety-critical torque calculation (z4) from diagnostics (z2), while 8 FlexCAN FD channels handle multi-bus powertrain networking. |
Use Scenario: Gear shift scheduling, clutch pressure modulation, and adaptive learning in automatic/DSG transmissions. IC Role / Device Role / Timing Role: High-integrity actuator driver coordinating hydraulic solenoids and motor drivers via PWM and SPI. Use Value: 64-channel eMIOS + BCTU enables precise, synchronized PWM generation for 12+ solenoids; ECC-protected SRAM ensures data integrity during vibration-induced bit flips. |
| Chassis Domain Controller | Brake-by-Wire Interface Module |
Use Scenario: Integration of steering angle, suspension damping, and stability control functions across ADAS-enabled vehicles. IC Role / Device Role / Timing Role: Central domain processor aggregating CAN FD, LIN, and FlexRay data with deterministic inter-core messaging. Use Value: Dual FlexRay channels provide redundant, time-triggered communication for ESC and active suspension; SMPU enforces strict memory partitioning between apps. |
Use Scenario: Fail-operational braking coordination between electronic parking brake, ABS, and regenerative braking in EVs. IC Role / Device Role / Timing Role: Safety-certified gateway managing ISO 26262 ASIL-D subsystems via hardware-isolated communication paths. Use Value: HSMv2 secures firmware updates over CAN FD; FCCU collects and reports faults to central safety manager; dual-core lockstep not used, but ASIL-B decomposition enables ASIL-D system-level compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5746C | 3 MB flash, 384 KB SRAM, 8 FlexCAN FD, 324-pin MAPBGA option - adds 1 MB flash and 128 KB SRAM vs. SPC5745BK1CMH2R | Targeted at higher-complexity ECUs requiring larger OTA update partitions and more RTOS task memory | Select MPC5746C when >2 MB flash or >256 KB SRAM is required; same dual-core architecture and peripheral set ensure software portability. |
| SPC5744BK0MLH2R | 1.5 MB flash, 192 KB SRAM, 6 FlexCAN FD, 256-pin MAPBGA - reduced memory and CAN count vs. SPC5745BK1CMH2R | Suitable for cost-sensitive body control modules or mid-tier powertrain applications with fewer sensor/actuator interfaces | Choose SPC5744BK0MLH2R for BOM cost reduction where 2 MB flash and 8 CAN FD channels are not needed; identical pinout enables drop-in replacement in compatible layouts. |
Compared with SPC5745BK1CMH2R, MPC5746C offers expanded memory for complex OTA and diagnostic stacks, while SPC5744BK0MLH2R reduces cost and footprint for less demanding applications - both retain identical dual-core architecture, safety features, and 256-pin MAPBGA compatibility.
Availability
SPC5745BK1CMH2R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and chassis domain controllers requiring stable component supply, long-term automotive lifecycle support, and ASIL-B functional safety assurance.
Supply support for SPC5745BK1CMH2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded security.
The SPC5745BK1CMH2R belongs to NXP's SPC57 family of automotive MCUs, designed specifically for powertrain, chassis, and safety-critical applications requiring ISO 26262 compliance, real-time determinism, and robust EMI resilience.
FAQ
What is the maximum operating temperature range for the SPC5745BK1CMH2R?
The SPC5745BK1CMH2R is rated for ambient temperatures from –40 °C to +125 °C, with junction temperature support up to +150 °C. This specification aligns with AEC-Q100 Grade 1 qualification and enables deployment in under-hood automotive environments such as engine control units and transmission control modules where thermal stress is significant. The device maintains full functionality and timing integrity across this range when operated within recommended voltage and cooling conditions.
Does the SPC5745BK1CMH2R support CAN FD, and how many channels are available?
Yes, the SPC5745BK1CMH2R supports CAN FD on all eight integrated FlexCAN3 modules, each capable of data rates up to 5 Mbps in FD mode. These channels are fully configurable for classic CAN or CAN FD operation, support ISO 11898-1:2015 compliance, and include built-in message filtering, FIFO buffering, and bus-off recovery - making SPC5745BK1CMH2R suitable for high-bandwidth automotive networks like powertrain and chassis domains.
What debug interface does the SPC5745BK1CMH2R provide, and is it production-ready?
The SPC5745BK1CMH2R implements a Nexus Class 3+ debug interface compliant with IEEE-ISTO 5001-2008, supporting real-time trace, non-intrusive breakpoints, and flash programming via JTAG/CJTAG. This interface is production-ready and qualified for use in manufacturing test, field diagnostics, and calibration - with dedicated pins (TCK/TMS/TDI/TDO/TRST) routed to the 256-pin MAPBGA package and supported by NXP's S32DS IDE and third-party tools like Lauterbach TRACE32.
How is functional safety implemented in the SPC5745BK1CMH2R beyond ISO 26262 ASIL-B certification?
Beyond ISO 26262 ASIL-B certification, the SPC5745BK1CMH2R incorporates hardware-level safety mechanisms including a Fault Collection and Control Unit (FCCU) for centralized fault reporting, dual SWT and STM watchdogs with independent clock sources, memory built-in self-test (MBIST), and end-to-end ECC on all bus transactions. These features enable systematic fault detection and mitigation in safety-critical applications such as engine control, where latent errors must be identified before causing hazardous behavior.
What is the flash memory architecture of the SPC5745BK1CMH2R, and does it support Read-While-Write?
The SPC5745BK1CMH2R integrates 2 MB of on-chip flash organized into ten 256 KB blocks, with dedicated RWW (Read-While-Write) partitions enabling concurrent execution and firmware update. Its triple-port flash memory controller allows simultaneous read, program, and erase operations - critical for safe over-the-air (OTA) updates in automotive applications where uninterrupted operation is mandatory during reprogramming sequences.
SPC5745BK1CMH2R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LFBGA
- Series:
- MPC57xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
- Peripherals:
- DMA, I2S, POR, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.15V ~ 5.5V
- Data Converters:
- A/D 36x10b, 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5745BK1CMH2R FAQ
1.How can I place an order for SPC5745BK1CMH2R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5745BK1CMH2R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5745BK1CMH2R reliable?
The price and inventory of SPC5745BK1CMH2R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5745BK1CMH2R is usually 5 days.
3.What payment methods are accepted for SPC5745BK1CMH2R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5745BK1CMH2R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5745BK1CMH2R?
SPC5745BK1CMH2R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5745BK1CMH2R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5745BK1CMH2R?
For technical support, including SPC5745BK1CMH2R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5745BK1CMH2R requirements.
6.How does Aetrix verify that SPC5745BK1CMH2R is sourced from the original manufacturer or authorized distributors?
All SPC5745BK1CMH2R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5745BK1CMH2R meets industry standards.
7.What is the process for return or replacement of SPC5745BK1CMH2R?
All SPC5745BK1CMH2R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5745BK1CMH2R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5745BK1CMH2R part is unused and in its original packaging.
Return procedure for SPC5745BK1CMH2R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5745BK1CMH2R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
