NXP Semiconductors SPC5745CBK1AMMJ6

Overview

SPC5745CBK1AMMJ6 from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 2 MB on-chip flash memory, 256 KB SRAM, and end-to-end ECC protection across all bus masters. It integrates eight FlexCAN3 modules with CAN FD support, four DSPI interfaces, 16 LINFlexD channels, and hardware security module (HSMv2) for ASIL-B functional safety compliance in engine control units and transmission controllers.

For engineers reviewing the SPC5745CBK1AMMJ6 datasheet, SPC5745CBK1AMMJ6 pinout, SPC5745CBK1AMMJ6 application, or SPC5745CBK1AMMJ6 equivalent, this page delivers verified technical context, validated pin-level design meaning, real-world automotive use cases, and two confirmed alternative parts with documented functional and packaging differences - all grounded in NXP's MPC5746C family documentation and ordering data.

Technical Context

The SPC5745CBK1AMMJ6 implements a dual-core Power Architecture® architecture with asymmetric processing: the e200z4 core handles high-integrity real-time tasks (e.g., torque calculation, safety monitoring) at 160 MHz with single-precision floating-point unit and VLE encoding, while the e200z2 core manages communication stacks and diagnostics at 80 MHz. Both cores share a crossbar switch enabling concurrent access to peripherals, flash, and RAM.

It features full end-to-end ECC (SECDED) over 64-bit data + 29-bit address paths, SMPU with 32 region descriptors, and integrated HSMv2 supporting secure boot, cryptographic acceleration, and life-cycle management. Clocking includes FMPLL, FXOSC (8–40 MHz), SXOSC (32 kHz), FIRC (16 MHz), and SIRC (128 kHz), with CMU and RTC for robust timing integrity.

Key Specifications

Pinout & Package

SPC5745CBK1AMMJ6 is housed in a 256-ball MAPBGA (package code MJ), with 17 mm × 17 mm footprint, 0.8 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in engine bay applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Compared with MPC5746C, SPC5745CBK1AMMJ6 reduces flash/SRAM capacity but retains identical dual-core architecture, peripheral set, and safety features - making it ideal for cost-sensitive ICE ECUs. Against SPC5744KBK1AMMJ6, it adds HSMv2 and two extra CAN FD channels, enabling scalable security and diagnostics without layout revision.

Availability

SPC5745CBK1AMMJ6 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply, long-term automotive qualification, and ASIL-B functional safety compliance.

Supply support for SPC5745CBK1AMMJ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded security.

The SPC5745CBK1AMMJ6 belongs to NXP's SPC574x automotive MCU family, designed specifically for ASIL-B powertrain and chassis control applications demanding high computational throughput, hardware-enforced safety, and integrated security.

FAQ

What is the maximum operating frequency of the SPC5745CBK1AMMJ6's primary CPU core?

The SPC5745CBK1AMMJ6 features a 160 MHz e200z4 Power Architecture® core as its primary CPU, delivering deterministic real-time performance for safety-critical engine and transmission control algorithms. This frequency is fully supported across the device's qualified temperature range (–40°C to +125°C) and is validated in NXP's MPC5746C family datasheet Rev. 6. The SPC5745CBK1AMMJ6 maintains this speed without derating under automotive thermal conditions.

Does the SPC5745CBK1AMMJ6 support CAN FD, and how many channels are available?

Yes, the SPC5745CBK1AMMJ6 supports CAN FD on all eight integrated FlexCAN3 modules, each capable of up to 5 Mbps data phase operation. This is confirmed in the MPC5746C family comparison table and block diagram, where "All FlexCANs optionally support CAN FD" applies to all derivatives including SPC5745C. The SPC5745CBK1AMMJ6 uses the same silicon as MPC5746C with flash/RAM configuration trimmed to 2 MB/256 KB.

What package type and pin count does the SPC5745CBK1AMMJ6 use?

The SPC5745CBK1AMMJ6 uses a 256-ball MAPBGA package (package code MJ), measuring 17 mm × 17 mm with 0.8 mm ball pitch. This is explicitly defined in NXP's ordering information section: "MJ = 256 MAPBGA". The package supports automotive thermal requirements and provides full access to all peripherals, including eight CAN FD channels, 16 LINFlexD interfaces, and Ethernet RMII/MII signals.

Is hardware security (HSM) included in the SPC5745CBK1AMMJ6?

Yes, the SPC5745CBK1AMMJ6 includes the Hardware Security Module version 2 (HSMv2), as confirmed in the MPC5746C family feature list and Table 1 comparison. HSMv2 provides AES-128/256, SHA-256, RSA-2048 acceleration, secure boot, and key provisioning - enabling UDS security access and ASIL-B-compliant life-cycle management. The "S" in the part number suffix denotes HSM inclusion.

What is the flash memory size and organization of the SPC5745CBK1AMMJ6?

The SPC5745CBK1AMMJ6 contains 2 MB of on-chip flash memory organized into ten 256 KB blocks (0x01000000–0x011FFFFF), with RWW (Read-While-Write) capability and emulated EEPROM support up to 64 KB. This configuration is specified in Table 2 ("MPC5745C" column) of the MPC5746C datasheet and matches the "5" in the part number (Flash Size = 5 → 2 MB).