NXP Semiconductors SPC5746BSK1AMMH6

Overview

SPC5746BSK1AMMH6 from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 3 MB on-chip flash memory, 384 KB SRAM with end-to-end ECC, and integrated FlexCAN FD, Ethernet AVB, and HSMv2 security module. It targets ASIL-B compliant powertrain and chassis control units requiring deterministic real-time performance, functional safety, and secure boot.

For engineers reviewing the SPC5746BSK1AMMH6 datasheet, SPC5746BSK1AMMH6 pinout, SPC5746BSK1AMMH6 application, or SPC5746BSK1AMMH6 equivalent, this page delivers verified technical context, validated pin mapping for the 256-pin MAPBGA package, confirmed safety and communication interface specifications, and two rigorously cross-checked alternative parts for automotive ECU design.

Technical Context

The SPC5746BSK1AMMH6 implements a dual-core Power Architecture® system with tightly coupled crossbar interconnect enabling concurrent access to flash, RAM, and peripherals by both CPUs. Its FMPLL supports multiple clock domains including 8–40 MHz FXOSC, 32 kHz SXOSC, and internal FIRC/SIRC oscillators, all monitored by the Clock Monitor Unit (CMU).

Functional safety is enforced via ISO 26262 ASIL-B certified hardware: System Memory Protection Unit (SMPU) with 32 region descriptors, Fault Collection and Control Unit (FCCU), and hardware-enforced memory isolation between cores and peripherals. The HSMv2 module provides cryptographic acceleration and life-cycle management per PASS security framework.

Key Specifications

Pinout & Package

SPC5746BSK1AMMH6 is housed in a 256-pin MAPBGA package (package code MJ), measuring 17 mm × 17 mm × 1.2 mm, with 0.8 mm ball pitch and Pb-free/NiPdAu finish. Thermal pad exposed on underside for enhanced heat dissipation in automotive under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core automotive microcontroller applications.

Compared with SPC5746BSK1AMMH6, MPC5746CK1AMMH6 offers identical functionality with formal automotive qualification, while SPC5744BK0MLU6 sacrifices safety architecture, networking capability, and memory capacity to reduce cost and package size - making it viable only for lower-complexity ASIL-A applications.

Availability

SPC5746BSK1AMMH6 is available at Aetrix Electronics and suitable for engine control units, brake control modules, vehicle gateway systems, and electric power steering designs requiring stable component supply across automotive production lifecycles.

Supply support for SPC5746BSK1AMMH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded security.

The SPC5746BSK1AMMH6 belongs to NXP's SPC57 family of automotive MCUs, designed specifically for ASIL-B and ASIL-D powertrain, chassis, and advanced driver assistance systems requiring high-integrity real-time processing and hardware-enforced security.

FAQ

What is the core architecture of the SPC5746BSK1AMMH6?

The SPC5746BSK1AMMH6 integrates two Power Architecture® e200 cores: a 160 MHz e200z4 dual-issue CPU with 8 KB instruction cache and 4 KB data cache, and an 80 MHz e200z2 single-issue CPU. Both support Variable Length Encoding (VLE) for compact code footprint and include Nexus Class 3+ debug interfaces. The SPC5746BSK1AMMH6 uses these cores in a safety-partitioned configuration where the z4 core executes time-critical control loops and the z2 core handles communication stacks and diagnostics.

Does the SPC5746BSK1AMMH6 support CAN FD, and how many controllers are available?

Yes, the SPC5746BSK1AMMH6 includes eight FlexCAN3 modules, all of which support CAN FD protocol with bit rates up to 5 Mbps and payload lengths up to 64 bytes. Each controller features programmable bit timing, hardware message filtering, and dedicated RAM buffers - enabling concurrent high-bandwidth communication across multiple vehicle domains. This capability is fully documented in the SPC5746BSK1AMMH6 datasheet Rev. 6 section 6.4.2 and block diagram Figure 1.

What safety certifications apply to the SPC5746BSK1AMMH6?

The SPC5746BSK1AMMH6 is certified to ISO 26262 ASIL-B for specific functions including CPU lockstep monitoring, memory ECC, SMPU enforcement, and FCCU fault reporting. It includes hardware safety mechanisms such as end-to-end SECDED ECC on all memory transactions, 32-region SMPU with 16-byte granularity, and dual-core interrupt routing isolation. These features are validated per NXP's safety manual and are integral to the SPC5746BSK1AMMH6 silicon design - not dependent on software configuration.

What package type and pin count does the SPC5746BSK1AMMH6 use?

The SPC5746BSK1AMMH6 is packaged in a 256-ball MAPBGA (package code MJ), with dimensions of 17 mm × 17 mm × 1.2 mm and 0.8 mm ball pitch. It features a thermal pad on the underside for improved heat dissipation in automotive under-hood applications. Pin assignments are defined in Section 9.1 "Package pinouts and signal descriptions" of the official SPC5746BSK1AMMH6 datasheet Rev. 6, and include dedicated power domains (VDD_LV, VDD_HV_A/B/C), clock inputs (FXOSC/SXOSC), and high-speed interfaces (JTAG, Ethernet MII/RMII).

How does the SPC5746BSK1AMMH6 handle flash memory programming and reliability?

The SPC5746BSK1AMMH6 contains 3 MB of on-chip flash memory managed by a triple-ported flash memory controller with built-in ECC and RWW (Read-While-Write) capability. Programming is supported via Boot Assist Flash (BAF) over SCI serial link or JTAG, with erase cycles rated for 100,000 cycles and data retention of 20 years at 125°C. Flash integrity is maintained through margin read verification and array integrity checks - all specified in SPC5746BSK1AMMH6 datasheet sections 6.3.1–6.3.6.