NXP Semiconductors SPC5746CHK0AMMJ6

Overview

SPC5746CHK0AMMJ6 from NXP Semiconductors is a dual-core automotive microcontroller featuring a 160 MHz e200z4 CPU and an 80 MHz e200z2 CPU, 3 MB on-chip flash, 384 KB SRAM with ECC, and integrated FlexCAN FD (8 channels), Ethernet AVB/1588, Dual FlexRay, and HSMv2 security module. It targets ASIL-B compliant powertrain and chassis control systems requiring deterministic real-time execution and functional safety.

For engineers reviewing the SPC5746CHK0AMMJ6 datasheet, SPC5746CHK0AMMJ6 pinout, SPC5746CHK0AMMJ6 application, or SPC5746CHK0AMMJ6 equivalent, key selection criteria include dual-core timing isolation, end-to-end ECC coverage across memory and bus transactions, 8 FlexCAN FD interfaces with configurable message RAM, hardware security boot validation via HSMv2, and support for 256-pin MAPBGA packaging with 178 GPIOs.

Technical Context

The SPC5746CHK0AMMJ6 implements a crossbar switch architecture enabling concurrent access to flash, SRAM, and peripherals by multiple bus masters-including both e200z4 and e200z2 cores, eDMA, and debug units-while maintaining deterministic latency. Its System Memory Protection Unit (SMPU) provides 32 region descriptors with 16-byte granularity for fine-grained memory access control across safety-critical partitions.

Timing integrity is enforced through three independent clock domains: FXOSC (8–40 MHz), SXOSC (32 kHz), and FIRC (16 MHz), all feeding into a frequency-modulated PLL (FMPLL) with Clock Monitor Unit (CMU) supervision. The Real Time Counter (RTC) and two System Timer Modules (STM) deliver precise timekeeping and event scheduling for safety-critical diagnostics and watchdog supervision.

Key Specifications

Pinout & Package

SPC5746CHK0AMMJ6 is housed in a 256-ball MAPBGA package (JEDEC MO-277AA, 17 mm × 17 mm, 0.8 mm pitch) with 178 configurable I/O pins, including dedicated high-speed differential pairs for FlexRay and Ethernet, and voltage-isolated domains for CAN, LIN, and ADC.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with MPC5748G and SPC5777M, the SPC5746CHK0AMMJ6 delivers optimal balance of ASIL-B compliance, 3 MB flash, 8 FlexCAN FD channels, and 256 BGA packaging-making it ideal for cost-sensitive, high-volume powertrain and chassis ECUs where pin compatibility and proven qualification outweigh expansion needs.

Availability

SPC5746CHK0AMMJ6 is available at Aetrix Electronics and suitable for automotive powertrain control, chassis electronics, and electric vehicle inverter applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 0 qualification.

Supply support for SPC5746CHK0AMMJ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Power Architecture® and functional safety microcontrollers.

The SPC5746CHK0AMMJ6 belongs to NXP's SPC57 family of automotive MCUs designed specifically for ASIL-B compliant powertrain, transmission, and chassis control systems-emphasizing real-time determinism, hardware security, and robustness in harsh environments.

FAQ

What is the core architecture of the SPC5746CHK0AMMJ6?

The SPC5746CHK0AMMJ6 integrates two Power Architecture® e200 cores: a 160 MHz e200z4 dual-issue CPU with 8 KB instruction cache and 4 KB data cache, and an 80 MHz e200z2 single-issue CPU. Both support Variable Length Encoding (VLE) for reduced code size and include Nexus Class 3+ debug interfaces. The SPC5746CHK0AMMJ6 uses these cores in asymmetric multiprocessing mode for safety-critical task partitioning.

Does the SPC5746CHK0AMMJ6 support CAN FD?

Yes, the SPC5746CHK0AMMJ6 includes eight FlexCAN3 modules, all of which support CAN FD protocol with bit rates up to 5 Mbps and payload sizes up to 64 bytes. Each FlexCAN module features configurable message RAM, hardware filtering, and error counters. The SPC5746CHK0AMMJ6 implements CAN FD in hardware without software overhead, enabling high-throughput communication in modern automotive networks.

What safety certifications apply to the SPC5746CHK0AMMJ6?

The SPC5746CHK0AMMJ6 is designed to support ISO 26262 ASIL-B compliance across key subsystems including memory (ECC), clocks (CMU), timers (STM/PIT), and fault collection (FCCU). It includes hardware features such as SMPU, lockstep-capable cores, and HSMv2 to enable certified safety mechanisms. The SPC5746CHK0AMMJ6 itself is AEC-Q100 Grade 0 qualified (-40°C to +125°C) and supports functional safety development per ISO 26262 Part 5 and Part 6.

How is flash memory protected on the SPC5746CHK0AMMJ6?

Flash memory on the SPC5746CHK0AMMJ6 is protected by end-to-end SECDED ECC covering all read/write transactions, plus hardware write-protection registers (MC_ME, MC_RGM), Boot Assist Flash (BAF) for secure serial programming, and HSMv2-managed secure boot verification. The 3 MB flash is divided into ten 256 KB blocks with Read-While-Write (RWW) capability, allowing background updates without interrupting execution. The SPC5746CHK0AMMJ6 also supports emulated EEPROM partitions within flash for wear-leveling.

What package and thermal specifications does the SPC5746CHK0AMMJ6 have?

The SPC5746CHK0AMMJ6 is packaged in a 256-ball MAPBGA (MJ code) with 17 mm × 17 mm body size and 0.8 mm ball pitch. It operates over -40°C to +125°C ambient temperature (AEC-Q100 Grade 0), with maximum junction temperature of 150°C. Thermal resistance θJA is specified at 22.5°C/W for a 2s2p board. The SPC5746CHK0AMMJ6 requires specific decoupling capacitors per Table 9 of the datasheet, including 1.32–3 µF for FPREG and 0.8–1.4 µF for LP/ULP regulators.