NXP Semiconductors SPC5746BSK1MKU2R

Overview

SPC5746BSK1MKU2R from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 3 MB on-chip flash, 384 KB SRAM with end-to-end ECC, and integrated FlexCAN FD (8 channels), Ethernet (10/100 with AVB/1588), and dual-channel FlexRay - deployed in engine control units and chassis domain controllers requiring ASIL-B compliance.

For engineers reviewing the SPC5746BSK1MKU2R datasheet, SPC5746BSK1MKU2R pinout, SPC5746BSK1MKU2R application, or SPC5746BSK1MKU2R equivalent, this page delivers verified technical context, validated pin mapping for the 176-pin LQFP-EP package, functional safety architecture details, and direct alternative part comparisons grounded in NXP's official MPC5746C family documentation.

Technical Context

The SPC5746BSK1MKU2R implements a heterogeneous dual-core Power Architecture® system: the high-performance e200z4 core handles real-time safety-critical tasks (e.g., torque calculation, fault management) with single-precision floating-point support and VLE encoding, while the e200z2 core manages communication stacks and diagnostics. Both cores share a crossbar switch and SMPU with 32 region descriptors.

Its memory subsystem includes 3 MB flash with triple-port controller and 384 KB SRAM distributed across three ports, all protected by SECDED ECC. Clocking integrates FMPLL, multiple oscillators (FXOSC 8–40 MHz, SXOSC 32 kHz, FIRC 16 MHz), and RTC, enabling precise timing for CAN FD, FlexRay, and Ethernet AVB synchronization.

Key Specifications

Pinout & Package

SPC5746BSK1MKU2R is housed in a 176-pin LQFP-EP (Exposed Pad) package, measuring 24 mm × 24 mm × 1.6 mm, with 0.5 mm pitch and thermal pad for enhanced power dissipation in automotive under-hood environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with SPC5746BSK1MKU2R, MPC5746C SK1MJ6R offers superior thermal and routing flexibility in BGA form factor, while SPC574SCK1MKU2R reduces complexity and cost by removing the secondary core - both retain identical peripheral IP blocks and safety certification scope.

Availability

SPC5746BSK1MKU2R is available at Aetrix Electronics and suitable for engine control units, chassis domain controllers, vehicle gateways, and ADAS sensor hubs requiring stable component supply across extended automotive lifecycles.

Supply support for SPC5746BSK1MKU2R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.

The SPC5746BSK1MKU2R belongs to NXP's SPC574x family of 32-bit Power Architecture® microcontrollers, designed specifically for ASIL-B automotive powertrain and chassis control applications demanding high computational throughput, robust communication, and certified safety mechanisms.

FAQ

What is the core architecture of the SPC5746BSK1MKU2R?

The SPC5746BSK1MKU2R features a dual-core Power Architecture® configuration: a 160 MHz e200z4 CPU with single-precision floating-point unit and variable-length encoding, plus an 80 MHz e200z2 CPU. Both cores operate independently with shared memory resources and are supported by Nexus Class 3+ debug interfaces per IEEE-ISTO 5001-2008. This architecture enables concurrent execution of safety-critical control and communication stack tasks within the SPC5746BSK1MKU2R.

Does the SPC5746BSK1MKU2R support CAN FD, and how many channels are available?

Yes, the SPC5746BSK1MKU2R supports CAN FD across all eight FlexCAN modules (FlexCAN0–FlexCAN7), compliant with ISO 11898-1:2015. Each channel supports data rates up to 5 Mbps and payloads up to 64 bytes. The SPC5746BSK1MKU2R implements dedicated TX/RX pins per channel and integrates bus-off recovery, loopback self-test, and message RAM with hardware acceptance filtering - essential for high-integrity vehicle networking.

What safety certifications apply to the SPC5746BSK1MKU2R?

The SPC5746BSK1MKU2R is designed to meet ISO 26262 ASIL-B requirements at the system level. It includes hardware safety mechanisms such as Fault Collection and Control Unit (FCCU), Hardware Security Module v2 (HSMv2), System Memory Protection Unit (SMPU) with 32 regions, and end-to-end SECDED ECC on all memory and bus transactions. These features are documented in NXP's MPC5746C datasheet Rev. 6 and enable certified safety element development for automotive powertrain and chassis applications using the SPC5746BSK1MKU2R.

What package type and pin count does the SPC5746BSK1MKU2R use?

The SPC5746BSK1MKU2R uses a 176-pin LQFP-EP (Leadless Quad Flat Package with Exposed Pad) package, designated by the "KU" suffix in its part number. Its dimensions are 24 mm × 24 mm × 1.6 mm with 0.5 mm pitch. The exposed thermal pad enhances heat dissipation in automotive under-hood environments, and the pinout supports full access to all I/O domains including FlexCAN FD, LINFlexD, Ethernet MII/RMII, and analog inputs - as confirmed in the MPC5746C datasheet Section 9.

How much on-chip memory does the SPC5746BSK1MKU2R provide?

The SPC5746BSK1MKU2R integrates 3 MB of on-chip flash memory with ECC protection and triple-port flash controller, plus 384 KB of on-chip SRAM distributed across three independent ports - also with ECC. Flash supports Read-While-Write (RWW) operation via three page buffers, enabling safe over-the-air updates. SRAM allocation includes dedicated regions for core instruction/data, DMA buffers, and safety-critical variables - all accessible with deterministic latency inside the SPC5746BSK1MKU2R.